Moisture-resistant electronic device package and methods of assembly
First Claim
1. An electronic device package comprising:
- a substrate having a first surface, an opposing second surface, and a plurality of edge surfaces extending between the first surface and the second surface around a perimeter of the substrate;
at least one contact pad on the first surface of the substrate;
at least one attachment pad on the second surface of the substrate;
at least one conductive element electrically connecting the at least one contact pad and the at least one attachment pad; and
a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure, wherein the cavity faces away from the substrate, and the housing structure extends across a bottom surface of the cavity to cover substantially all of the first surface of the substrate and includes at least one aperture in the bottom surface of the cavity exposing the at least one contact pad through the housing structure.
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Accused Products
Abstract
Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
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Citations
48 Claims
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1. An electronic device package comprising:
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a substrate having a first surface, an opposing second surface, and a plurality of edge surfaces extending between the first surface and the second surface around a perimeter of the substrate;
at least one contact pad on the first surface of the substrate;
at least one attachment pad on the second surface of the substrate;
at least one conductive element electrically connecting the at least one contact pad and the at least one attachment pad; and
a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure, wherein the cavity faces away from the substrate, and the housing structure extends across a bottom surface of the cavity to cover substantially all of the first surface of the substrate and includes at least one aperture in the bottom surface of the cavity exposing the at least one contact pad through the housing structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of forming an electronic device package comprising:
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providing a substrate having a first surface, an opposing second surface, and a plurality of edge surfaces extending between the first surface and the second surface around a perimeter of the substrate;
forming at least one contact pad on the first surface of the substrate;
forming at least one attachment pad on the second surface of the substrate that is electrically connected to the at least one contact pad;
covering substantially all of the first surface of the substrate with at least one layer of material to form a housing structure including a cavity having sidewalls and a bottom surface formed from the at least one layer of material, wherein the cavity faces away from the substrate; and
leaving at least one aperture in the bottom surface of the cavity to expose the at least one contact pad through the layer of material. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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34. The method of 24, further comprising:
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covering substantially all of the second surface of the substrate with the at least one layer of material; and
forming at least another aperture to expose the at least one attachment pad through the layer of material.
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Specification