Plasma processing apparatus

• US 6,953,908 B2
• Filed: 12/17/2003
• Issued: 10/11/2005
• Est. Priority Date: 12/17/2002
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Original Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Inventors: Yasaka, Yasuyoshi, Ishii, Nobuo
• Primary Examiner(s): Walberg, Teresa J.
• Application Number:
  US10/736,844
• Publication Number:
  US 20040149741A1
• Time in Patent Office: 664 Days
• Field of Search: 219/121.43, 219/121.4, 219/121.41, 219/121.42, 118/723.MW, 156/345.36, 156/345.34, 156/345.41, 204/298.37, 204/298.38
• US Class Current: 219/121.43
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H05B 6/72 Radiators or antennas
• CPC Class Codes: H05B 6/806 for laboratory use

Abstract

A plasma processing apparatus, comprising: at least, a plasma processing chamber for processing therein an object to be processed; antenna means for guiding microwaves into the plasma processing chamber; and a dielectric member disposed between the antenna means and the plasma processing chamber; wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projecting shape.

Claims

1. A plasma processing apparatus, comprising:

a plasma processing chamber for processing therein an object to be processed;

antenna means for guiding microwaves into the plasma processing chamber; and

a dielectric member disposed between the antenna means and the plasma processing chamber;

wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projection provided in a circumferential direction of the dielectric member, and

wherein the projection has a corner-shaped or edge shaped portion having a curved surface.

2. A plasma processing apparatus according to claim 1, wherein the antenna means comprises a plane antenna member having plural slots.

3. A plasma processing apparatus according to claim 1, wherein the dielectric member also has a projection provided in a radial direction thereof.

4. A plasma processing apparatus, comprising:

a plasma processing chamber for processing therein an object to be processed;

antenna means for guiding microwaves into the plasma processing chamber; and

a dielectric member disposed between the antenna means and the plasma processing chamber;

wherein a surface of the dielectric member facing an inside of the plasma processing chamber has a projection provided along longitudinal and transverse directions of the dielectric member.

5. A plasma processing apparatus according to claim 4, wherein the antenna means comprises a plane antenna member having plural slots.

6. A plasma processing apparatus according to claim 4, wherein the projection has a corner-shaped or edge-shaped portion having a curved surface.

7. A plasma processing apparatus according to claim 4, wherein the dielectric member has a plurality of projections facing the inside of the plasma processing chamber, the projections are provided so that they constitute a crossing-type arrangement, and a crossing portion of the projections has a curved surface.

8. A plasma processing apparatus according to claim 4, wherein the dielectric member has a plurality of projections facing the inside of the plasma processing chamber, and crossing of the projections is avoided.