Composite electronic component

• US 6,956,166 B2
• Filed: 12/01/2003
• Issued: 10/18/2005
• Est. Priority Date: 10/17/2000
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kishimoto, Yasunori
• Primary Examiner(s): LEE, JINHEE J
• Application Number:
  US10/724,790
• Publication Number:
  US 20040140870A1
• Time in Patent Office: 687 Days
• Field of Search: 174/52.4, 174/11.R, 174/260, 174/262, 174/54, 174/52.2, 174/52.1
• US Class Current: 174/559
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H03H 7/19 Two-port phase shifters providing a predetermined phase shift, e.g. "all-pass" filters
• CPC Class Codes: H03H 9/02913 Measures for shielding against electromagnetic fields shielding of electrical components in general H05K9/00
• CPC Class Codes: H03H 9/0576 including surface acoustic wave [SAW] devices
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/6483 Ladder SAW filters
• CPC Class Codes: H03H 9/72 Networks using surface acoustic waves
• CPC Class Codes: H03H 9/725 Duplexers

Abstract

A composite electronic component that prevents the electrical connection between a conductive case member of the composite electronic component, which performs physical shielding against a physical impact or dust adhesion and also performs an electromagnetic shielding function, and a conductive member for performing the electromagnetic shielding function for a surface acoustic wave element built therein. A composite electronic component includes surface acoustic wave devices therein, a first case member, and a second metallic case member. In order to prevent the electrical connection between the internal surface of the metallic case connected to a ground potential and a conductor disposed in a package of the surface acoustic wave devices and connected to the ground potential to perform the electromagnetic shielding function, an insulating material layer is provided on at least one of the top surface of the conductor and the bottom surface of a top plate of the metallic case.

Claims

1. A composite electronic component comprising:

a first case member;

a surface acoustic wave device mounted on the first case member and which includes a package a surface acoustic wave element accommodated within the package, and a ground terminal, the package having a conductor in at least one portion thereof; and

a conductive second case member to be connected to a ground potential and fixed to the first case member, the conductive second case member having an opening in one portion opposing the conductor of the package;

wherein the conductive second case member is metallic; and

the openinq has a planar square shape positioned to oppose the top of the package so as to prevent electrical connection between the conductive second case member and the top of the package.

2. A component according to claim 1, wherein the first case member is a planar case circuit board and the second case member includes a top plate and an annular side-wall extending downwardly from the periphery of the top plate so as to surround the surface acoustic wave device mounted on the planar first case member.

3. A component according to claim 1, wherein the second case member is made of an insulator and a conductive film disposed on the external surface of the insulator.

4. A component according to claim 1, wherein the package includes first and second package members, the surface acoustic wave element being mounted on the first package member, the second package member having the conductor.

5. A component according to claim 4, wherein the first package member includes a bottom plate and an annular side-wall extending upwardly from the periphery of the bottom plate so as to have an opening opened upwardly and the second package member is a planar lid which is fixed so as to close the opening of the first package.

6. A component according to claim 4, wherein the first package member is a planar package circuit board and the second package member includes a top plate and an annular side-wall extending downwardly from the periphery of the top plate so as to surround the surface acoustic wave element mounted on the planar package circuit board.

7. A component according to claim 6, wherein the second package member includes a metallic cap.

8. A component according to claim 1, wherein a plurality of the surface acoustic wave devices are mounted on the first case member.

9. A component according to claim 1, wherein the surface acoustic wave device include a plurality of surface acoustic wave elements.

10. A component according to claim 9, wherein each of the plurality of surface acoustic wave elements has a ladder-type circuit structure including a series arm resonator and a parallel arm resonator.

11. A component according to claim 1, wherein the composite electronic component is a duplexer.

12. A communication device comprising a composite electronic component according to claim 1.