Semiconductor device with an L-shaped/reversed L-shaped gate side-wall insulating film
First Claim
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1. A semiconductor device, comprising:
- a gate electrode formed on a surface region of a semiconductor substrate;
a source region and drain region which are formed in the surface region of the semiconductor substrate on both sides of the gate electrode;
a gate side-wall insulating film having a first portion covering a side-wall of the gate electrode and a second portion covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode; and
a silicon-containing-layer containing silicon formed on each of the source region and the drain region, the silicon-containing-layer covering the second portion of the gate side-wall insulating film.
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Abstract
Provided is a semiconductor device, comprising a gate electrode formed on a semiconductor substrate, source/drain diffusion layers formed on both sides of the gate electrode, a gate electrode side-wall on the side of the source/drain diffusion layer and a gate side-wall insulating film covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode and having an L-shaped/reversed L-shaped cross-sectional shape, and a semiconductor layer extending over the gate side-wall insulating film covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode.
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Citations
25 Claims
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1. A semiconductor device, comprising:
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a gate electrode formed on a surface region of a semiconductor substrate;
a source region and drain region which are formed in the surface region of the semiconductor substrate on both sides of the gate electrode;
a gate side-wall insulating film having a first portion covering a side-wall of the gate electrode and a second portion covering a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode; and
a silicon-containing-layer containing silicon formed on each of the source region and the drain region, the silicon-containing-layer covering the second portion of the gate side-wall insulating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor device comprising:
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a gate electrode formed on an upper surface of a semiconductor substrate;
a source region and drain region which are formed on both sides of the gate electrode;
a gate side-wall insulating film covering a side wall of the gate electrode and a part of the upper surface of the semiconductor substrate in the vicinity of the gate electrode;
a silicon-containing-layer formed on each of the source region and the drain region, the silicon-containing layer covering a portion of the gate side-wall insulating film; and
a buried device isolation region comprising a trench contiguous to the outer peripheral edge portion of each of the source region and the drain region and having an insulating film buried therein, wherein the buried device isolation region includes;
a trench formed in an upper surface region of a semiconductor substrate;
a first buried insulating film formed to extend along the inner wall of the trench in a manner to be buried in a lower portion of the trench to reach a predetermined depth from the open surface of the trench; and
a second buried insulating film formed to cover said first buried insulating film in an upper portion of the trench. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification