Flip-chip image sensor packages
First Claim
1. An electronic device package comprising:
- a transparent substrate;
a plurality of conductive traces positioned on a surface of the transparent substrate, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point;
a plurality of optically interactive electronic devices, each optically interactive electronic device having at least one bond pad and mounted to the transparent substrate by a bond between the first attachment point of an associated conductive trace of the plurality of conductive traces and the at least one bond pad;
a plurality of backing caps, each backing cap covering a back surface of each optically interactive electronic device and having at least one backing cap attachment point on a surface thereof in electrical communication with the second attachment point of the associated conductive trace and at least one attachment pad on a another surface of the backing cap in electrical communication with the at least one backing cap attachment point.
1 Assignment
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Accused Products
Abstract
The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.
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Citations
15 Claims
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1. An electronic device package comprising:
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a transparent substrate;
a plurality of conductive traces positioned on a surface of the transparent substrate, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point;
a plurality of optically interactive electronic devices, each optically interactive electronic device having at least one bond pad and mounted to the transparent substrate by a bond between the first attachment point of an associated conductive trace of the plurality of conductive traces and the at least one bond pad;
a plurality of backing caps, each backing cap covering a back surface of each optically interactive electronic device and having at least one backing cap attachment point on a surface thereof in electrical communication with the second attachment point of the associated conductive trace and at least one attachment pad on a another surface of the backing cap in electrical communication with the at least one backing cap attachment point. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic device package comprising:
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a transparent substrate;
at least one secondary substrate secured by a first surface thereof to a surface of the transparent substrate having a central aperture covered by the transparent substrate and a plurality of conductive traces positioned on the at least one secondary substrate around the central aperture, each conductive trace of the plurality of conductive traces having a first attachment point and a second attachment point on a second surface of the at least one secondary substrate;
an optically interactive electronic device having at least one bond pad, the optically interactive electronic device mounted to the at least one secondary substrate by a bond between the first attachment point of a conductive trace of the plurality of conductive traces and the at least one bond pad; and
a backing cap covering a back surface of the optically interactive electronic device, the backing cap having at least one backing cap attachment point on a surface thereof in electrical communication with the second attachment point of the conductive trace and at least one attachment pad on another surface of the backing cap in electrical communication with the at least one backing cap attachment point. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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Specification