Quadrature hybrid low loss directional coupler

• US 6,956,449 B2
• Filed: 01/27/2003
• Issued: 10/18/2005
• Est. Priority Date: 01/27/2003
• Status: Expired due to Fees

• Current Assignee: Andrew LLC (CommScope Holding Company, Inc.)
• Original Assignee: Andrew Corporation (CommScope Holding Company, Inc.)
• Inventors: Hilbert, Mark A., Snyder, Robert F.
• Primary Examiner(s): TAKAOKA, DEAN O
• Application Number:
  US10/351,931
• Publication Number:
  US 20040145427A1
• Time in Patent Office: 995 Days
• Field of Search: 333/26, 333/27, 333/109, 333/111, 333/112, 333/113, 333/114, 333/115, 333/116, 333/117, 333/118, 333/119, 333/185, 333/238, 333/243
• US Class Current: 333/116
• CPC Class Codes: H01P 5/187 Broadside coupled lines
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence

Abstract

A coupling device defined by an RF circuit board having a cavity formed therein and a plurality of conductive traces and a ground plane, a coupler board having opposites sides and conductive traces, and first and, second metal shields. When assembled, the coupler board is supported by the RF circuit board, and cavities are formed on opposite sides of the coupler board by the first and second metal shields.

Claims

1. A coupling device comprising:

a circuit board having first and second surfaces and an opening formed therebetween, and having a plurality of conductive traces;

a coupler board having opposites surfaces and conductive traces;

the coupler board being mounted with the circuit board at the opening;

first and second shields positioned proximate opposite surfaces of the coupler board and circuit board and forming cavities on opposite sides of the coupler board.

2. The coupling device of claim 1, wherein the said cavities formed are aircavities.

3. The coupling device of claim 1, further comprising ground planes, the conductive traces being formed on the first surface and a ground plane being formed on the first and the second surfaces.

4. The coupling device of claim 1, wherein the conductive traces on the coupler board are formed on the opposite surfaces.

5. The coupling device of claim 1, wherein the first and the second shieldsare stamped from sheet metal.

6. The coupling device of claim 1, wherein the coupling device forms at least one of a coupler, a combiner, and a splitter.

7. The coupling device of claim 1, wherein said coupler board is configured to cover the circuit board opening to form a cavity on one side of the coupler board.

8. The coupling device of claim 1, wherein at least one of said shields is raised to form a cavity proximate a side of the coupler board.

9. A coupling device to couple signals between various ports comprising:

a circuit board having opposite surfaces;

an opening formed in the circuit board between the opposite surfaces, the opening being free of obstruction to form an air opening;

a coupler board positioned with the circuit board to cover a portion of the air opening to create an air cavity proximate the coupler board;

the coupler board including opposing coupling traces that form an input port, an output port, and coupled port, the traces spanning across the air cavity to coincide with the air cavity.

10. The coupling device of claim 9, wherein the coupler board covers the entire opening on a side of the circuit board.

11. The coupling device of claim 9, wherein the coupling traces are formed on opposite sides thereof.

12. The coupling device of claim 11, wherein the circuit board includes conductive traces formed on at least one surface, the circuit board conductive traces coupling with a coupling trace on a surface of the coupler board when the coupler board is positioned with the circuit board.

13. The coupling device of claim 11, wherein the coupling traces have overlapping portions.

14. The coupling device of claim 9, further comprising a shield positioned on a surface of the circuit board opposite the coupler board.

15. The coupling device of claim 9, further comprising a shield positioned over the coupler board to form an additional air cavity on a side of the coupler board.

16. The coupling device of claim 11, wherein at least one of the coupling traces includes at least one of an angled portion and an overlapped portion.

17. The coupling device of claim 9, wherein the coupling traces form an input port, an output port, a coupling port and an isolation port.

18. The coupling device of claim 12, wherein said coupler board coupling traces are positioned thereon to couple with the conductive traces proximate the opening of the circuit board.

19. A method of integrating a coupling device into a circuit board having first and second surfaces, the method comprising:

forming a plurality of conductive traces on a surface of the circuit board;

forming an opening intermediate the first and second surfaces;

positioning a coupler board with opposing coupling traces adjacent one of the surfaces of the circuit board to cover the opening and form an air cavity, the coupling traces coinciding with the opening and air cavity and forming an input port, output port, and coupled port;

connecting the conductive traces with the coupling traces;

positioning a shield on another surface of the circuit board opposite the coupler board to cover the air cavity.

20. The method of claim 19, further comprising positioning the coupler board to cover the opening.

21. The method of claim 19, further comprising positioning a shield over the coupler board.

22. The method of claim 21, wherein the shield is configured to form another air cavity with the coupler board.

23. A signal combining device comprising:

a coupler board with coupling traces formed on opposite surfaces thereof to form at least an input port, a direct port and a coupled port;

shields positioned proximate the opposite surfaces of the coupler board;

the shields configured to form air cavities with the coupler board at opposite surfaces of the board to surround the coupling traces with air.

24. The signal combining device of claim 23, further comprising:

a circuit board positioned intermediate one of the surfaces and a respective shield.

25. The signal combining device of claim 24, wherein the circuit board includes conductive traces thereon positioned to connect with coupling traces on the coupler board.

26. A signal splitting device comprising:

a coupler board with coupling traces formed on opposite surfaces thereof;

shields positioned proximate the opposite surfaces;

the shields configured to form cavities with the coupler board at opposite surfaces of the board.

27. The signal splitting device of claim 26, further comprising:

a circuit board positioned intermediate one of the surfaces and a respective shield.

28. The signal splitting device of claim 26, wherein the circuit board includes conductive traces thereon positioned to connect with coupling traces on the coupler board.

29. A circuit board having first and second surfaces, and comprising:

a ground plane formed on the first and the second surfaces;

an opening formed intermediate the first and the second surfaces; and

,

a plurality of conductive traces etched from the ground plane on the first surface, and leading up to the opening;

the conductive traces configured to couple with ports of a hybrid coupler and the opening forming a cavity for the coupler.

30. A process of assembling a coupling device comprising:

providing a circuit board having an opening and land areas;

placing a coupler board having connective elements on the circuit board over the opening, and aligning the connective elements with the land areas;

placing a first shield over the coupler board;

soldering the first shield and coupler board to the circuit board;

placing a second shield against a surface of the circuit board opposite the coupler board; and

,

soldering the second shield to be held on the circuit board.

31. The process of claim 30, the circuit board having holes proximate the opening, the first metal shield having respective tabs, and the second metal shield having respective holes, further comprising passing the tabs of the first metal shield through the holes in the circuit board and through the holes in the second metal shield to align the shields over the opening.

32. The process of claim 31, wherein the coupler board has notches, further comprising passing the tabs through the notches to align the coupler board with the opening.