Method of forming resist pattern, and exposure device

• US 6,956,641 B2
• Filed: 12/12/2002
• Issued: 10/18/2005
• Est. Priority Date: 03/27/2000
• Status: Expired due to Fees

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Furukawa, Takamitsu
• Primary Examiner(s): FULLER, RODNEY EVAN
• Application Number:
  US10/317,156
• Publication Number:
  US 20030117608A1
• Time in Patent Office: 1,041 Days
• Field of Search: 355/52, 355/53, 355/67, 355/71, 430/311, 430/322, 430/328, 430/330, 430/394
• US Class Current: 355/71
• CPC Class Codes: G03F 7/2024 of the already developed image
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking

Abstract

A device for exposure of an object surface having a predetermined shrinkage rate during a baking process of the object. The device includes an optical system having a light source irradiating light towards a target location. A filter is provided between the target location and the light source. The filter has a transmission rate that is adjustable to at least three different levels and which passes light from the light source therethrough.

Claims

1. A device for exposure of an object surface having a predetermined shrinkage rate during bake processing of the object following exposure, the device comprising:

(a) an optical system having a light source which when operated irradiates light of a substantially uniform intensity towards a target location, which location is placement of the object surface comprising a plurality of exposure unit regions thereat for exposure,

(b) a filter provided between the target location and the light source, the filter being divided into a plurality of unit areas each of which being smaller than the exposure unit regions and having a transmission rate per unit area adjustable to at least three different levels, the filter being passed light having an exposure amount corresponding to a predetermined shrinkage rate in the object surface based on bake processed following exposure of light irradiated from the light source therethrough.

2. The device of claim 1, wherein the transmission rate of the filter is corrected for each predetermined region of the object surface for reducing a distribution of errors in the shrinkage rate, which distribution corresponds to a temperature distribution arising in the object during the bake process.

3. The device of claim 1, wherein the transmission rate of the filter is corrected for each predetermined region of the object to be processed for reducing a distribution of errors in the shrinkage rate for forming a final pattern on the object surface.

4. The device of claim 1, wherein a total area of the unit areas is larger than a total area of the exposure unit regions.