Light emitting diodes with current spreading layer

• US 6,958,494 B2
• Filed: 08/14/2003
• Issued: 10/25/2005
• Est. Priority Date: 08/14/2003
• Status: Active Grant

• Current Assignee: DiCon Fiber Optics Incorporated
• Original Assignee: DiCon Fiber Optics Incorporated
• Inventors: Du, Qinghong, Lee, Ho-Shang, Lin, Hui-Li
• Primary Examiner(s): Wilson, Allan R.
• Application Number:
  US10/641,641
• Publication Number:
  US 20050035354A1
• Time in Patent Office: 803 Days
• Field of Search: 257/86, 257/94, 257/103
• US Class Current: 257/86
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

A light-emitting diode (LED) for both AlGaInP- and GaN-based materials needs a good transparent current spreading layer to disseminate electrons or holes from the electrode to the active layer. The present invention utilizes a conductive and transparent ITO (Indium Tin Oxide) thin film with an ultra-thin (to minimize the absorption) composite metallic layer to serve as a good ohmic contact and current spreading layer. The present invention avoids the Schottky contact due to direct deposition of ITO on the semiconductor. For AlGaInP materials, a thick GaP current spreading layer is omitted by the present invention. For GaN-based LEDs with the present invention, semi-transparent Ni/Au contact layer is avoided. Therefore, the light extraction of LED can be dramatically improved by the present invention. Holes may be etched into the semiconductor cladding layer forming a Photonic Band Gap structure to improve LED light extraction.

Claims

1. A light emitting diode comprising:

an active light emission layer embedded in a waveguide layer;

a Photonic Band Gap structure adjacent to the active layer;

a semiconductor layer over the active layer, said semiconductor layer passing light emitted by the active layer as light output from the diode;

a current spreading composite layer on said semiconductor layer, said composite layer comprising a first metallic layer in contact with said semiconductor layer, and a second current spreading layer comprising ITO in contact with said first metallic layer, said first and second layers substantially transparent to light emitted by the active layer; and

a cladding layer adjacent to the waveguide layer, said structure comprising an array of holes at least in the cladding layer.

2. The light emitting diode according to claim 1, wherein said first metallic layer comprises at least one metal selected from the following:

titanium, gold, zinc, indium, nickel, and beryllium.

3. The light emitting diode according to claim 1, wherein said first metallic layer comprises a composite layer.

4. The light emitting diode according to claim 1, wherein one of the layers in said composite layer in said first metallic layer comprises titanium.

5. The light emitting diode according to claim 1, wherein said first metallic layer comprises Ti/Au, Ti/Au—

Zn, Ti/Au—

Be, Ni/Au, Au—

Zn, In—

Be, or Ti/In—

Be.

6. The light emitting diode according to claim 1, wherein said first metallic layer has a thickness within a range of about 0.4˜

8 nm.

7. The light emitting diode according to claim 1, said first metallic layer assisting to forming an ohmic contact with said semiconductor layer.

8. The light emitting diode according to claim 1, wherein said second current spreading layer has a thickness within a range of about 40 to 1,000 nm.

9. The light emitting diode according to claim 1, said diode comprising AlGaInP-. AlGaAs-, AlGaN-, InGaN-, or GaN-based materials.

10. The light emitting diode according to claim 1, wherein said semiconductor layer comprises a p-type material.

11. The light emitting diode according to claim 1, said structure comprising a portion of said current spreading composite layer.

12. The light emitting diode according to claim 1, wherein a diameter of holes in said array ranges from 80 to 300 nm.

13. The light emitting diode according to claim 1, wherein a lattice constant of said structure ranges from about 100 to 400 nm.

14. The light emitting diode according to claim 1, wherein a lattice pattern of said structure lattice is triangular, rectangular or hexagonal.

15. The light emitting diode according to claim 1, said structure comprising a portion of said current spreading composite layer and the semiconductor layer.

16. A light emitting diode comprising:

an active light emission layer;

a Photonic Band Gap structure adjacent to the active layer;

a semiconductor layer over the active layer on said semiconductor layer passing light emitted by the active layer as light output from the diode;

a current spreading composite layer on said semiconductor layer, said composite layer comprising a first metallic layer in contact with said semiconductor layer, and a second current spreading layer comprising ITO in contact with said first metallic layer, said first and second layers substantially transparent to light emitted by the active layer, said structure comprising an array of holes in the current spreading composite layer and the semiconductor layer.

17. The light emitting diode according to claim 16, said active layer being embedded in a waveguide layer.

18. The light emitting diode according to claim 17, said active layer comprising multiple quantum wells or double heterostructure in the waveguide layer.

19. A light emitting diode comprising:

an active light emission layer;

a Photonic Band Gap structure adjacent to the active layer;

a semiconductor layer over the active layer, said semiconductor layer passing light emitted by the active layer as light output from the diode;

a current spreading composite layer on said semiconductor layer, said composite layer comprising a first metallic layer in contact with said semiconductor layer, and a second current spreading layer in contact with said first metallic layer, said first and second layers substantially transparent to light emitted by the active layer, wherein said first metallic layer has a total thickness not more than about 8 nm; and

a cladding layer adjacent to the active layer, said structure comprising an array of holes at least in the cladding layer.

20. The light emitting diode according to claim 19, wherein said first metallic layer comprises at least one metal selected from the following:

titanium, gold, zinc, indium, Nickel, and beryllium.

21. The light emitting diode according to claim 19, wherein said first metallic layer comprises a composite layer.

22. The light emitting diode according to claim 19, wherein one of the layers in said composite layer in said first metallic layer comprises titanium.

23. The light emitting diode according to claim 19, wherein said first metallic layer comprises Ti/Au, Ti/Au—

Zn, Ti/Au—

Be, Ni/Au, Au—

Zn, In—

Be, or Ti/In—

Be.

24. The light emitting diode according to claim 19, wherein the second layer comprises ITO.

25. The light emitting diode according to claim 19, said first metallic layer assisting to forming an ohmic contact with said semiconductor layer.

26. The light emitting diode according to claim 19, wherein said second current spreading layer has a thickness within a range of about 40 to 1,000 nm.

27. The light emitting diode according to claim 19, said diode comprising AlGaInP-. AlGaAs-, AlGaN-, InGaN-, or GaN-based materials.

28. The light emitting diode according to claim 19, wherein said semiconductor layer comprises a p-type material.

29. The light emitting diode according to claim 19, said structure comprising a portion of said current spreading composite layer.

30. The light emitting diode according to claim 19, wherein a diameter of holes in said array ranges from 80 to 300 nm.

31. The light emitting diode according to claim 19, wherein a lattice constant of said structure ranges from about 100 to 400 nm.

32. The light emitting diode according to claim 19, wherein a lattice pattern of said structure lattice is triangular, rectangular or hexagonal.

33. The light emitting diode according to claim 19, said structure comprising a portion of said current spreading composite layer and the semiconductor layer.

34. A light emitting diode comprising:

an active light emission layer;

a Photonic Band Gap structure adjacent to the active layer;

a semiconductor layer over the active layer, said semiconductor layer passing light emitted by the active layer as light output from the diode; and

a current spreading composite layer on said semiconductor layer, said composite layer comprising a first metallic layer in contact with said semiconductor layer, and a second current spreading layer in contact with said first metallic layer, said first and second layers substantially transparent to light emitted by the active layer, wherein said first metallic layer has a total thickness not more than about 8 nm, said structure comprising an array of holes in the current spreading composite layer and the semiconductor layer.

35. The light emitting diode according to claim 34, said active layer embedded in a waveguide layer.

36. The light emitting diode according to claim 35, said active layer comprising multiple quantum wells or double heterostructure in the waveguide layer.