Display device and method of producing same

• US 6,961,111 B1
• Filed: 08/31/2000
• Issued: 11/01/2005
• Est. Priority Date: 09/08/1999
• Status: Expired due to Term

• Current Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kuramasu, Keizaburo
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Erdem, Fazli
• Application Number:
  US09/831,315
• Time in Patent Office: 1,888 Days
• Field of Search: 349/150, 349/151, 349/152, 349/157, 349/43, 349/149, 349/154, 349/189, 349/190, 349/153, 349/58, 349/65, 349/138, 349/42, 257/207, 257/204, 257/205, 257/72, 345/206
• US Class Current: 349/152
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence

Abstract

A driver circuit-integrated type active matrix substrate 212 has, on a glass substrate 210, a liquid crystal display unit 221 including a matrix array composed of thin film transistors, and driver circuits 224–226 for driving the liquid crystal display unit. A peripheral portion of the glass substrate 210 has recessed grooves 260–263 formed therein, and power supply lines 251–254 for supplying power to the driver circuits 225 and 226 are buried in the recessed grooves. Such a configuration reduces the resistance of bus wiring lines such as the power supply lines for the driver circuits and data lines, without increasing an area of the peripheral portion. The driver circuit-integrated type active matrix substrate reduces an amount of voltage drop in power supply voltage, ensuring reliable operation of the driver circuits.

Claims

1. A display device comprising:

an active matrix substrate having a peripheral portion and a driver circuit section comprising a plurality of circuit elements and a plurality of polycrystalline silicon thin film transistors;

a counter substrate;

a liquid crystal material filled between the active matrix substrate and the counter substrate; and

an individually-wired line array for supplying a clock signal, a data signal or electric power to the plurality of circuit elements in the driver circuit section, wherein the individually-wired line array is extended to the peripheral portion of the active matrix substrate, wherein;

the peripheral portion of the active matrix substrate comprises a multi-layer bus line-equipped section having a bus line located on the insulator, the bus line is connected to the individually-wired line array via the via hole, and the bus line comprises a connecting terminal for connecting the display device to an external circuit; and

the insulator is a pre-formed resin substrate having a bus line located on a surface thereof and a via hole in the substrate.

2. The display device according to claim 1, wherein the resin substrate comprising an aramid-epoxy resin.

3. The display device according to claim 1, wherein the via hole is filled with electrically conductive paste.

4. The display device according to claim 1, wherein the resin substrate is a multi-layer structure comprising a plurality of layers in which said bus line is located on a surface of an inner layer thereof as well as on a surface of the outermost layer thereof, and the bus lines are selectively connected to each other via a via hole in each of the layers to form a three-dimensional wiring structure.

5. The display device according to claim 3, wherein the electrically conductive paste partially protrudes from a lower opening of the via hole, and the active matrix substrate and the resin substrate are bonded together with the protruding portion of the electrically conductive paste.

6. The display device according to claim 4, wherein an electrically conductive paste fills the via hole;

the electrically conductive paste protrudes from a lower opening of the via hole; and

the electrically conductive paste partially protrudes from the opening of the via hole, and the active matrix substrate and the resin substrate are bonded together with the protruding portion of the electrically conductive paste.

7. The display device according to claim 1, wherein the resin substrate and the active matrix substrate are bonded with an adhesive comprising a material having a thermoplastic property.

8. The display device according to claim 1, wherein the resin substrate and the active matrix substrate are bonded with an adhesive comprising an anisotropic conductive resin or a silver paste.

9. The display device according to claim 1, wherein the resin substrate is a film substrate, and is detachably bonded to the active matrix substrate.

10. The display device according to claim 9, wherein the film substrate is made of a resin comprising polyimide or epoxy.

11. The display device according to claim 1, further comprising a semiconductor chip of an external circuit, said semiconductor chip being mounted on the resin substrate and is connected to the bus line.

12. The display device according to claim 11, wherein the semiconductor chip is buried in the via hole.

13. The display device according to claim 1, wherein the bus line in the multi-layer bus line-equipped section is a thick film.

14. The display device according to claim 13, wherein the insulator in the multi-layer bus line-equipped section is a thick film.

24. The display device according to claim 1, wherein, in place of the liquid crystal, a rare gas is located between the substrates, the rare gas for forming a plasma discharge to perform a display operation.

15. A display device comprising:

an active matrix substrate having a peripheral portion and a driver circuit section comprising a plurality of circuit elements and a plurality of polycrystalline silicon thin film transistors;

a counter substrate;

a liquid crystal material filled between the active matrix substrate and the counter substrate; and

an individually-wired line array for supplying a clock signal, a data signal or electric power to the plurality of circuit elements in the driver circuit section, wherein the individually-wired line array is extended to the peripheral portion of the active matrix substrate, wherein;

the active matrix substrate has a recessed groove located in the peripheral portion;

a bus line connected to the individually-wired line array is buried in the groove, the bus line is a layered structure comprising a copper foil layer, a copper plating layer, and a gold-nickel plating layer.

18. The display device according to claim 15, wherein the bus line is a pre-formed metal fine wire.

22. The display device according to claim 15, wherein the bus line is formed by depositing in which a thin, electrically conductive layer is formed in advance and a plurality of different metal layers are selectively deposited on the electrically conductive layer.

16. A display device comprising:

an active matrix substrate having a peripheral portion and a driver circuit section comprising a plurality of circuit elements and a plurality of polycrystalline silicon thin film transistors;

a counter substrate;

a liquid crystal material filled between the active matrix substrate and the counter substrate; and

an individually-wired line array for supplying a clock signal, a data signal or electric power to the plurality of circuit elements in the driver circuit section, wherein the individually-wired line array is extended to the peripheral portion of the active matrix substrate, wherein;

the active matrix substrate comprises an organic resin layer in the peripheral portion thereof, a connecting electrode, and a bus line connected to the individually-wired line array and buried in the organic resin layer;

the organic resin comprises a photosensitive resin;

the organic resin layer has a via hole formed by photolithography; and

the bus line is electrically connected to the individually wired line array via the connecting electrode located in the via hole.

17. The display device according to claim 16, wherein the bus line is an electrically conductive thermosetting resin.

19. The display device according to claim 16, wherein the bus line is a pre-formed metal fine wire.

20. The display device according to claim 16, wherein the bus line is produced by plating.

21. The display device according to claim 20, wherein the bus line is a layered structure comprising a copper foil layer, a copper plating layer, and a gold-nickel plating layer.

23. The display device according to claim 16, wherein the bus line is formed by depositing in which a thin, electrically conductive layer is formed in advance and a plurality of different metal layers are selectively deposited on the electrically conductive layer.