Apparatus and methods for stabilization and control of fiber devices and fiber devices including the same

• US 6,961,484 B2
• Filed: 05/21/2002
• Issued: 11/01/2005
• Est. Priority Date: 05/25/2001
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Miller, Matthew, Grunnet-Jepsen, Anders, Johnson, Alan E., Tsai, Tsung-Ein, Sweetser, John N.
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): Mooney, Michael P.
• Application Number:
  US10/153,452
• Publication Number:
  US 20020176088A1
• Time in Patent Office: 1,260 Days
• Field of Search: 398/87, 398/9, 385/12, 385/37, 385/14, 385/15, 385/24, 385/27, 385 88- 90, 372/6
• US Class Current: 385/14
• CPC Class Codes: G01D 5/35316 using a Bragg gratings
• CPC Class Codes: G02B 6/0218 using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients
• CPC Class Codes: G02B 6/022 using mechanical stress, e.g. tuning by compression or elongation, special geometrical shapes such as "dog-bone" or taper G02B6/02204 takes precedence; optical modulation using photo-elastic effect G02F1/0131
• CPC Class Codes: G02B 6/02204 using thermal effects, e.g. heating or cooling of a temperature sensitive mounting body optical modulation using thermo-optic effect G02F1/0147

Abstract

A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Claims

1. An apparatus, comprising:

a flip-chip platform;

at least one in-fiber device disposed in or on the flip-chip platform;

at least one sensor operationally coupled to the in-fiber device;

at least one transducer operationally coupled to the in-fiber device; and

feedback circuitry operationally coupled to the sensor and the transducer.

2. The apparatus of claim 1, wherein the in-fiber device is a fiber Bragg grating.

3. The apparatus of claim 1, wherein the flip-chip platform includes groove, at least a portion of the in-fiber device being disposed in the groove.

4. The apparatus of claim 1, wherein at least one of the sensor or transducer is embedded in the flip-chip platform.

5. The apparatus of claim 1, wherein the flip-chip platform is fabricated from at least one of a polymer, glass, crystal, insulator, or piezoelectric material.

6. The apparatus of claim 5, wherein the flip-chip platform includes indicators to aid in aligning the in-fiber device and the electronic circuitry.

7. The apparatus of claim 3, wherein an active region of the in-fiber device is disposed in the groove and an inactive region of the in-fiber device is attached to the flip-chip platform using at least one of a two-part epoxy, an ultraviolet (UV) curable epoxy, or solder.

8. The apparatus of claim 3, wherein at least one of the sensor or transducer is in substantial alignment with the groove.

9. The apparatus of claim 1, wherein the flip-chip platform comprises a first flip-chip substrate, a second flip-chip substrate, and an adhesive between the first and second flip-chip substrates to hold the first flip-chip and second flip-chip substrates together.

10. The apparatus of claim 9, wherein at least one of the sensor or transducer is printed on the first flip-chip substrate.

11. The apparatus of claim 10, wherein a second flip-chip substrate includes alignment marks to align at least one of the sensor, transducer, or in-fiber device with each other.

12. A method of fabricating a photonic device, comprising:

disposing at least one in-fiber device in or on a flip-chip platform;

operationally coupling at least one sensor to the in-fiber device;

operationally coupling at least one transducer to the in-fiber device; and

operationally coupling feedback circuitry to the sensor and the transducer.

13. The method of claim 12, wherein disposing at least one in-fiber device in or on a flip-chip platform comprises disposing at least one fiber Bragg grating in or on a flip-chip platform.

14. The method of claim 12, wherein disposing at least one in-fiber device disposed in or on a flip-chip platform comprises disposing at least one in-fiber device in or on a grooved flip-chip platform.

15. The method of claim 13, wherein operationally coupling at least one sensor to the fiber Bragg grating comprises operationally coupling at least one strain sensor or at least one temperature sensor to the fiber Bragg grating.

16. The method of claim 13, wherein operationally coupling at least one transducer to the fiber Bragg grating comprises operationally coupling at least one of a heating element, cooling element, or a piezoelectric transducer to the fiber Bragg grating.