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Method of making near chip size integrated circuit package

  • US 6,962,829 B2
  • Filed: 05/17/2002
  • Issued: 11/08/2005
  • Est. Priority Date: 10/31/1996
  • Status: Expired due to Term
First Claim
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1. A method of forming a plurality of integrated circuit chip packages, said method comprising:

  • providing a substrate having a plurality of sections, each of said sections having first metallizations formed on a first surface of said substrate;

    coupling an integrated circuit chip to a corresponding one of each of said sections of said substrate;

    electrically connecting each said integrated circuit chip to said first metallizations on said corresponding one of said sections;

    encapsulating said integrated circuit chips, said first metallizations and said first surface of said substrate with a layer of an encapsulant, wherein said layer of the encapsulant has an outer surface overlying the integrated circuit chips;

    placing the outer surface of the layer of the encapsulant on a mounting surface, and immobilizing the encapsulated substrate on said mounting surface;

    cutting said encapsulated substrate while on said mounting surface along a periphery of each of said sections to form said plurality of integrated circuit chip packages.

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