Semiconductor sensor with substrate having a certain electric potential

• US 6,963,134 B2
• Filed: 08/09/2002
• Issued: 11/08/2005
• Est. Priority Date: 09/10/2001
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Otani, Hiroshi
• Primary Examiner(s): Tran, Minhloan
• Assistant Examiner(s): MANDALA, VICTOR A
• Application Number:
  US10/214,594
• Publication Number:
  US 20030047804A1
• Time in Patent Office: 1,187 Days
• Field of Search: 257/684, 257/723, 257/724, 257/725, 257/782, 257/784, 257/666, 257/685, 257/676, 257/696, 257/698, 257/691, 257/203, 257/207, 257/208, 257/693
• US Class Current: 257/723
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A highly reliable semiconductor device less susceptible to external noise is provided. The semiconductor device has a signal output chip and a substrate. The signal output chip has one or more semiconductors and outputs a predetermined signal. The substrate has a circuit formed thereon and is electrically connected to the signal output chip. A potential of the substrate is fixed to a certain level.

Claims

1. A semiconductor device comprising:

a substrate;

a signal output chip which has one or more semiconductors and which outputs a predetermined signal, said signal output chip being formed on the substrate; and

an electric circuit formed on the substrate, said electric circuit being electrically connected to the signal output chip and being configured to generate a signal that is input to the signal output chip, and said electric circuit has a movable part that generates said signal,

wherein an electric potential of the substrate is fixed to a certain level.

2. The semiconductor device according to claim 1, wherein the electric potential of the substrate is fixed to a ground level.

3. The semiconductor device according to claim 1, wherein the signal output chip is formed on a substrate of the signal output chip, and wherein a rear surface of the substrate of the signal output chip has a metal layer.

4. A semiconductor device comprising:

a substrate;

a signal output chip which has one or more semiconductors and which outputs a predetermined signal, said signal output chip being formed on the substrate;

an electric circuit formed on the substrate, said electric circuit being electrically connected to the signal output chip and being configured to generate a signal that is input to the signal output chip, and said electric circuit has a movable part that generates said signal; and

a die pad, to which the substrate is fixedly attached by a conductive material,

wherein an electric potential of the die pad is fixed to a certain level.

5. The semiconductor device according to claim 4, wherein the conductive material is a conductive resin.

6. The semiconductor device according to claim 4, wherein the conductive material is a conductive metal.

7. The semiconductor device according to claim 4, wherein the signal output chip is formed on a substrate of the signal output chip, and wherein a rear surface of the substrate of the signal output chip has a metal layer.

8. A semiconductor device comprising:

means for supporting;

means for outputting a predetermined signal, said means for outputting being formed on the means for supporting; and

means for generating a signal that is input to the means for outputting, the means for generating being formed on the means for supporting and being electrically connected to the means for outputting, said means for generating including a movable part that generates said signal,

wherein an electric potential of the means for supporting is fixed to a certain level.

9. The semiconductor device according to claim 8, wherein the electric potential of the means for supporting is fixed to a ground level.

10. The semiconductor device according to claim 8, wherein the means for outputting is formed on means for supporting the means for outputting, and wherein a rear surface of the means for supporting the means for outputting has a metal layer.

11. A semiconductor device comprising:

means for supporting;

means for outputting a predetermined signal formed on the means for supporting;

means for generating a signal that is input to the means for outputting, the means for generating being formed on the means for supporting and being electrically connected to the means for outputting, said means for generating including a movable part that generates said signal; and

a die pad to which the means for supporting is fixedly attached by a conductive material,

wherein an electric potential of the die pad is fixed to a certain level.

12. The semiconductor device according to claim 11, wherein the conductive material is a conductive resin.

13. The semiconductor device according to claim 11, wherein the conductive material is a conductive metal.

14. The semiconductor device according to claim 11, wherein the means for outputting is formed on means for supporting the means for outputting, and wherein a rear surface of the means for supporting the means for outputting has a metal layer.