Fluid cooled vehicle drive module
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Assignments
First Claim
1. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
- a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
a substrate secured to the thermal support and cooled during operation by the coolant stream;
a power electronics circuit directly secured to and cooled by the substrate, the power electronics circuit being configured for generating output signals resulting from power conversion, the power electronic circuit generating heat during operation that is at least partially extracted by the coolant stream via the substrate; and
a driver circuit for applying drive signals to the power electronics circuit, the driver circuit being secured to and cooled by the thermal support.
2 Assignments
0 Petitions

Accused Products

Abstract
An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
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42 Claims
- 1. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
a substrate secured to the thermal support and cooled during operation by the coolant stream;
a power electronics circuit directly secured to and cooled by the substrate, the power electronics circuit being configured for generating output signals resulting from power conversion, the power electronic circuit generating heat during operation that is at least partially extracted by the coolant stream via the substrate; and
a driver circuit for applying drive signals to the power electronics circuit, the driver circuit being secured to and cooled by the thermal support. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- 14. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a thermal support for a circuit, the support comprising a substrate having fluid inlet and outlet ports and a circulation path coupled between the inlet and outlet ports, the inlet and outlet ports being configured to transmit a coolant for circulation through the circulation path;
an interface plate configured to support a power electronics circuit, the interface plate being configured for mounting to the support adjacent to the coolant circulation path for extraction of heat from the interface plate during operation;
a power electronics circuit configured for power conversion supported on the interface plate; and
a driver circuit for applying drive signals to the power electronics circuit, the driver circuit being secured to and cooled by the thermal support;
wherein the support at least partially defines an electrical reference plane, a mechanical support, and a thermal extraction path for the power electronics circuit. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
- 27. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power;
a control circuit coupled to the power electronics circuit and configured to generate control signals for control of the solid state switches;
a fluid cooled support at least partially defining an electrical reference plane and on which at least the power electronics circuit is directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit for removal of heat therefrom; and
a driver circuit for applying drive signals to the power electronics circuit, the driver circuit being secured to and cooled by the support. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
- 40. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
a substrate secured to the thermal support and cooled during operation by the coolant stream;
a power electronics circuit directly secured to and cooled by the substrate, the power electronics circuit being configured for generating output signals resulting from power conversion, the power electronic circuit generating heat during operation that is at least partially extracted by the coolant stream via the substrate; and
a control circuit secured on and cooled by the thermal support.
- 41. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a thermal support for a circuit, the support comprising a substrate having fluid inlet and outlet ports and a circulation path coupled between the inlet and outlet ports, the inlet and outlet ports being configured to transmit a coolant for circulation through the circulation path;
an interface plate configured to support a power electronics circuit, the interface plate being configured for mounting to the support adjacent to the coolant circulation path for extraction of heat from the interface plate during operation;
a power electronics circuit configured for power conversion supported on the interface plate; and
a control circuit secured on and cooled by the thermal support;
wherein the support at least partially defines an electrical reference plane, a mechanical support, and a thermal extraction path for the power electronics circuit.
- 42. An electric drive for a vehicle at least partially propelled by an electric motor, the drive comprising:
a vehicle drive train;
a power converter operatively coupled to the drive train and comprising;
a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power;
a control circuit coupled to the power electronics circuit and configured to generate control signals for control of the solid state switches; and
a fluid cooled support at least partially defining an electrical reference plane and on which at least the power electronics circuit is directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit for removal of heat therefrom, wherein the control circuit is secured on and cooled by the fluid cooled support.
1 Specification
This application claims the benefit of U.S. Provisional Application No. 60/349,259, filed Jan. 16, 2002.
This invention was made with Government support under Cooperative Agreement No. DE-FC02-99EE50571 awarded by the Department of Energy. The Government has certain rights in this invention.
The present technique relates to a vehicle drive including power electronic devices and their incorporation into modules and systems. More particularly, the technique relates to the configuration, packaging and thermal management of power electronic devices in such drives.
A wide array of vehicle drives are known including power electronic devices, such as power switches, transistors, and the like. For example, silicon controlled rectifiers (SCRs), insulated gate bipolar transistors (IGBTs), field effect transistors (FETs), and so forth are used to provide power to loads. In certain applications, for example, arrays of power switches are employed to convert direct current power to alternating current waveforms for application to loads, typically an electric vehicle motor.
In electric vehicles, a source of direct current is typically available from a battery or power supply system incorporating a battery or other direct or rotating energy converter. Power electronic devices are employed to convert this power to alternating current waveforms for driving one or more electric motors. The motors serve to drive power transmission elements to propel the vehicle. While numerous constraints exist in such settings which differ from those of industrial settings, numerous problems and difficulties are shared in all such applications.
Demands made on power electronic devices typically include their reliability, power output, size and weight limits, and requirements regarding the environmental conditions under which they must operate. Where size and weight constraints force reductions in the packaging dimensions, difficulties arise in appropriately placing the power electronic devices, and drive and control circuitry associated with the devices to sufficiently remove heat generated during their operation. Where size, cost and weight are less important, large heat sinks and heat dissipation devices may be employed utilizing any fluid that can be accommodated by choice of materials that are compatible. However, as packaging sizes are reduced, more efficient and effective techniques are needed. Electrical and electronic constraints also impose difficulties on package design. For example, reduction of inductance in the circuits and circuit layout is commonly a goal, while solutions for reducing inductance may be difficult to realize. Shielding from electromagnetic interference originating both within the package and outside the package may be important, depending upon the surrounding environment. Similarly, appropriate interfacing with external circuitry, and the facility to install, service and replace power electronics packages may be important in certain applications. It has typically been necessary in many instances to configure the power electronic element to match closely the specific needs of the application and by doing so meet cost, size, performance targets that can be achieved by no other means. Finally, certain environments, such as vehicle environments, impose a wide range of difficult operating conditions, including large temperature spans, vibration and shock loading, and so forth.
There is a need, therefore, for improved techniques in packaging of power electronic devices in vehicle drives. There is a particular need for techniques which offer highly efficient and cost-effective power capabilities in small, robust, and thermally managed configurations.
The present technique provides a vehicle drive including power electronics modules designed to respond to such needs. The technique makes use of novel packaging, thermal management, interconnect, and grounding shielding approaches which both improve performance, and offer smaller, lighter and more efficient configurations of the power electronic devices and their drive circuitry. The technique offers multiple facets for such packaging and thermal management which can be adapted to a variety of settings, particularly in vehicular applications. Many of the embodiments of the present technique permit utilization of standardized cells designed to be reconfigured into a number of optimum configurations matching key application requirements.
The features of the technique offer modular packaging, such as around a thermal management system, generally including a thermal support. Power electronic devices may be mounted directly to the support for removal of heat. The arrangement of the devices, and their interconnection with incoming and outgoing power conductors may vary, and may make use of the thermal support for extraction of heat and for mounting of various components. A number of improved power device assemblies, their attachment means to the thermal support are accommodated with the scope of the present technique.
In an exemplary embodiment, a vehicle drive including a modular power converter is featured, although other types of power electronic circuitry, including various power converting circuitry and drives, and so forth, may be adapted in the package. Incoming power conductors interface with the power electronics circuitry, which converts the incoming power to desired output power, such as alternating current waveforms. The incoming and outgoing power conductor configurations and arrangements may facilitate installation of the module into enclosures or vehicular mounting spaces, with plug-in connections being offered for both power and control. Coolant may be routed through the thermal base via additional connections. Exemplary coolant configurations are envisaged that effectively extract heat by close and thermally matched mounting of power electronics and other electronic devices immediately adjacent to heat removal surfaces. Locations, positioning and interconnection of control, drive, and power electronic circuitry facilitate close packaging of these elements.
Shielding from electromagnetic interference may be facilitated through the use of a shielding support, which may be a thermal support and, where desired, additional external shielding and closures. Optimum power device temperature and EMI regulation means may be accommodated in the intrinsic features of the support, such that they work in close harmony with electrical power switching elements or other circuitry and their thermomechanical attachment to both the inputs, outputs and the support, EMI-management and thermal-management system.
The present technique offers a wide range of improvements in vehicle drive power electronics packaging and management. The improvements reside both in the particular configuration of the packages, the configuration of the package components and the interrelationship and layout of the components, their interfaces, and their operational interdependence. The technique also offers more effective shielding from EMI/RFI. Moreover, better high frequency grounds may be achieved by low inductance connection means integrated into the support. Connections may be cooled by means of integrated bus structure in contact with electrically insulating but thermally conductive features in or integrated with the support and coolant circulating system.
The foregoing and other advantages and features of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
Before detailing specific embodiments of the inventive technique as presently contemplated, certain definitional notes are in order. Firstly, reference is made in the present disclosure to power devices and subassemblies incorporating such devices. Such devices may include a range of components, such as power electronic switches (e.g. IGBTs, FETs) of various power ratings. The devices may also include gate driver circuitry for such components, sensing and monitoring circuitry, protection circuitry, filtering circuitry, and so forth. The devices may be provided in the subassemblies in various groupings, both integrally and separate from supporting substrates and/or thermal expansion coefficient members and heat transfer elements. Reference is also made herein to energy storage and conditioning circuitry. Such circuitry may vary in composition depending upon the particular configuration of the associated power electronic devices and circuits. For example, in inverter drive applications as discussed below, the energy storage and conditioning circuitry may include one or more capacitors, capacitor/inductor circuits or networks. Filtering circuitry may also be included for signal conditioning. In other applications, such as medium frequency welding, the energy storage and conditioning circuitry may include one or more transformers. Finally, while reference is made herein to a thermal support used in conjunction with power devices and other circuitry, various configurations and functions may be attributed to the support. For example, as described below, the support may provide both mechanical and electrical support for the various components, as well as offer integrated and highly efficient cooling of some or all of the components. Moreover, the support may provide electrical and shielding functions, such as for EMI and RFI shielding both of external fields that may affect the components as well as fields that may be generated by the components during operation. Thermal regulating components and circuits may also be incorporated into or associated with the support.
Turning now to the drawings, and referring first to
The exemplary configurations of
As mentioned above, various circuit configurations may be designed into the power electronics module. The circuit configurations will vary widely depending upon the particular requirements of each individual application. However, certain exemplary circuit configurations are presently envisaged, both of which include power electronic devices which require robust and compact packaging along with thermal management. Two such exemplary circuits are illustrated in
In the embodiment of
In the embodiment of
In the illustrated embodiment, housing 94 includes a cavity 104 in which circuit assembly 92 is disposed. Conductors 106 transmit DC power to the circuit assembly 92, while conductors 108 transmit the AC waveforms from the circuit assembly 92 for application to a load. An interface plate 110 is provided through which conductors 106 and 108 extend. Where desired, sensors may be incorporated into the assembly, such as current sensors 112 which are aligned about two of the outgoing power conductors 108 to provide feedback regarding currents output by the module. As will be appreciated by those skilled in the art, other types and numbers of sensors may be employed, and may be incorporated both within the housing, within a connector assembly, or within the circuit assembly itself.
As described more fully below, thermal support 12 may incorporate a variety of features designed to improve support, both mechanical and electrical, for the various components mounted thereon. Certain of these features may be incorporated directly into the thermal support, or may be added, as is the case of the embodiment of FIG. 8. As shown in
An alternative configuration for the housing 94 and cover 96 of the module is illustrated in
In the arrangement of
Within the housing, various other features may facilitate interconnections between the various circuits and components. For example, in the illustrated embodiment sensor cabling 136 is provided for receiving signals from current sensors 112. Such signals may be routed, via the cabling 136 around the housing to drive circuitry 34 or control circuitry 36, so as to monitor operating conditions of the power electronic circuitry. Other types of sensors and placements of such sensors, along with signal transmission cabling may, of course, be incorporated in the arrangement.
Returning to
A variety of interface configurations may be envisaged for mounting the various components on the thermal support 12. In the embodiment illustrated in
As illustrated in
Features are formed within channel 152 for enhancing the heat transfer from the power electronic circuit. In the embodiment of
Where fins 160 extend from plate 148, various types of fins and patterns of arrangement may be provided. As illustrated in
It should be noted that the various alternative configurations described herein for routing coolant can be subject to wide variation and adaptation depending upon the heat dissipating requirements, the configuration of the thermal support, the location and disposition of the power electronic circuits, and so forth. The examples provided are intended to be exemplary only.
As described above, the interface plate 148 may be separately fabricated from the body of the thermal support 12. Moreover, the thermal support 12 may incorporate a substantial number of features useful for extracting heat, mechanically mounting the various circuitry and components, establishing an electrical reference plane for the circuitry, and shielding the surrounding circuitry, at least somewhat, from stray electromagnetic interference generated by operation of the power electronic devices. The thermal support structure may be formed out of a number of materials and manners (e.g., polymers, polymer matrix composites, thermosetting materials and processes, utilizing a number of net shape, forming, discrete machining, fixture bonding, and similar Processes). The number of integrated features that the thermal base may provide may be broken into cellular elements that can be included or excluded by means of settings in the tooling of manufacture so that many power electronic designs, topologies, and configurations can be built to order from the core elements embodied in the tooling and design. Moreover, features may be formed on or added to the thermal support for receiving the interface plate 148 and for defining a volume in which an insulation or potting material may be deposited. In present embodiments, the thermal support may include a partial integral flange 126 (see, e.g., FIG. 14). In alternative arrangements, a frame 114 may be added to the thermal support to accomplish certain of the mounting and insulation and potting functions, as illustrated in FIG. 16. In this embodiment also, however, the thermal support 12 is fabricated separately from the interface plate 148 to permit any special processing of the circuitry disposed on the interface plate.
An exemplary electronic device subassembly is illustrated in FIG. 18. As noted above, the electronic device subassembly 130 is placed directly on the interface plate 148 to promote good thermal transfer from the electronics devices to the interface plate. In the embodiment of
The device subassembly design illustrated in
As shown in
The terminal strip illustrated in
As shown in
As noted above, the packaging and configuration of the module 10 may be arranged so as to permit incoming power and outgoing power to be routed in a variety of manners depending upon the arrangement of interface circuitry and components. The packaging may also permit various routing arrangements for coolant.
As noted above, various connector configurations can be provided in the present technique for routing power and coolant to and from the module.
The connections are made to the module, then, by simply plugging the mating connector 236 into the interface 232 as indicated by arrow 248. As will be appreciated by those skilled in the art, various locking features, securement features, straps, fasteners, or the like may be provided to ensure that the connector is fully and securely installed. Moreover, a sensor or switch assembly (not shown) may be provided in either the connector interface 232 or the mating connector 236 to sense whether the connection is appropriately completed. Feedback signals from such devices may be used by the controller to prevent or limit application of power to the module until appropriate interconnections are made.
In configurations employing more than one entry location for conductors, multiple connectors may be provided as indicated in FIG. 24. The arrangement of
As mentioned above, various alternative configurations may be envisaged for the particular external packaging of the module, as well as for its shielding from stray EMI.
In the arrangement illustrated in
In the embodiment illustrated in
To enhance thermal control in modules of the type described above, various fluid flow controls may be incorporated into the structures as illustrated generally in FIG. 34. The flow control system, indicated generally by reference numeral 332, may include various sensors 334 which detect local temperatures at various locations around the power electronic device subassembly 130 and at other locations in the system. Input lines 336 feed signals representative of the temperatures to a flow control circuit 338. The flow control circuit 338 regulates the flow of coolant to and from the module via a flow control valve 340 coupled to the flow control circuit via an output line 342. Thus, closed-loop temperature control may be provided in the module so as to optimize coolant flow and to minimize variations in thermal cycling, thereby enhancing the life of the power electronic components within the device subassembly 130.
As noted above, a wide range of circuits may be accommodated that may benefit from the various configurations described above. In particular, as mentioned above, various types of converter circuits may be supported on the thermal support and connected, cooled, shielded and so forth as described.
Also as noted above, another type of circuitry which may be accommodated in the arrangements described are AC—AC converters, matrix switch topologies of the type illustrated in
It should be noted that, while certain three-phase topologies are discussed herein, the present technique may extend to single phase and other arrangements. Such arrangements may accommodate applications such as mid-frequency welding applications. Such applications may incorporate a high frequency transformer rather than certain of the capacitors disposed on the thermal support. The circuitry supported on and thermally serviced by the support then becomes somewhat modular between application-specific designs.
While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown in the drawings and have been described in detail herein by way of example only. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.