Radiator plate rapid cooling apparatus

• US 6,966,359 B1
• Filed: 04/30/2004
• Issued: 11/22/2005
• Est. Priority Date: 04/30/2004
• Status: Expired due to Fees

• Current Assignee: Thermasol Technology Co., Ltd.
• Original Assignee: I-Ming Liu
• Inventors: Liu, I-Ming
• Primary Examiner(s): McKinnon, Terrell
• Application Number:
  US10/834,913
• Publication Number:
  US 20050241806A1
• Time in Patent Office: 571 Days
• Field of Search: 165/104.33, 165/104.19, 165/104.21, 165/185, 165/80.3, 361/699, 361/700, 257714-716, 174/15.2
• US Class Current: 165/104.21
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: F28F 9/26 Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators connecting different sections in water heaters F24H9/14 , connecting headers with inlet or outlet fittings F28F9/0246
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.

Claims

1. A radiator plate rapid cooling apparatus comprising a base deck and radiation fins located above the base deck, the base deck having passages formed therein that contain a capillary means formed by extrusion to form a closed loop of double-layer passages, the closed loop being vacuumized and filled with a heat dissipation medium, the base deck having a heat absorption end to transfer heat to the radiation fins located thereabove to allow the heat to be dispelled by a fan to achieve heat dissipation effect, the passages are reciprocal and have two ends which communicate with one another and house the capillary means which is placed therein or formed by integrated extrusion.

2. The radiator plate rapid cooling apparatus of claim 1, wherein the radiator plate is adopted for use on personal or notebook computers, projectors and plasma television sets and other devices that have heat generating sources.

3. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck and the radiation fins are formed in an integrated manner by extrusion, forging or soldering.

4. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck and the radiation fins are selectively made from aluminum or copper.

5. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is mountable independently on a heat generating element.

6. The radiator plate rapid cooling apparatus of claim 1, wherein the capillary means has a round tube in the center with spacers formed on the periphery thereof.

7. The radiator plate rapid cooling apparatus of claim 1, wherein the heat dissipation medium is selectively liquid or gas.

8. The radiator plate rapid cooling apparatus of claim 1, wherein the heat dissipation medium is filled to the amount of 10% to 70% of the internal volume capacity of the passages.

9. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck has longitudinal passages formed therein.

10. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is located on the bottom end of the radiator plate and has the passages formed therein, the passages housing the capillary means which is placed therein or formed by integrated extrusion to form a loop of double-layer passages.

11. The radiator plate rapid cooling apparatus of claim 10, wherein the capillary means is formed in a mesh and barrel fashion.

12. The radiator plate rapid cooling apparatus of claim 10, wherein the radiator plate includes a base deck of a same height and radiation fins of varying heights and densities according to the space size of a heat generating source.

13. The radiator plate rapid cooling apparatus of claim 1, further having longitudinal passages located at two ends of the reciprocal passages, the longitudinal passages housing a partition plate to partition the reciprocal passages to become a single loop.

14. The radiator plate rapid cooling apparatus of claim 13, wherein the partition plate is made by integrated plastic injection and has conical spacers formed on the periphery thereof.

15. The radiator rapid cooling apparatus of claim 1, wherein the base deck has an exit connection end an inlet connection end that have one end connecting to the passage and other end connecting to an external heat exchange circulation system to form an open loop, the open loop being connectable in series.

16. The radiator plate rapid cooling apparatus of claim 1, wherein the base deck is coupled in series to form a closed loop and has transverse passages containing a partition plate to form a single loop.