Backlight module and heat dissipation structure thereof
First Claim
1. A heat dissipation structure for a backlight module comprising a circuit board having a through hole with a light emitting diode (LED) corresponding thereto, disposed on one side of the circuit board, comprising:
- a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole;
a thermal conductive element disposed between the heat conducting portion and the LED, the thermal conducting element being made of a soft material that is not damaging to the LED; and
a heat dissipating portion thermo-conductively connected to the heat conducting portion.
1 Assignment
0 Petitions
Accused Products
Abstract
A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.
72 Citations
19 Claims
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1. A heat dissipation structure for a backlight module comprising a circuit board having a through hole with a light emitting diode (LED) corresponding thereto, disposed on one side of the circuit board, comprising:
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a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole; a thermal conductive element disposed between the heat conducting portion and the LED, the thermal conducting element being made of a soft material that is not damaging to the LED; and a heat dissipating portion thermo-conductively connected to the heat conducting portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A backlight module, comprising:
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a housing; a circuit board having a plurality of through holes and disposed on the housing; a plurality of light emitting diodes (LEDs) corresponding to the through holes and disposed on and electrically connected to the circuit board; a plurality of heat conducting portions thermo-conductively connected to the LEDs and disposed in the through holes; a plurality of thermal conductive elements disposed in the through hole and sandwiched between the LEDs and the heat conducting portions; and at least one heat dissipation portion thermo-conductively connected to the heat conducting portions and positioned between the circuit board and the housing. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification