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Backlight module and heat dissipation structure thereof

  • US 6,966,674 B2
  • Filed: 02/17/2004
  • Issued: 11/22/2005
  • Est. Priority Date: 02/17/2004
  • Status: Active Grant
First Claim
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1. A heat dissipation structure for a backlight module comprising a circuit board having a through hole with a light emitting diode (LED) corresponding thereto, disposed on one side of the circuit board, comprising:

  • a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole;

    a thermal conductive element disposed between the heat conducting portion and the LED, the thermal conducting element being made of a soft material that is not damaging to the LED; and

    a heat dissipating portion thermo-conductively connected to the heat conducting portion.

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