Terahertz interconnect system and applications

• US 6,967,347 B2
• Filed: 06/14/2003
• Issued: 11/22/2005
• Est. Priority Date: 05/21/2001
• Status: Expired due to Fees

• Current Assignee: The Board of Regents of the University of Colorado (University of Colorado System)
• Original Assignee: The Board of Regents of the University of Colorado (University of Colorado System)
• Inventors: Estes, Michael J., Moddel, Garret
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nguyen, Thinh T.
• Application Number:
  US10/462,491
• Publication Number:
  US 20040069984A1
• Time in Patent Office: 892 Days
• Field of Search: 257/25, 257/30, 257/31, 257/32, 257/34, 257/35, 257/36, 257/46
• US Class Current: 257/25
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 2006/12123 Diode
• CPC Class Codes: G02B 2006/1213 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: G02B 2006/12142 Modulator
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/1226 involving surface plasmon interaction
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4279 Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06534 Optical coupling
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 31/035236 Superlattices; Multiple quantum well structures
• CPC Class Codes: H01L 31/06 : characterised by potential barriers
• CPC Class Codes: H01L 31/101 : Devices sensitive to infrared, visible or ultraviolet radiation
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy

Abstract

An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.

Claims

1. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein said transmitting and receiving arrangements are configured to cooperate with one another such that said transmitting arrangement conveys said electromagnetic signal to said receiving arrangement by free-space transmission.

2. The assembly of claim 1 further comprising:

a first substrate configured for supporting said first electrical circuitry and said transmitting arrangement; and

a second substrate separate from said first substrate, said second substrate being configured for supporting said receiving arrangement and said second electrical circuitry.

3. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein said transmitting arrangement includes a transmitting antenna for transmitting said electromagnetic signal away from said transmitting arrangement.

4. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein said receiving arrangement includes a receiving antenna for receiving said electromagnetic signal.

5. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling,

wherein said electron tunneling device is configured such that using only said first layer in the arrangement would result in a given value of nonlinearity in said transport of electrons, with respect to said given voltage, and wherein said arrangement further includes a different, second layer disposed directly adjacent to and configured to cooperate with said first layer such that said nonlinearity, with respect to said given voltage, is increased over and above said given value of nonlinearity by the inclusion of said second layer without the necessity for any additional layer.

6. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling,

wherein said transmitting and receiving arrangements are configured to cooperate with one another such that said transmitting arrangement conveys said electromagnetic signal to said receiving arrangement by free-space transmission.

7. The assembly of claim 6 further comprising:

a first substrate configured for supporting said first electrical circuitry and said transmitting arrangement; and

a second substrate separate from said first substrate, said second substrate being configured for supporting said receiving arrangement and said second electrical circuitry.

8. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing first data;

a first transceiver arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into a first electromagnetic signal containing at least a portion of said first data;

a second transceiver arrangement configured for receiving said first electromagnetic signal and for converting said first electromagnetic signal into a second electrical signal containing at least some of said portion of said first data; and

a second electrical circuitry connected with said second transceiver arrangement and configured for receiving said second electrical signal,

wherein at least one of said first and second transceiver arrangements includes an electron tunneling device, said electron tunneling device including

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling,

wherein said second electrical circuitry is configured for providing a third electrical signal containing second data,

wherein said second transceiver arrangement is further configured for receiving said third electrical signal and for converting said third electrical signal into a third electromagnetic signal containing at least a portion of said second data,

wherein said first transceiver arrangement is further configured for receiving said third electromagnetic signal and for converting said third electromagnetic signal into a fourth electrical signal containing at least some of said portion of said second data, and

wherein said first electrical circuitry is configured for receiving said fourth electrical signal.

9. An assembly comprising:

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;

a receiving arrangement for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving arrangements is configured to provide electron tunneling and includes an antenna connected therewith.

10. The assembly of claim 9 wherein said transmitting arrangement includes an electron tunneling device for providing said electron tunneling, and wherein said antenna is a transmitting antenna for transmitting said electromagnetic signal away from said transmitting arrangement.

11. The assembly of claim 9 wherein said receiving arrangement includes an electron tunneling device for providing said electron tunneling, and wherein said antenna is a receiving antenna for receiving said electromagnetic signal.

12. The assembly of claim 9 wherein each of said transmitting and receiving arrangements includes an electron tunneling device for providing said electron tunneling.

13. An assembly comprising:

first electrical means for providing a first electrical signal containing data;

transmitting means connected with said first electrical means and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;

receiving means for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data; and

second electrical means connected with said receiving means and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving means includes means for providing electron tunneling with an antenna connected therewith.

14. An assembly comprising:

a substrate;

an integrated circuit package supported on said substrate and containing

an integrated circuit module configured for providing an output electrical signal containing output data, and

a transceiver arrangement connected with said integrated circuit module for receiving said output electrical signal and for converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data; and

a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

15. The assembly of claim 14 wherein said integrated circuit module is a standard integrated circuit chip.

16. The assembly of claim 14 wherein said transceiver arrangement includes an electron tunneling arrangement for providing electron tunneling.

17. The assembly of claim 16 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

18. The assembly of claim 14 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver arrangement is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said integrated circuit module.

19. An assembly comprising:

a substrate;

an integrated circuit package including

an integrated circuit module for providing an output electrical signal containing output data, and

a plurality of electrical pin-outs for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package;

a socket arrangement supported on said substrate and configured for receiving said integrated circuit package thereon, said socket arrangement including a transceiver arrangement disposed therein such that said transceiver arrangement receives said output electrical signal from said plurality of electrical pin-outs and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data; and

a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

20. The assembly of claim 19 wherein said transceiver arrangement includes an electron tunneling arrangement for providing electron tunneling.

21. The assembly of claim 20 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

22. The assembly of claim 19 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver arrangement is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said integrated circuit module through said plurality of electrical pin-outs.

23. An assembly comprising:

a substrate;

an integrated circuit package supported on said substrate and containing an integrated circuit module, said integrated circuit module being configured for providing an output electrical signal containing output data;

an electrical interconnect also supported on said substrate and having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end;

a transceiver package also supported on said substrate and including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect such that said transceiver chip receives said output electrical signal and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data; and

a waveguide having a first segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward a distinct, second segment of said waveguide.

24. The assembly of claim 23 wherein said transceiver chip includes an electron tunneling arrangement for providing electron tunneling.

25. The assembly of claim 24 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

26. The assembly of claim 23 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver chip is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said second end of said electrical interconnect, wherein said electrical interconnect is further configured for receiving said input electrical signal and directing at least a portion of said input electrical signal to said first end, and wherein said integrated circuit module is further configured to receive said portion of said input electrical signal.

27. In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

a substrate;

an integrated circuit package supported on said substrate and configured for accommodating said integrated circuit module thereon, said integrated circuit packaging including a transceiver arrangement connected with said integrated circuit module for receiving said output electrical signal and for converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data; and

a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

28. The assembly of claim 27 wherein said integrated circuit package is configured for accommodating a standard integrated circuit chip as said integrated circuit module.

29. The assembly of claim 27 wherein said transceiver arrangement includes an electron tunneling arrangement for providing electron tunneling.

30. The assembly of claim 29 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

31. The assembly of claim 27 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver arrangement is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said integrated circuit module.

32. In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module, for providing an output electrical signal containing output data, and a plurality of electrical pin-outs, for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

a substrate;

a socket arrangement supported on said substrate and configured for receiving said integrated circuit package thereon, said socket arrangement including a transceiver arrangement disposed therein such that said transceiver arrangement receives said output electrical signal from said plurality of electrical pin-outs and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data; and

a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

33. The assembly of claim 32 wherein said transceiver arrangement includes an electron tunneling arrangement for providing electron tunneling.

34. The assembly of claim 33 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

35. The assembly of claim 32 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver arrangement is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said integrated circuit module through said plurality of electrical pin-outs.

36. In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module configuredfor providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

a substrate configured for supporting said integrated circuit module thereon, said substrate including

an electrical interconnect having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end,

a transceiver package including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect such that said transceiver chip receives said output electrical signal and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

a waveguide having a first segment and a distinct, second segment, said first segment being configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

37. The assembly of claim 36 wherein said transceiver chip includes an electron tunneling arrangement for providing electron tunneling.

38. The assembly of claim 37 wherein said electron tunneling device includes

first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and

an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

39. The assembly of claim 36 wherein said waveguide is further configured for receiving an input electromagnetic signal containing input data at said distinct, second segment and directing said input electromagnetic signal toward said first segment, wherein said transceiver chip is further configured for receiving at least a portion of said input electromagnetic signal, for converting said portion of said input electromagnetic signal into an input electrical signal containing at least a portion of said input data, and for directing said input electrical signal to said second end of said electrical interconnect, wherein said electrical interconnect is further configured for receiving said input electrical signal and directing at least a portion of said input electrical signal to said first end, and wherein said integrated circuit module is further configured to receive said portion of said input electrical signal.

40. In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

an integrated circuit package configured for accommodating said integrated circuit module thereon, said integrated circuit package including a transceiver arrangement connected with said integrated circuit module and configured for

receiving said output electrical signal,

converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

directing said output electromagnetic signal away from said integrated circuit package,

wherein said transceiver arrangement is further configured for radiating said output electromagnetic signal into free space such that said output electromagnetic signal is directed away from said integrated circuit package.

41. In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

an integrated circuit package configured for accommodating said integrated circuit module thereon, said integrated circuit package including a transceiver arrangement connected with said integrated circuit module and configured for

receiving said output electrical signal,

converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

directing said output electromagnetic signal away from said integrated circuit package; and

a waveguide having a first segment and a distinct, second segment, said first segment being connected with said transceiver arrangement and said distinct, second segment being located away from said integrated circuit package, wherein said transceiver arrangement is further configured for directing at least a portion of said output electromagnetic signal into said first segment of said waveguide, and wherein said waveguide is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide and, consequently, away from said integrated circuit package.

42. The assembly of claim 41 further comprising a substrate for supporting said integrated circuit package and at least a portion of said waveguide, wherein said waveguide is a slab waveguide.

43. In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

an integrated circuit package configured for accommodating said integrated circuit module thereon, said integrated circuit package including a transceiver arrangement connected with said integrated circuit module and configured for

receiving said output electrical signal,

converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

directing said output electromagnetic signal away from said integrated circuit package;

a substrate for supporting said integrated circuit package thereon; and

a transmission line having a first segment and a distinct, second segment, at least said first segment also being supported on said substrate, said distinct, second segment being located away from said integrated circuit package,

wherein said transceiver is further configured for directing at least a portion of said output electromagnetic signal toward said first segment of said transmission line, and

wherein said first segment of said transmission line is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said transmission line and, consequently, away from said integrated circuit package.

44. In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module, for providing an output electrical signal containing output data, and a plurality of electrical pin-outs, for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

a socket arrangement configured for accommodating said integrated circuit package thereon, said socket arrangement including a transceiver arrangement configured for

receiving said output electrical signal from said plurality of electrical pin-outs,

converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

directing said output electromagnetic signal away from said socket arrangement.

45. The assembly of claim 44 wherein said transceiver arrangement is further configured for radiating said output electromagnetic signal into free space such that said output electromagnetic signal is directed away from said socket arrangement.

46. The assembly of claim 44 further comprising a waveguide having a first segment and a distinct, second segment, said first segment being connected with said transceiver arrangement and said distinct, second segment being located away from said socket arrangement, wherein said transceiver arrangement is further configured for directing at least a portion of said output electromagnetic signal into said first segment of said waveguide, and wherein said waveguide is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide and, consequently, away from said socket arrangement.

47. The assembly of claim 46 further comprising a substrate for supporting said socket arrangement and at least a portion of said waveguide, wherein said waveguide is a slab waveguide.

48. The assembly of claim 44 further comprising:

a substrate for supporting said socket arrangement; and

a transmission line having a first segment and a distinct, second segment, at least said first segment also being supported on said substrate, said distinct, second segment being located away from said socket arrangement,

wherein said transceiver is further configured for directing at least a portion of said output electromagnetic signal toward said first segment of said transmission line, and

wherein said first segment of said transmission line is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said transmission line and, consequently, away from said socket arrangement.

49. In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

an electrical interconnect having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end,

a transceiver package including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect and configured for

receiving said output electrical signal,

converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and

directing said output electromagnetic signal away from said transceiver package.

50. The assembly of claim 49 wherein said transceiver chip is further configured for radiating said output electromagnetic signal into free space such that said output electromagnetic signal is directed away from said transceiver package.

51. The assembly of claim 49 further comprising a waveguide having a first segment and a distinct, second segment, said first segment being connected with said transceiver chip and said distinct, second segment being located away from said transceiver package, wherein said transceiver chip is further configured for directing at least a portion of said output electromagnetic signal into said first segment of said waveguide, and wherein said waveguide is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide and, consequently, away from said transceiver package.

52. The assembly of claim 51 further comprising a substrate for supporting said transceiver package and at least a portion of said waveguide, wherein said waveguide is a slab waveguide.

53. The assembly of claim 49 further comprising:

a substrate for supporting said electrical interconnect and said transceiver package; and

a transmission line having a first segment and a distinct, second segment, at least said first segment also being supported on said substrate, said distinct, second segment being located away from said transceiver package,

wherein said transceiver chip is further configured for directing at least a portion of said output electromagnetic signal toward said first segment of said transmission line, and

wherein said first segment of said transmission line is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said transmission line and, consequently, away from said transceiver package.