IC chip package

• US 6,967,400 B2
• Filed: 01/27/2004
• Issued: 11/22/2005
• Est. Priority Date: 01/04/2001
• Status: Expired due to Fees

• Current Assignee: Wen-Wen Chiu
• Original Assignee: Wen-Wen Chiu
• Inventors: Chiu, Wen-Wen
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US10/764,457
• Publication Number:
  US 20040183169A1
• Time in Patent Office: 665 Days
• Field of Search: 257/704, 257/701, 257/710
• US Class Current: 257/704
• CPC Class Codes: G04G 21/04 using radio waves radio-controlled time-pieces G04R
• CPC Class Codes: G04G 9/0064 in which functions not related to time can be displayed digital output to display devices of digital computers G06F3/14
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.

Claims

1. An IC chip package comprising:

a substrate having a top side, a bottom side, and a plurality of conductive pads arranged on the top side;

a chip fixedly mounted on the top side of said substrate and having a plurality of conductive pads;

a plurality of bonding wires respectively electrically connected between the conductive pads of said substrate and the conductive pads of said chip;

adhesive means provided on the top side of said substrate around the border thereof;

a cover adapted for covering said substrate; and

a spacer connected between said substrate and said cover to keep said cover from said substrate at a distance, wherein said spacer comprises at least two columns respectively fixedly connected between said substrate and said cover.

2. The IC chip package as claimed in claim 1, wherein said spacer comprises

four columns respectively fixedly connected between said substrate and said cover.

3. The IC chip package as claimed in claim 1, wherein said adhesive means is applied to the border of the top side of said substrate and covered on the connecting area between said bonding wires and the conductive pads at the top side of said substrate.

4. The IC chip package as claimed in claim 1, wherein said cover is adhered to said adhesive means.

5. The IC chip package as claimed in claim 1, wherein the top side of said substrate has at least one recessed locating hole adapted to receive said at least one column.

6. The IC chip package as claimed in claim 1, wherein said substrate comprises at least two locating through holes extended through the top and bottom sides thereof, and each of the at least two columns of said spacer is respectively inserted through a respective one of the at least two locating holes of said substrate and exposed to the outside of the bottom side of said substrate.

7. The IC chip package as claimed in claim 1, wherein said spacer is comprised of an open frame fixedly connected between said substrate and said cover.

8. The IC chip package as claimed in claim 7, wherein said open frame has a recessed portion facing said substrate for receiving said adhesive means.

9. The IC chip package as claimed in claim 1, wherein said cover is made of transparent material.

10. The IC chip package as claimed in claim 1, wherein said cover has a through hole aimed at said chip, and at least one lens respectively sealed in the through hole.

11. The IC chip package as claimed in claim 1, wherein said cover comprises a screw hole extended through the top and bottom sides thereof corresponding in location to said chip, and a lens unit mounted in said screw hole, said lens unit comprising a barrel threaded into said screw hole and at least one lens sealed in said barrel.

12. The IC chip package as claimed in claim 1, wherein said substrate is made of the materials selected from the group consisting of reinforced plastics, glass fibers, and ceramics.

13. The IC chip package as claimed in claim 1, wherein said adhesive means is selected form the group consisting of silicones, epoxies, acrylics, polyamides, and glass.

14. The IC chip package as claimed in claim 1, wherein said adhesive means is a double-sided adhesive tape.

15. The IC chip package as claimed in claim 1, wherein said substrate further comprises a plurality of electronic elements mounted on the top side thereof and electrically connected to the conductive pads at the top side of said substrate.

16. The IC chip package as claimed in claim 1 further comprising a connecting device adapted to electrically connect the conductive pads of said substrate to an external object outside said substrate.

17. The IC chip package as claimed in claim 16, wherein said connecting device comprises a plurality of plated through holes disposed in the periphery of said substrate and adapted to connect the conductive pads at the top side of said substrate to the bottom side of said substrate.

18. The IC chip package as claimed in claim 16, wherein said connecting device comprises a plurality of plated through holes electrically connected between the conductive pads at the top side of said substrate and the bottom side of said substrate, and a plurality of solder balls provided at the bottom side of said substrate and respectively electrically connected to the through holes of said connecting device.

19. The IC chip package as claimed in claim 16, wherein said connecting device comprises a plurality of metal leads, said metal leads each having one end electrically connected to the conductive pads at the top side of said substrate and an opposite end extended to the outside of said substrate and bent into a predetermined shape.