×

Hermetically sealed semiconductor power module and large scale module comprising the same

  • US 6,967,402 B2
  • Filed: 02/19/2004
  • Issued: 11/22/2005
  • Est. Priority Date: 05/15/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A large scale module comprising:

  • (a) a heat sink;

    (b) a metallic frame having a plurality of openings disposed on said heat sink;

    (c) a plurality of semiconductor power modules disposed on said heat sink so as to be mounted in said openings;

    (d) a plurality of sealing members disposed between said respective semiconductor power modules and said metallic frame;

    (e) a plastic cover for covering one surface of said metallic frame on which said semiconductor power module is mounted; and

    (f) a resin filled into said cover.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×