Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
First Claim
1. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
- a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarazing medium to condition the planarizing surface;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder.
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Abstract
A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.
56 Citations
232 Claims
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1. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarazing medium to condition the planarizing surface;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the drag force;
a sensor operatively coupled to the conditioning body to detect the force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the force sensor including a gauge positioned to measure movement of the piston relative to the cylinder. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An apparatus for monitoring conditioning of a planarizing medium used for chemical-mechanical planarization of a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface, the conditioning body generating a drag force generally parallel to the planarizing surface;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor being positioned to detect relative motion between the piston and the cylinder;
an actuator coupled to the conditioning body with a support assembly to control at least one of a generally normal force between the conditioning body and the planarizing medium and a position of the conditioning body relative to the planarizing medium;
a sensor coupled to the support assembly to detect the drag force; and
a feedback device coupled to the actuator to control activation of the actuator in response to a signal received from the force sensor. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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29. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein the support member includes a piston slidably received in a cylinder;
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, the method comprising:
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coupling a sensor to a conditioning body, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, and the support member includes a piston slidably received in a cylinder;
engaging the conditioning body with the planarizing medium and moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium while the conditioning body engages the planarizing medium; and
monitoring the conditioning body to detect a frictional force between the conditioning body and the planarizing medium, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (37)
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38. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:
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engaging a conditioning body with the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, and further wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion;
moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and
maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by adjusting a relative velocity between the conditioning body and the planarizing medium, wherein maintaining an approximately constant frictional force includes selecting a target frictional force, detecting a force between the upwardly extending portion and the laterally extending portion coupled to the conditioning body, and adjusting the relative velocity until the force is approximately equal to the target frictional force, and further wherein measuring a force transmitted to the support member includes detecting a force between the upwardly extending portion and the laterally extending portion with a force sensor. - View Dependent Claims (39, 40)
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41. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder sealable and slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a sealed gap between an end of the piston and the closed end of the cylinder, the sensor being positioned within the gap for measuring a change in pressure within the gap as the piston moves relative to the cylinder. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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52. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder sealably and slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, wherein the piston has a generally circular cross-sectional shape and the cylinder has an aperture with a generally circular cross-sectional shape for receiving the piston, and further wherein the piston and the cylinder define a sealed gap between an end of the piston and the closed end of the cylinder, the sensor being positioned within the gap for measuring a change in pressure within the gap as the piston move relative to the cylinder. - View Dependent Claims (53, 54, 55, 56, 57, 58, 59, 60)
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61. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder sealably and slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a sealed gap between an end of the piston and the closed end of the cylinder, wherein the piston has a generally rectangular cross-sectional shape and the cylinder has an aperture with a generally rectangular cross-sectional shape for receiving the piston, and further wherein the sensor being positioned within the gap for measuring a change in pressure within the gap as the piston moves relative to the cylinder. - View Dependent Claims (62, 63, 64, 65, 66, 67, 68, 69)
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70. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (71, 72, 73, 74, 75, 76, 77, 78, 79)
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80. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, wherein the piston is sealably engaged with the cylinder and further wherein the sensor includes a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91)
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92. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder; and
a biasing member coupled to the cylinder and the piston to bias the piston toward or away from the cylinder. - View Dependent Claims (93, 94, 95, 96, 97, 98, 99, 100, 101, 102)
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103. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder, wherein the gauge includes a pointer on one of the piston and the cylinder and a scale on the other of the piston and the cylinder, the pointer being aligned with the scale and movable relative to the scale to indicate relative movement between the piston and the cylinder. - View Dependent Claims (104, 105, 106, 107, 108, 109, 110, 111, 112, 113)
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114. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder; and
a sensor operatively coupled to the conditioning body to detect the force;
the sensor including a gauge positioned to measure movement of the piston relative to the cylinder. - View Dependent Claims (115, 116, 117, 118, 119, 120, 121, 122, 123, 124)
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125. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, wherein the piston is sealable engaged with the cylinder; and
a sensor operatively coupled to the conditioning body to detect the force, the sensor including a gauge positioned to measure movement of the piston relative to the cylinder. - View Dependent Claims (126, 127, 128, 129, 130, 131, 132, 133, 134)
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135. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder;
a biasing member coupled to the cylinder and the piston to bias the piston toward or away from the cylinder; and
a sensor operatively coupled to the conditioning body to detect the force, the sensor including a gauge positioned to measure movement of the piston relative to the cylinder. - View Dependent Claims (136, 137, 138, 139, 140, 141, 142, 143, 144)
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145. An apparatus for monitoring conditioning of a planarizing medium used for chemical-mechanical planarization of a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface, the conditioning body generating a drag force generally parallel to the planarizing surface;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, wherein the piston is sealably engaged with the cylinder;
an actuator coupled to the conditioning body with a support assembly to control at least one of a generally normal force between the conditioning body and the planarizing medium and a position of the conditioning body relative to the planarizing medium;
a sensor coupled to the support assembly to detect the drag force, the sensor including a pressure gauge positioned within the gap to detect a change in pressure in the gap when one of the piston and the cylinder moves relative to the other, the sensor is positioned to detect relative motion between the piston and the cylinder; and
a feedback device coupled to the actuator to control activation of the actuator in response to a signal received from the force sensor. - View Dependent Claims (146, 147, 148, 149, 150, 151, 152)
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153. An apparatus for monitoring conditioning of a planarizing medium used for chemical-mechanical planarization of a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface, the conditioning body generating a drag force generally parallel to the planarizing surface;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder defining a gap between an end of the piston and the closed end of the cylinder, an actuator coupled to the conditioning body with a support assembly to control at least one of a generally normal force between the conditioning body and the planarizing medium and a position of the conditioning body relative to the planarizing medium;
a sensor coupled to the support assembly to detect the drag force, the sensor being positioned to detect relative motion between the piston and the cylinder;
a feedback device coupled to the actuator to control activation of the actuator in response to a signal received from the force sensor; and
a biasing member coupled to the cylinder and the piston to bias the piston toward or away from the cylinder. - View Dependent Claims (154, 155, 156, 157, 158, 159, 160)
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161. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a piston slidably received in a cylinder; and
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (162, 163, 164, 165)
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166. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a piston slidably received in a cylinder;
biasing one of the piston and the cylinder toward or away from the other of the piston and the cylinder; and
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (167, 168, 169)
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170. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a piston slidably and sealably received in a cylinder to form a sealed space between an end of the cylinder and an end of the piston; and
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a pressure within the sealed space. - View Dependent Claims (171, 172, 173, 174)
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175. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, the method comprising:
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coupling a sensor to a conditioning body, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, and further wherein the support member includes a piston slidably and sealably received in a cylinder to form a sealed space between an end of the cylinder and an end of the piston;
engaging the conditioning body with the planarizing medium and moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium while the conditioning body engages the planarizing medium; and
monitoring the conditioning body to detect a frictional force between the conditioning body and the planarizing medium, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a pressure within the sealed space. - View Dependent Claims (176)
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177. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:
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engaging a conditioning body with the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a piston slidably received in a cylinder;
moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and
maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by adjusting a relative velocity between the conditioning body and the planarizing medium, wherein maintaining an approximately constant frictional force includes selecting a target frictional force, detecting a force between the conditioning body and the planarizing medium and adjusting the relative velocity until the force is approximately equal to the target frictional force, wherein detecting the force includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (178)
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179. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably and sealably engaging the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder. - View Dependent Claims (180, 181, 182, 183, 184, 185, 186)
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187. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder; and
a biasing member coupled to the cylinder and the piston to bias the piston toward or away from the cylinder. - View Dependent Claims (188, 189, 190, 191, 192, 193, 194)
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195. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the frictional force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the sensor including a gauge positioned to measure movement of the one of the piston and the cylinder relative to the other of the piston and the cylinder, wherein the gauge includes a pointer on one of the piston and the cylinder and a scale on the other of the piston and the cylinder, the pointer being aligned with the scale and movable relative to the scale to indicate relative movement between the piston and the cylinder. - View Dependent Claims (196, 197, 198, 199, 200, 201)
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202. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the drag force;
a sensor operatively coupled to the conditioning body to detect the force;
a piston; and
a cylinder having an open end and a closed end, the cylinder slidably and sealably engaging the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the force sensor including a gauge positioned to measure movement of the piston relative to the cylinder. - View Dependent Claims (203, 204, 205, 206, 207, 208, 209, 210)
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211. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:
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a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;
a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;
a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;
a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the drag force;
a sensor operatively coupled to the conditioning body to detect the force;
a piston;
a cylinder having an open end and a closed end, the cylinder slidably receiving the piston, at least one of the piston and the cylinder being coupled to the conditioning body to slide relative to the other of the piston and the cylinder under the influence of the force on the conditioning body, the piston and the cylinder defining a gap between an end of the piston and the closed end of the cylinder, the force sensor including a gauge positioned to measure movement of the piston relative to the cylinder; and
a biasing member coupled to the cylinder and the piston to bias the piston toward or away from the cylinder. - View Dependent Claims (212, 213, 214, 215, 216, 217, 218, 219)
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220. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein the support member includes a piston slidably received in a cylinder;
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a movement of one of the piston and the cylinder relative to the other of the piston and the cylinder; and
biasing one of the piston and the cylinder toward or away from the other of the piston and the cylinder. - View Dependent Claims (221, 222, 223, 224, 225)
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226. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:
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moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, the support member including a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, wherein the support member includes a piston slidably and sealably received in a cylinder to form a sealed space between an end of the cylinder and an end of the piston; and
monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body by detecting a pressure within the sealed space. - View Dependent Claims (227, 228, 229, 230, 231, 232)
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Specification