Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies

• US 6,969,309 B2
• Filed: 03/29/2004
• Issued: 11/29/2005
• Est. Priority Date: 09/01/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Carpenter, Craig M.
• Primary Examiner(s): Shakeri, Hadi
• Application Number:
  US10/812,804
• Publication Number:
  US 20040192177A1
• Time in Patent Office: 610 Days
• Field of Search: 451285-289, 451/303, 451/307, 451/41, 451/490
• US Class Current: 451/285
• CPC Class Codes: B24B 13/012 conformable in shape to the optical surface, e.g. by fluid pressure acting on an elastic membrane
• CPC Class Codes: B24B 37/12 Lapping plates for working plane surfaces
• CPC Class Codes: B24B 37/20 Lapping pads for working plane surfaces
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24D 9/08 Circular back-plates for carrying flexible material

Abstract

Planarizing machines for chemical-mechanical planarization of microelectronic substrate assemblies are disclosed. The planarizing machines for processing microelectronic substrate assemblies generally include a table, a pad support assembly either positioned on or in the table, and a planarizing medium coupled to the pad support assembly. The pad support assembly includes a fluid container and an elastic membrane coupled to the fluid container. The fluid container generally is a basin that is either a separate component that is attached to the table, or a depression in the table itself. The fluid container can also be a bladder attached to the table. The fluid chamber is filled with support fluid to support the elastic membrane over the fluid chamber.

Claims

1. A planarizing machine for processing microelectronic substrate assemblies, comprising:

a table;

a fluid container removably attached to the table, the fluid container is a bladder having a bottom section attached to the table, a sidewall projecting from the bottom section, and an elastic membrane, the elastic membrane being a top portion of the bladder integral with the sidewall, the bottom section and the sidewall having thicknesses greater than a thickness of the elastic membrane to define an at least semi-rigid support for the elastic membrane;

the bottom section, the sidewall, and the elastic membrane defining an enclosed fluid chamber in the bladder.

2. The planarizing machine of claim 1 wherein the elastic membrane of the bladder is a rubber sheet.

3. The planarizing machine of claim 2, further comprising a support fluid in the fluid chamber to support the elastic membrane.

4. The planarizing machine of claim 3 wherein the support fluid comprises liquid water.

5. The planarizing machine of claim 3 wherein the support fluid comprises glycerin.

6. The planarizing machine of claim 3 wherein the support fluid comprises air.

7. The planarizing machine of claim 1 wherein the bladder comprises a uniformly resilient elastomeric material.

8. The planarizing machine of claim 1 wherein the elastic membrane is a non-perforated elastic membrane.

9. A planarizing machine for planarizing microelectronic substrates, comprising:

a table;

a fluid container removably attached to the table, the fluid container comprising a bladder including a bottom section having a first thickness attached to the table and a sidewall having a second thickness projecting from the bottom section, and an elastic membrane, the elastic membrane having a thickness less than the first thickness and the second thickness;

the bottom section and the sidewall defining an at least semi-rigid support for the membrane;

the elastic membrane being attached to the sidewall to define a fluid chamber in the bladder in a space between the bottom section and the elastic membrane.

10. The planarizing machine of claim 9, further comprising a support fluid in the fluid chamber, wherein the support fluid comprises liquid water.

11. The planarizing machine of claim 9, further comprising a support fluid in the fluid chamber, wherein the support fluid comprises glycerin.

12. The planarizing machine of claim 9, further comprising a support fluid in the fluid chamber, wherein the support fluid comprises air.

13. The planarizing machine of claim 9 wherein the bladder comprises a resilient elastomeric material.

14. The planarizing machine of claim 9 wherein the elastic membrane is a non-perforated elastic membrane.

15. A planarizing apparatus for use in a planarizing machine for microelectronic devices, comprising:

a pad support assembly having a bottom section of a first thickness, the bottom section configured to be attached to a table of the planarizing machine, a sidewall having a second thickness projecting from the bottom section, an elastic membrane having a thickness less than the first thickness and the second thickness;

the bottom section and the sidewall defining an at least semi-rigid support for the membrane;

the elastic membrane being coupled to the sidewall to define an enclosed fluid chamber, the bottom section, the sidewall and the elastic membrane being an integral component defining a bladder;

a support fluid in the fluid chamber; and

a planarizing medium coupled to the elastic membrane, the planarizing medium and the elastic membrane configured to flex in a local flex zone under a substrate pressed against the planarizing medium to provide at least a substantially uniform pressure distribution across the substrate.

16. The planarizing apparatus of claim 15 wherein the support fluid comprises water.

17. The planarizing apparatus of claim 15 wherein the support fluid comprises glycerin.

18. The planarizing apparatus of claim 15 wherein the support fluid comprises air.

19. The planarizing machine of claim 15 wherein the pad support assembly comprises a elastomeric material.

20. The planarizing machine of claim 15 wherein the elastic membrane is a non-perforated elastic membrane.