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Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies

  • US 6,969,309 B2
  • Filed: 03/29/2004
  • Issued: 11/29/2005
  • Est. Priority Date: 09/01/1998
  • Status: Expired due to Fees
First Claim
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1. A planarizing machine for processing microelectronic substrate assemblies, comprising:

  • a table;

    a fluid container removably attached to the table, the fluid container is a bladder having a bottom section attached to the table, a sidewall projecting from the bottom section, and an elastic membrane, the elastic membrane being a top portion of the bladder integral with the sidewall, the bottom section and the sidewall having thicknesses greater than a thickness of the elastic membrane to define an at least semi-rigid support for the elastic membrane;

    the bottom section, the sidewall, and the elastic membrane defining an enclosed fluid chamber in the bladder.

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