Anisotropically conductive connector, its manufacture method and probe member

• US 6,969,622 B1
• Filed: 02/06/2002
• Issued: 11/29/2005
• Est. Priority Date: 02/09/2001
• Status: Expired due to Term

• Current Assignee: ISC Incorporated (Svenska Cellulosa AB)
• Original Assignee: JSR Corporation
• Inventors: Kokubo, Terukazu, Inoue, Kazuo, Naoi, Masaya, Seno, Koji
• Primary Examiner(s): Nguyen, Tuan H.
• Application Number:
  US10/470,746
• Time in Patent Office: 1,392 Days
• Field of Search: 438/14, 438/15, 438/17, 438/18, 324/754, 324/761, 324/755
• US Class Current: 438/14
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 43/007 for elastomeric connecting elements

Abstract

An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

Claims

1. An anisotropically conductive connector comprising:

a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof; and

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

2. The anisotropically conductive connector according to claim 1, wherein the whole of the frame plate is formed by a magnetic substance having a saturation magnetization of at least 0.1 Wb/m².

3. The anisotropically conductive connector according to claim 2, wherein positioning holes each extending through in the thickness-wise direction of the frame plate are formed in the frame plate.

4. The anisotropically conductive connector according to claim 3, wherein air circulating holes each extending through in the thickness-wise direction of the frame plate are formed in the frame plate.

5. The anisotropically conductive connector according to claim 4, wherein the coefficient of linear thermal expansion of the frame plate is at most 3×

10<sup>−

5</sup>/K.

6. A probe member comprising:

a circuit board for inspection, on the surface of which inspection electrodes are formed in accordance with a pattern corresponding to a pattern of electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and

the anisotropically conductive connector according to claim 3 arranged on the surface of the circuit board for inspection;

wherein said probe member is suitable for use in conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

7. The probe member according to claim 6, wherein the coefficient of linear thermal expansion of the frame plate is at most 3×

10<sup>−

5</sup>/K, and the coefficient of linear thermal expansion of a base material making up the circuit board for inspection is at most 3×

10<sup>−

5</sup>/K.

8. The probe member according to claim 7, wherein a sheet-like connector is arranged on the anisotropically conductive connector, the sheet-like connector comprising an insulating sheet and a plurality of electrode structures each extending in a thickness-wise direction of the insulating sheet and arranged in accordance with a pattern corresponding to the pattern of the electrodes to be inspected.

9. An inspection apparatus, comprising:

the probe member according to claim 8,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

10. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 8.

11. An inspection apparatus, comprising:

the probe member according to claim 7,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

12. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 7.

13. The probe member according to claim 6, wherein a sheet-like connector is arranged on the anisotropically conductive connector, the sheet-like connector comprising an insulating sheet and a plurality of electrode structures each extending in a thickness-wise direction of the insulating sheet and arranged in accordance with a pattern corresponding to the pattern of the electrodes to be inspected.

14. An inspection apparatus, comprising:

the probe member according to claim 13,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

15. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 13.

16. An inspection apparatus, comprising:

the probe member according to claim 6,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

17. An inspection method for a wafer, comprising:

conducting an electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 6.

18. The anisotropically conductive connector according to claim 1, wherein conductive parts for non-connection that are not electrically connected to any electrode to be inspected of the integrated circuits in the wafer as the object for inspection and extend in the thickness-wise direction are formed in the functional part of each of the elastic anisotropically conductive films in addition to the conductive parts for connection, and the conductive parts for non-connection contain the conductive particles exhibiting magnetism at high density and are insulated from the conductive parts for connection by the insulating part.

19. A probe member comprising:

a circuit board for inspection, on the surface of which inspection electrodes are formed in accordance with a pattern corresponding to a pattern of electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and

the anisotropically conductive connector according to claim 18 arranged on the surface of the circuit board for inspection;

wherein said probe member is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

20. The probe member according to claim 19, wherein the coefficient of linear thermal expansion of the frame plate is at most 3×

10<sup>−

5</sup>/K, and the coefficient of linear thermal expansion of a base material making up the circuit board for inspection is at most 3×

10<sup>−

5</sup>/K.

21. The probe member according to claim 20, wherein a sheet-like connector is arranged on the anisotropically conductive connector, the sheet-like connector comprising an insulating sheet and a plurality of electrode structures each extending in a thickness-wise direction of the insulating sheet and arranged in accordance with a pattern corresponding to the pattern of the electrodes to be inspected.

22. An inspection apparatus, comprising:

the probe member according to claim 21, wherein the electrical connection to the integrated circuit formed on the wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

23. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 21.

24. An inspection apparatus, comprising:

the probe member according to claim 20,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

25. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 20.

26. The probe member according to claim 19, wherein a sheet-like connector is arranged on the anisotropically conductive connector, the sheet-like connector comprising an insulating sheet and a plurality of electrode structures each extending in a thickness-wise direction of the insulating sheet and arranged in accordance with a pattern corresponding to the pattern of the electrodes to be inspected.

27. An inspection apparatus, comprising:

the probe member according to claim 26,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

28. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 26.

29. An inspection apparatus, comprising:

the probe member according to claim 19,

wherein an electrical connection to an integrated circuit formed on a wafer as an object for inspection is achieved through the probe member;

wherein said inspection apparatus is suitable for performing electrical inspection of each of a plurality of integrated circuits formed on the wafer.

30. An inspection method for a wafer, comprising:

carrying out an electrical inspection of each of a plurality of integrated circuits formed on a wafer so that each of the integrated circuits formed on the wafer is electrically connected to a tester through the probe member according to claim 19.

31. A burn-in test, comprising:

fixing an integrated circuit board to an anisotropically conductive connector; and

inspecting the integrated circuit board at an elevated temperature;

wherein said anisotropically conductive connector comprises;

a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof;

wherein the coefficient of linear thermal expansion of the frame plate is at most 3×

10<sup>−

5</sup>/K; and

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

32. A probe member comprising:

a circuit board for inspection, on the surface of which inspection electrodes are formed in accordance with a pattern corresponding to a pattern of electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and

the anisotropically conductive connector according to claim 31 arranged on the surface of the circuit board for inspection;

wherein said probe member is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer.

33. The burn-in-test according to claim 31, wherein said elevated temperature is at least 120°

C.

34. A process for producing an anisotropically conductive connector, comprising:

providing a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as the object for inspection have been formed,

forming molding material layers for elastic anisotropically conductive films in which conductive particles exhibiting magnetism are dispersed in a liquid polymer-forming material, which will become an elastic polymeric substance by a curing treatment, in the respective anisotropically conductive film-arranging holes of the frame plate and at inner peripheries thereabout, and

applying to the molding material layers a magnetic field having higher intensity at portions to become conductive parts for connection and portions to become supported parts than the other portions, thereby gathering the conductive particles in the molding material layers at the portions to become the conductive parts for connection in a state that at least the conductive particles existing in the portions to become the supported parts in the molding material layer are retained in these portions, and orienting conductive particles in the thickness-wise direction, and in this state, subjecting the molding material layers to a curing treatment to form the elastic anisotropically conductive films;

thereby obtaining said anisotropically conductive connector, comprising

the frame plate in which the plurality of anisotropically conductive film-arranging holes each extending in the thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and the plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof; and

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

35. The process according to claim 34, wherein the molding material layers are formed in the respective anisotropically conductive film-arranging holes of the frame plate and at inner peripheries thereabout by:

providing a mold comprising a top force and a bottom force, on which ferromagnetic substance layers have been respectively formed in accordance with a pattern corresponding to a pattern of the conductive parts for connection in the elastic anisotropically conductive films to be formed,

coating molding surfaces of one or both of the top force and bottom force of the mold by screen printing with a molding material in which the conductive particles exhibiting magnetism are dispersed in the liquid polymer-forming material, which will become the elastic polymeric substance by the curing treatment, and superimposing the top force and bottom force on each other through the frame plate.

36. A process for producing an anisotropically conductive connector, comprising:

providing a frame plate in which a plurality of the anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as the object for inspection have been formed,

arranging a spacer, in which through-holes each having a shape conforming to the plane shape of each elastic anisotropically conductive film to be formed and extending in the thickness-wise direction of the frame plate are formed corresponding to the said elastic anisotropically conductive films, on one surface or both surfaces of the frame plate, and forming molding material layers for elastic anisotropically conductive films in which the conductive particles exhibiting magnetism are dispersed in a liquid polymer-forming material, which will become an elastic polymeric substance by a curing treatment, in the anisotropically conductive film-arranging holes of the frame plate and the through-holes of the spacer, and

applying to the molding material layers a magnetic field having higher intensity at portions to become conductive parts for connection and portions to become supported parts than the other portions, thereby gathering the conductive particles in the molding material layers at the portions to become the conductive parts for connection in a state that at least the conductive particles existing in the portions to become the supported parts in the molding material layer are retained in these portions, and orienting the conductive particles in the thickness-wise direction, and in this state, subjecting the molding material layers to a curing treatment to form the elastic anisotropically conductive films;

thereby obtaining said anisotropically conductive connector, comprising

the frame plate in which the plurality of anisotropically conductive film-arranging holes each extending in the thickness-wise direction of the frame plate are formed corresponding to the electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and the plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof; and

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer.

37. The process according to claim 36, wherein the molding material layers are formed in the anisotropically conductive film-arranging holes of the frame plate and the through-holes of the spacer by:

providing a mold comprising a top force and a bottom force, on which ferromagnetic substance layers have been respectively formed in accordance with a pattern corresponding to a pattern of the conductive parts for connection in the elastic anisotropically conductive films to be formed,

coating molding surfaces of one or both of the top force and bottom force of the mold by screen printing with a molding material in which the conductive particles exhibiting magnetism are dispersed in a liquid polymer-forming material, which will become the elastic polymeric substance by the curing treatment, and

superimposing the top force and bottom force on each other through the frame plate and the spacer arranged on one surface or both surfaces of the frame plate.

38. A process for producing an anisotropically conductive connector, which comprises:

providing a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which electrodes to be inspected of the integrated circuits in a wafer as an object for inspection have been formed,

forming molding material layers for elastic anisotropically conductive films in which the conductive particles exhibiting magnetism are dispersed in a liquid polymer-forming material, which will become an elastic polymeric substance by a curing treatment, in the respective anisotropically conductive film-arranging holes of the frame plate and at inner peripheries thereabout,

applying to the molding material layers a magnetic field having higher intensity at portions to become conductive parts for connection, portions to become conductive parts for non-connection and portions to become supported parts than the other portions, thereby gathering the conductive particles in the molding material layers at the portions to become the conductive parts for connection and the portions to become the conductive parts for non-connection in a state that at least the conductive particles existing in the portions to become the supported parts in the molding material layer are retained in these portions, and orienting the conductive particles in the thickness-wise direction, and in this state, subjecting the molding material layers to a curing treatment to form the elastic anisotropically conductive films;

thereby obtaining an anisotropically conductive connector, comprising

the frame plate in which the plurality of anisotropically conductive film-arranging holes each extending in the thickness-wise direction of the frame plate are formed corresponding to the electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and the plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof;

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer; and

wherein conductive parts for non-connection that are not electrically connected to any electrode to be inspected of the integrated circuits in the wafer as the object for inspection and extend in the thickness-wise direction are formed in the functional part of each of the elastic anisotropically conductive films in addition to the conductive parts for connection, and the conductive parts for non-connection contain the conductive particles exhibiting magnetism at high density and are insulated from the conductive parts for connection by the insulating part.

39. The process according to claim 38, wherein the molding material layers are formed in the respective anisotropically conductive film-arranging holes of the frame plate and at inner peripheries thereabout by:

providing a mold comprising a top force and a bottom force, on which ferromagnetic substance layers have been respectively formed in accordance with patterns corresponding to patterns of the conductive parts for connection and the conductive parts for non-connection in the elastic anisotropically conductive films to be formed, and

coating molding surfaces of one or both of the top force and bottom force of the mold by screen printing with a molding material in which the conductive particles exhibiting magnetism are dispersed in the liquid polymer-forming material, which will become the elastic polymeric substance by the curing treatment, and

superimposing the top force and bottom force on each other through the frame plate.

40. A process for producing an anisotropically conductive connector comprising:

providing a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which electrodes to be inspected of the integrated circuits in a wafer as the object for inspection have been formed,

arranging a spacer, in which through-holes each having a shape conforming to the plane shape of each elastic anisotropically conductive film to be formed and extending in the thickness-wise direction of the frame plate are formed corresponding to the said elastic anisotropically conductive films, on one surface or both surfaces of the frame plate, and forming molding material layers for elastic anisotropically conductive films in which the conductive particles exhibiting magnetism are dispersed in a liquid polymer-forming material, which will become an elastic polymeric substance by a curing treatment, in the anisotropically conductive film-arranging holes of the frame plate and the through-holes of the spacer, and

applying to the molding material layers a magnetic field having higher intensity at portions to become conductive parts for connection, portions to become conductive parts for non-connection and portions to become supported parts than the other portions, thereby gathering the conductive particles in the molding material layers at the portions to become the conductive parts for connection and the portions to become the conductive parts for non-connection in a state that at least the conductive particles existing in the portions to become the supported parts in the molding material layer are retained in these portions, and orienting the conductive particles in the thickness-wise direction, and in this state, subjecting the molding material layers to a curing treatment to form the elastic anisotropically conductive films;

thereby obtaining an anisotropically conductive connector, comprising

the frame plate in which the plurality of anisotropically conductive film-arranging holes each extending in the thickness-wise direction of the frame plate are formed corresponding to the electrode regions, in which the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and the plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole,

wherein each of the elastic anisotropically conductive films comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism,

wherein the frame plate has a saturation magnetization of at least 0.1 Wb/m² at least at the inner peripheral edges about the anisotropically conductive film-arranging holes thereof;

wherein said anisotropically conductive connector is suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer; and

wherein conductive parts for non-connection that are not electrically connected to any electrode to be inspected of the integrated circuits in the wafer as the object for inspection and extend in the thickness-wise direction are formed in the functional part of each of the elastic anisotropically conductive films in addition to the conductive parts for connection, and the conductive parts for non-connection contain the conductive particles exhibiting magnetism at high density and are insulated from the conductive parts for connection by the insulating part.

41. The process according to claim 40, wherein the molding material layers are formed in the anisotropically conductive film-arranging holes of the frame plate and the through-holes of the spacer by:

providing a mold comprising a top force and a bottom force, on which ferromagnetic substance layers have been respectively formed in accordance with patterns corresponding to patterns of the conductive parts for connection and the conductive parts for non-connection in the elastic anisotropically conductive films to be formed, and

coating molding surfaces of one or both of the top force and bottom force of the mold by screen printing in which a molding material in which the conductive particles exhibiting magnetism are dispersed in the liquid polymer-forming material, which will become the elastic polymeric substance by the curing treatment, and

superimposing the top force and bottom force on each other through the frame plate and the spacer arranged on one surface or both surfaces of the frame plate.