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Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

  • US 6,969,635 B2
  • Filed: 12/03/2001
  • Issued: 11/29/2005
  • Est. Priority Date: 12/07/2000
  • Status: Expired due to Term
First Claim
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1. A method for forming a MEMS device, comprising:

  • providing a first wafer;

    providing a second wafer;

    providing a sacrificial layer on or in the first or second wafer;

    forming a plurality of MEMS elements on the sacrificial layer;

    releasing the plurality of MEMS devices by etching away the sacrificial layer;

    mixing one or more spacer elements into an adhesive or providing one or more spacer elements separately from the adhesive for separating the wafers during and after bonding;

    applying the adhesive to one or both of the first and second wafers;

    bonding the first and second wafers together into a wafer assembly with the spacer elements therebetween so that the first and second wafers are held together in a spaced apart relationship as a wafer assembly;

    singulating the wafer assembly into individual dies; and

    applying a getter to one or both wafers before bonding the two wafers together into the wafer assembly.

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