Cooling structure for multichip module

• US 6,969,907 B2
• Filed: 10/03/2002
• Issued: 11/29/2005
• Est. Priority Date: 12/21/1999
• Status: Expired due to Term

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Kojima, Takashi, Ogawa, Naoki, Yamada, Yasushi, Imai, Makoto, Yagi, Yuji
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): Soward, Ida M.
• Application Number:
  US10/262,865
• Publication Number:
  US 20030025197A1
• Time in Patent Office: 1,153 Days
• Field of Search: 257712-713, 257/723, 257/685, 257/706, 257/717, 257/720, 257/796, 257/930, 257/E23.08, 257/E23.081, 257/E23.082, 257/E23.083, 257/E23.101, 257/E23.102
• US Class Current: 257/713
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: Y10S 257/93 Thermoelectric, e.g. peltier effect cooling

Abstract

A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.

Claims

1. A cooling structure for a multichip module having a plurality of electronic devices which generate different amounts of heat relative to each other, the cooling structure comprising:

a first member which forms a first face of the multichip module and which transmits heat generated by the electronic devices to the outside of the module; and

a second member which forms a second face of the multichip module that is different from the first face, which is in contact with the electronic devices and which does not contact the first member, and which has thermal conductivity,

wherein the plurality of electronic devices includes at least one low heat device comprising a diode and at least one high heat device selected from the group consisting of an insulated gate bipolar transistor, a metal-oxide semiconductor and a power transistor, and

heat generated from the high heat device flows to the first member through the low heat device and the second member.

2. A cooling structure according to claim 1, wherein the first member transmits heat generated by the electronic devices to a cooling medium.

3. A cooling structure according to claim 2, wherein the cooling medium includes air and water.

4. A cooling structure according to claim 1, wherein the second member has electrical conductivity and is electrically in contact with the electronic devices.

5. A cooling structure according to claim 2, wherein the second member comprises an insulating member and a wiring pattern which is electrically in contact with the electronic devices.

6. A cooling structure according to claim 1, further comprising a third member that supports the electronic devices, wherein a coefficient of thermal expansion of the second member and that of the third member are in a predetermined range at steady driving state of the multichip module.

7. A cooling structure according to claim 6, wherein the coefficient of thermal expansion of the second member is substantially the same as that of the third member.

8. A cooling structure according to claim 6, wherein the third member is a substrate on which the electric devices are arranged.

9. A cooling structure according to claim 1, wherein a coefficient of thermal expansion of the first member and that of the second member are in a predetermined range at steady driving state of the multichip module.

10. A cooling structure according to claim 4, further comprising a third member that supports the electronic devices, wherein a coefficient of thermal expansion of the second member and that of the third member are in a predetermined range at steady driving state of the multichip module.

11. A cooling structure according to claim 10, wherein the coefficient of thermal expansion of the second member is substantially the same as that of the third member.

12. A cooling structure according to claim 10, wherein the third member is a substrate on which the electric devices are arranged.

13. A cooling structure according to claim 4, wherein a coefficient of thermal expansion of the first member and that of the second member are in a predetermined range at steady driving state of e multichip module.

14. A cooling structure according to claim 13, further comprising a third member that supports the electronic devices, wherein a coefficient of thermal expansion of the second member and that of the third member are in a predetermined range at steady driving state of the multichip module.

15. A cooling structure according to claim 12, wherein the coefficient of thermal expansion of the second member is substantially the same as that of the third member.

16. A cooling structure according to claim 1, wherein the first and second members are so located to sandwich the electronic devices.

17. A cooling structure according to claim 2, wherein the second member has electrical conductivity and is electrically in contact with the electronic devices.

18. A cooling structure according to claim 2, wherein the second member comprises an insulating member and a wiring pattern which is electrically in contact with the electronic devices.

19. A cooling structure according to claim 14, wherein the third member is a substrate on which the electrical devices are arranged.