Heat sink system

• US 6,970,356 B2
• Filed: 07/09/2003
• Issued: 11/29/2005
• Est. Priority Date: 07/16/2002
• Status: Active Grant

• Current Assignee: Tseng Jyi Peng
• Original Assignee: Tseng Jyi Peng
• Inventors: Peng, Tseng Jyi
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/616,181
• Publication Number:
  US 20040070939A1
• Time in Patent Office: 874 Days
• Field of Search: 361600-605, 361/583, 361686-689, 361692-695, 361704-712, 361801-816, 361715-719, 165/80.2, 165/80.3, 165/80.4, 165/185, 174/15.1, 174/16.2, 174/252, 174/35.RG, 313/499, 313/500, 313/501, 313/503, 313/581, 313/583, 313/495, 313/512, 315/169.3, 315/169.4, 455/3.01, 455/3.02, 455/3.05, 455/73, 455/99, 455/128, 455/130, 455/78, 455/67.5, 455/82, 219/203, 219/209.05
• US Class Current: 361/695
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A heat sink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly consists of a thermal conducting substrate base with a top and bottom side. Radiating fins are attached to the bottom side of the base. The fins are cooled by external air. The component on the circuit board is connected to the top surface of the heat sink base by means of thermal conducting spacers which create a gap between the bottom surface of the circuit board and the top surface of the heat sink base. A first hole is placed in the heat sink base and driving means are attached to the said base at the area of the first hole. A rotating fan is operatively attached to the said driving means in such a manner that when the fan rotates air is forced between the gap created between the circuit board and the heat sink base. A second hole is installed in the heat sink base. The air flowing from the fan is exhausted through the said second hole. A shield, preferably constructed of RF absorbing materials, is attached to the heat sink base in such a manner as to enclose the circuit board and channel airflow around the spacers.

Claims

1. A heat sink system comprising:

a circuit board having a top surface and a bottom surface;

a component to be cooled which is mounted on the top surface of said circuit board;

a substrate base made from a thermal conducting material and containing a top surface and a bottom surface with a first opening extending from said top surface through the base to said bottom surface of the base and a second opening from said top surface through the base to said bottom surface of the base;

a thermal conducting spacer of predetermined dimensions with a proximal and distal end, the proximal end being connected to said component at the bottom surface of said circuit board and the distal end being connected to the top surface of said substrate base;

a plurality of fins vertically projecting from the bottom surface of the said substrate base;

driving means at least a part of which is installed in said first opening of the substrate base and which is at least partially supported by the said substrate base;

a fan rotated by said driving means whereby air is drawn by the fan through the first said opening in the substrate base and flows over the top surface of the base and exits through the second said opening of the substrate base.

2. A heat sink system comprising:

a circuit board having a top surface and a bottom surface;

a component to be cooled which is mounted on the top surface of said circuit board;

a substrate base made from a thermal conducting material and containing a top surface and a bottom surface with a first opening extending from said top surface through the base to said bottom surface of the base and a second opening from said top surface through the base to said bottom surface of the base;

a thermal conducting spacer of predetermined dimensions with a proximal and distal end, the proximal end being connected to said component at the bottom surface of said circuit board and the distal end being connected to the top surface of said substrate base;

a plurality of fins vertically projecting from the bottom surface of the said substrate base;

driving means at least a part of which is installed in said first opening of the substrate base and which is at least partially supported by the said substrate base;

a fan rotated by said driving means whereby air is drawn by the fan through the first said opening in the substrate base and flows over the top surface of the base and exits through the second said opening of the substrate base;

a shield with at least one side wall and a top wall disposed over said side wall said shield being disposed over the top surface of the printed circuit board.

3. The heat sink system of claim 2 where the shield is made out of radio frequency absorbing materials.

4. A heat sink system comprising:

a circuit board having a top surface and a bottom surface;

a component to be cooled which is mounted on the top surface of said circuit board;

a substrate base made from a thermal conducting material and containing a top surface and a bottom surface with a first opening extending from said top surface through the base to said bottom surface of the base and a second opening from said top surface through the base to said bottom surface of the base;

a thermal conducting spacer of predetermined dimensions with a proximal and distal end, the proximal end being connected to said component at the bottom surface of said circuit board and the distal end being connected to the top surface of said substrate base;

a plurality of fins vertically projecting from the bottom surface of the said substrate base;

driving means at least a part of which is installed in said first opening of the substrate base and which is at least partially supported by the said substrate base;

a fan rotated by said driving means whereby air is drawn by the fan through the first said opening in the substrate base and flows over the top surface of the base and exits through the second said opening of the substrate base;

a generally rectangular shaped shield with at least one side wall shield, the said printed circuit board being disposed over said shield.