Mold type semiconductor laser

• US 6,970,486 B2
• Filed: 05/17/2001
• Issued: 11/29/2005
• Est. Priority Date: 05/19/2000
• Status: Expired due to Term

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Nakata, Naotaro
• Primary Examiner(s): Harvey, Minsun Oh
• Assistant Examiner(s): Nguyen, Tuan N.
• Application Number:
  US09/858,508
• Publication Number:
  US 20020009112A1
• Time in Patent Office: 1,657 Days
• Field of Search: 372/34, 372/75, 372/51, 372/54, 372/59, 372/55, 372 43- 50, 372/36, 372/49, 349/42, 349/61, 362/31, 257/81, 136/244, 358/98, 369/110
• US Class Current: 372/36
• CPC Class Codes: H01S 5/0231 Stems
• CPC Class Codes: H01S 5/0232 Lead-frames
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/0683 by monitoring the optical output parameters

Abstract

A sub-mount (7) provided with a laser chip (8) and a light receiving element (5) for monitoring is bonded to a die pad portion (2a) of a first lead (2). An electrode of the laser chip and an electrode of the light receiving element are electrically connected to second leads (3, 4) by wires such as metallic wires, not shown, respectively. A resin frame (6) is provided to cover sides and a rear surface side of the sub-mount except for an emission surface side of the laser chip and to integrally hold one end portion sides of the first and second leads. An antireflection unit (9) for preventing light from being reflected on the light receiving element is formed on a portion of the resin frame opposite to the rear end face of the laser chip. As a result, it is possible to obtain a mold type semiconductor laser capable of constantly detect accurate laser chip output and capable of forming an accurate optical output control circuit.

Claims

1. A mold type semiconductor laser comprising:

a first lead having a die pad portion formed on one end;

a laser chip and a light receiving element for monitoring an output of said laser chip, mounted on the die pad portion;

second leads electrically connected to an electrode of said laser chip and an electrode of said light receiving element, respectively;

a resin frame covering sides and a rear end face side of said die pad portion except for an emission surface side of said laser chip, and integrally holding one end portion sides of said first and second leads; and

an antireflection means for preventing a light emitted from a rear end face of said laser chip from being reflected and incident on said light receiving element, said antireflection means being formed on a portion of said resin frame opposite to the rear end face of said laser chip with respect to said light receiving element,

wherein said antireflection means is formed by removing a portion of said resin frame opposite to the rear end face of said laser chip, so that the light emitted from the rear end face of said laser chip passes through the removed portion and goes rearward, and a light reflected by said resin frame is not incident on said light receiving element, such that said antireflection means is configured to prevent interference between the light incident on said light receiving element directly from the rear end face of said laser chip and a light reflected on said light receiving element.

2. A semiconductor laser according to claim 1, wherein said antireflection means is formed on said resin frame in a range of not less than ±

15°

in a horizontal direction from a light emission portion on the rear end face of said laser chip.

3. A mold type semiconductor laser comprising:

a first lead having a die pad portion formed on one end;

a laser chip and a light receiving element for monitoring an output of said laser chip, mounted on the die pad portion;

second leads electrically connected to an electrode of said laser chip and an electrode of said light receiving element, respectively;

a resin frame covering sides and a rear end face side of said die pad portion except for an emission surface side of said laser chip, and integrally holding one end portion sides of said first and second leads; and

an antireflection means for preventing a light emitted from a rear end face of said laser chip from being reflected and incident on said light receiving element, said antireflection means being formed on a portion of said resin frame opposite to the rear end face of said laser chip with respect to said light receiving element,

wherein said antireflection means is an irregular surface formed to allow the light to be irregularly reflected on the portion of said resin frame opposite to ihe rear end face of said laser chip so that a light reflected by said resin frame is not incident on said light receiving element, such that said antireflection means is configured to prevent interference between the light incident on said light receiving element directly from the rear end face of said laser chip and a light reflected on said light receiving element.

4. A semiconductor laser according to claim 3, wherein said antireflection means is a light absorber applied on the portion of said resin frame opposite to the rear end face of said laser chip.

5. A semiconductor laser according to claim 3, wherein said antireflection means is formed on said resin frame in a range of not less than ±

15°

in a horizontal direction from a light emission portion on the rear end face of said laser chip.

6. A mold type semiconductor laser comprising:

a first lead having a die pad portion formed on one end;

a laser chip and a light receiving element for monitoring an output of said laser chip, mounted on the die pad portion;

second leads electrically connected to an electrode of said laser chip and an electrode of said light receiving element, respectively;

a resin frame covering sides and a rear end face side of said die pad portion except for an emission surface side of said laser chip, and integrally holding one end portion sides of said first and second leads; and

an antireflection means for preventing a light emitted from a rear end face of said laser chip from being reflected and incident on said light receiving element, said antireflection means being formed on a portion of said resin frame opposite to the rear end face of said laser chip with respect to said light receiving element,

wherein said antireflection means is an inclined surface which has an angle of not less than 20° and

less than 90°

with respect to a vertical surface so that a light reflected by said resin frame is not incident on said light receiving element, such that said antireflection means is configured to prevent interference between the light incident on said light receiving element directly from the rear end face of said laser chip and a light reflected on said light receiving element.

7. A semiconductor laser according to claim 6, wherein said antireflection means is formed on said resin frame in a range of not less than ±

15°

in a horizontal direction from a light emission portion on the rear end face of said laser chip.