System and software for data collection and process control in semiconductor manufacturing and method thereof

• US 6,970,758 B1
• Filed: 07/12/2001
• Issued: 11/29/2005
• Est. Priority Date: 07/12/2001
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Richardson, David Alan, Patty, Richard Bruce, Likes, Donald Craig, Brown, Russell Clinton, Shi, Yurong
• Primary Examiner(s): Picard, Leo
• Assistant Examiner(s): KOSOWSKI, ALEXANDER J
• Application Number:
  US09/905,220
• Time in Patent Office: 1,601 Days
• Field of Search: 700/108, 700/121, 700/51
• US Class Current: 700/108
• CPC Class Codes: G05B 15/02 electric
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/32179 Quality control, monitor production tool with multiple sensors
• CPC Class Codes: G05B 2219/32233 Scheduling repair
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

In its various embodiments, the method collects data from process and metrology tools in a semiconductor manufacturing environment, generates statistics from that data, detects tool failures, processing errors, and other conditions that can jeopardize product output, and performs high level process control in the form of tool shutdowns, lot holds, and lot releases. One method as disclosed automates the collection and recording of data from process and metrology tools, automates configuration of data collection, and automates process equipment shut downs, all within the existing framework of existing MES systems and engineering data collection systems. Automation of configurations and data collection is conducted by creation of data collection plans, data collection capability specifications, and other versioned documents within a process control and data collection system as disclosed herein. These versioned documents may be generated through a common graphical user interface and presented via an Internet web browser or other network interface.

Claims

1. A method comprising:

entering semiconductor process parameters into a statistical process control system;

receiving a request from an equipment interface for a data collection plan; and

configuring the equipment interface, using the statistical process control system, to collect the semiconductor process parameters, wherein configuring includes providing the data collection plan to the equipment interface.

2. The method as in claim 1, wherein entering parameters includes referencing a data collection capability specification accessible to the statistical process control system.

3. The method as in claim 1, further including:

measuring a process parameter on a semiconductor wafer, the process parameter measured in accordance with the data collection plan; and

providing the process parameter to the statistical process control system through the equipment interface.

4. The method as in claim 3, wherein measuring includes providing a trigger to a metrology tool from a manufacturing execution system.

5. A method comprising:

establishing a data collection plan using a statistical process control system, the data collection plan identifying data to collect from a semiconductor tool;

receiving a request from an equipment interface to receive a data collection plan; and

providing the data collection plan to the equipment interface of the semiconductor tool through the statistical process control system in response to receiving the request from the equipment interface.

6. The method as in claim 5, wherein establishing includes referencing a data collection capability specification accessible to the statistical process control system.

7. The method as in claim 5, further including performing a measurement consistent with the data collection plan.

8. The method as in claim 7, wherein performing a measurement includes providing a trigger to a metrology tool from a manufacturing execution system.

9. The computer readable medium as in claim 7, wherein the instructions to collect measurement data are performed in response to a trigger provided to a metrology tool from a manufacturing execution system.

10. The computer readable medium as in claim 5, wherein the instructions to establish a data collection plan include referencing a data collection capability specification accessible to the statistical process control system.

11. The computer readable medium as in claim 5, wherein the program of instructions further includes instructions to collect measurement data consistent with the data collection plan.

12. A computer readable medium tangibly embodying a program of instructions, said program of instructions including instructions to:

establish a data collection plan using a statistical process control system, the data collection plan identifying data to collect from a semiconductor tool;

receive a request from an equipment interface to receive a data collection plan; and

provide the data collection plan to the equipment interface of the semiconductor tool through the statistical process control system.

13. A system comprising:

a user interface to;

receive a capability specification identifying a data collection capability of a semiconductor tool;

receive a data collection plan, the data collection plan used in conjunction with the capability specification to identify data to be collected from a semiconductor tool; and

receive a process control strategy;

a communications port to configure an equipment interface of a semiconductor tool to collect measurement data from the semiconductor tool;

a communications port to obtain measurement data from the equipment interface;

a data broker to;

receive the measurement data from the communications port; and

provide the measurement data to a statistical process client; and

a statistical process client to evaluate the measurement data in accordance with the process control strategy.

14. The system as in claim 13, further including a communications port to provide control signals to a manufacturing execution system.

15. The system as in claim 14, wherein the control signals are provided by the statistical process client in response to an evaluation of the measurement data.

16. The system as in claim 13, wherein the user interface is a graphical user interface.

17. The system as in claim 13, wherein the user interface is an Internet interface.

18. The system as in claim 13, further including a data history client, and wherein the data broker is further to provide the measurement data to the data history client.

19. The system as in claim 18, wherein the data history client is to provide the measurement data to a non-volatile storage medium.

20. A method comprising:

receiving, at a statistical process control system, a capability specification identifying a data collection capability of a semiconductor tool;

receiving a data collection plan at the statistical process control system, the data collection plan used in conjunction with the capability specification to identify data to be collected from a semiconductor tool;

configuring an equipment interface, using the statistical process control system, to collect measurement data from the semiconductor tool;

obtaining the measurement data from the semiconductor tool;

providing the measurement data to a statistical process client through a data broker, the statistical process client being part of the statistical process control system;

receiving a process control strategy at the statistical process control system; and

evaluating the measurement data in accordance with the process control strategy using the statistical process control client.

21. The method as in claim 20, further including verifying that the process control strategy is consistent with the data collection plan, wherein the verifying is performed using the statistical process control system.

22. The method as in claim 20, wherein configuring includes providing a data collection plan to the equipment interface.

23. The method as in claim 22, wherein the data collection plan is provided in response to a request from the equipment interface.

24. The method as in claim 20, wherein obtaining includes providing a trigger to the semiconductor tool from a manufacturing execution system.

25. The method as in claim 20, wherein the capability specification, the data collection plan and the process control strategy are received via a common user interface.

26. The method as in claim 25, wherein the user interface is a graphical user interface.

27. The method as in claim 20, wherein the user interface is an Internet interface.