Dental curing light

• US 6,971,875 B2
• Filed: 12/13/2001
• Issued: 12/06/2005
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/017,455
• Publication Number:
  US 20020168603A1
• Time in Patent Office: 1,454 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14

Abstract

A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A dental curing light comprising:

a wand adapted to be grasped by a human hand,

a battery power source located within said wand,

electronic control circuitry located within said wand,

a light module attached to said wand,

said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis,

a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a light emitting semiconductor device mounted thereon, and

a light emitting semiconductor device mounted on said mounting platform wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light directly emitted by the light emitting semiconductor device will be emitted forward from the light emitting semiconductor device at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.

2. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

3. A dental curing light as recited in claim 1 wherein said light emitting semiconductor device utilizes a driving current of not more than about 350 milliamps.

4. A dental curing light as recited in claim 1 further comprising at least one air vent on said wand.

5. A dental curing light as recited in claim 1 wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light emitted by the light emitting semiconductor device will be emitted generally orthogonal to said elongate heat sink longitudinal axis.

6. A dental curing light comprising:

a wand adapted to be grasped by a human hand,

a source of electrical power selected from the group consisting of a battery power source located within said wand and a wall outlet power adapter,

a light module attached to said wand,

said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, and elongate heat sink being adapted to draw heat away from a semiconductor located at said elongate heat sink distal end,

a mounting platform located at said elongate heat sink distal end,

a primary heat sink mounted to said mounting platform, and

a light emitting semiconductor device affixed to said primary heat sink;

wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light directly emitted by the light emitting semiconductor device will be emitted forward from the light emitting semiconductor device at an angle of from about 30 degrees to about 150 degrees to said elongate heat sink longitudinal axis.

7. A dental curing light as recited in claim 6 wherein said light emitting semiconductor device is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

8. A dental curing light as recited in claim 6 wherein said light emitting semiconductor device utilizes a driving current of not more than about 350 milliamps.

9. A dental curing light as recited in claim 6 further comprising at least one air vent on said wand.

10. A dental curing light as recited in claim 6 wherein said mounting platform is oriented so that when a light emitting semiconductor device is mounted on it, light emitted by the light emitting semiconductor device will be emitted generally orthogonal to said elongate heat sink longitudinal axis.

11. A dental curing light as recited in claim 6 further comprising a well in said primary heat sink, said light emitting semiconductor device being located in said well.

12. A dental curing light as recited in claim 11 wherein said well includes a light reflective coating on its interior.

13. A dental curing light as recited in claim 11 wherein said light emitting semiconductor device is affixed to said primary heat sink by use of heat conductive and light reflective adhesive.

14. A dental curing light as recited in claim 11 further comprising a cover over said light emitting semiconductor device.

15. A dental curing light as recited in claim 14 wherein said cover is selected from the group consisting of windows and focus lenses.

16. A dental curing light comprising:

a primary heat sink,

a light emitting semiconductor chip in heat conductance with said primary heat sink,

an elongate secondary heat sink to which said primary heat sink is affixed,

an elongate secondary heat sink longitudinal axis,

said primary heat sink being adapted to draw heat away from said light emitting semiconductor device, said elongate secondary heat sink being adapted to draw heat away from said primary heat sink and to dissipate said heat; and

wherein at least some of the light directly emitted by said light emitting semiconductor chip will be emitted forward from the light emitting semiconductor device so that it travels away from the curing light in a direction that forms an angular orientation in the range of from about 30 to 150 degrees with respect to said elongate heat sink longitudinal axis.

17. A dental curing light as recited in claim 16 wherein said primary heat sink has a well on it, and wherein said light emitting semiconductor is mounted in said well.

18. A dental curing light as recited in claim 17 wherein said well has a light-reflective surface.

19. A dental curing light comprising:

a wand designed to be grasped by a human hand,

controls for initiating and terminating light transmission by the dental curing light,

circuitry in electrical connection with said controls,

a light source, the light source including;

a light emitting semiconductor device,

a primary heat sink to which said light emitting semiconductor device is affixed,

an elongate secondary heat sink having a proximal end and a distal end and a longitudinal axis therebetween,

a mounting platform located at said secondary heat sink distal end, said primary heat sink being affixed to said mounting platform,

said primary heat sink being adapted to draw heat away from said light emitting semiconductor device, said elongate secondary heat sink being adapted to draw heat away from said primary heat sink and to dissipate said heat; and

wherein at least some of the light directly emitted by said light emitting semiconductor device will be emitted forward from the light emitting semiconductor device so that it travels away from the dental curing light in a direction that forms an angle with respect to said elongate secondary heat sink longitudinal axis in the range of from about 45 to about 135 degrees.

20. A dental curing light comprising:

an elongate heat sink, said elongate heat sink having a proximal end, a distal end and a longitudinal axis therebetween,

a primary heat sink mounted to said elongate heat sink,

a light emitting semiconductor device mounted to said primary heat sink; and

wherein at least some of the light directly emitted by said light emitting semiconductor device is emitted forward from the light emitting semiconductor device at angular orientation with respect to said elongate heat sink longitudinal axis that is in the range of from about 30 to about 150 degrees.

21. A dental curing light comprising:

an elongate heat sink, said elongate heat sink having a proximal end, a distal end and a longitudinal axis therebetween,

a light emitting semiconductor device mounted in a fixed position with respect to said primary elongate heat sink; and

a battery power unit in electrical conduction with said light emitting semiconductor device in order to power it and cause it to emit light;

wherein said light emitting semiconductor device directly emits at least some light that travels forward from the light emitting semiconductor device at an angle in the range of 30 to 150 degrees to said elongate heat sink longitudinal axis.