Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate of a first conductivity type;
a drift layer of a first conductivity type formed on a first main surface of the semiconductor substrate, a surface of the drift layer having a first area and a second area which is positioned on an outer periphery of the first area;
a cell portion which is formed in the first area of the drift layer and includes a first base layer of a second conductivity type selectively formed in a surface layer of the first area, a source layer of a first conductivity type selectively formed in a surface layer of the first base layer, a first metallic compound which is formed on the surface layer of the first base layer and a surface layer of the source layer in common, and a control electrode which is formed in the first base layer and the source layer via a first insulating film and has a second metallic compound formed on a top surface thereof;
a terminating portion which is formed in the second area of the drift layer, alleviates an electric field to maintain a breakdown voltage by extending a depletion layer, and includes a second base layer of a second conductivity type selectively formed in a surface layer in the second area of the drift layer, an impurity diffused layer of a second conductivity type formed in a surface layer of the second base layer, and a third metallic compound which is provided to a surface layer of the impurity diffused layer, an end surface thereof on the terminating portion side being positioned on the cell portion side away from an end surface of the impurity diffused layer on the terminating portion side;
a first main electrode formed so as to be in contact with the first metallic compound and the third metallic compound in common; and
a second main electrode formed on a second main surface opposite to the first main surface of the semiconductor substrate.
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Abstract
A semiconductor device including a drift layer of a first conductivity type formed on a surface of a semiconductor substrate. A surface of the drift layer has a second area positioned on an outer periphery of a first area. A cell portion formed in the first area includes a first base layer of a second conductivity type, a source layer and a control electrode formed in the first base layer and the source layer. The device also includes a terminating portion formed in the drift layer including a second base layer of a second conductivity type, an impurity diffused layer of a second conductivity type, and a metallic compound whose end surface on the terminating portion side is positioned on the cell portion side away from the end surface of the impurity diffused layer on the terminal portion side.
36 Citations
24 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate of a first conductivity type; a drift layer of a first conductivity type formed on a first main surface of the semiconductor substrate, a surface of the drift layer having a first area and a second area which is positioned on an outer periphery of the first area; a cell portion which is formed in the first area of the drift layer and includes a first base layer of a second conductivity type selectively formed in a surface layer of the first area, a source layer of a first conductivity type selectively formed in a surface layer of the first base layer, a first metallic compound which is formed on the surface layer of the first base layer and a surface layer of the source layer in common, and a control electrode which is formed in the first base layer and the source layer via a first insulating film and has a second metallic compound formed on a top surface thereof; a terminating portion which is formed in the second area of the drift layer, alleviates an electric field to maintain a breakdown voltage by extending a depletion layer, and includes a second base layer of a second conductivity type selectively formed in a surface layer in the second area of the drift layer, an impurity diffused layer of a second conductivity type formed in a surface layer of the second base layer, and a third metallic compound which is provided to a surface layer of the impurity diffused layer, an end surface thereof on the terminating portion side being positioned on the cell portion side away from an end surface of the impurity diffused layer on the terminating portion side; a first main electrode formed so as to be in contact with the first metallic compound and the third metallic compound in common; and a second main electrode formed on a second main surface opposite to the first main surface of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor device comprising:
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a semiconductor substrate of a first conductivity type; a drift layer of a first conductivity type formed on a first main surface of the semiconductor substrate and has a first area and a second area which is positioned on an outer periphery of the first area; a cell portion which is formed in the first area of the drift layer, and includes a first base layer of a second conductivity type selectively formed in a surface layer of the first area, a trench formed so as to extend from a surface of the first base layer to the inside of the drift layer, a first insulating film formed on a bottom surface and side surfaces of the trench, a source layer of a first conductivity type selectively formed in a surface layer of the first base layer so as to be in contact with the first insulating film, a first metallic compound formed on a surface of the first base layer and a surface of the source layer in common, and a control electrode which is formed so as to fill the trench via the first insulating film and has a second metallic compound formed on a top face thereof; a terminating portion which is formed in the second area of the drift layer and alleviates an electric field to maintain a breakdown voltage by extending a depletion layer, and includes a second base layer of a second conductivity type selectively formed in a surface layer in the second area of the drift layer, an impurity diffused layer of a second conductivity type formed in a surface layer of the second base layer, and a third metallic compound which is formed in a surface layer in the impurity diffused layer, an end surface thereof on the terminating portion side being positioned on the cell portion side away from an end surface of the impurity diffused layer on the terminating portion side; a first main electrode formed so as to be in contact with the first metallic compound and the third metallic compound in common; and a second main electrode formed on a second main surface opposite to the first main surface of the semiconductor substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification