Critical dimension analysis with simultaneous multiple angle of incidence measurements

• US 6,972,852 B2
• Filed: 10/26/2004
• Issued: 12/06/2005
• Est. Priority Date: 03/29/2000
• Status: Expired due to Term

• Current Assignee: The Therma-Wave Incorporated (KLA Corporation)
• Original Assignee: The Therma-Wave Incorporated (KLA Corporation)
• Inventors: Opsal, Jon, Rosencwaig, Allan
• Primary Examiner(s): Rosenberger, Richard A.
• Application Number:
  US10/973,703
• Publication Number:
  US 20050057760A1
• Time in Patent Office: 406 Days
• Field of Search: 356512-514, 356/601, 356/625, 356/636, 356/237.5, 356/73
• US Class Current: 356/625
• CPC Class Codes: G01B 11/02 for measuring length, width or thickness G01B11/08 takes precedence
• CPC Class Codes: G01B 11/024 by means of diode-array scanning
• CPC Class Codes: G01B 11/14 for measuring distance or clearance between spaced objects or spaced apertures G01B11/26 takes precedence; rangefinders G01C3/00
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Abstract

A method and apparatus are disclosed for evaluating relatively small periodic structures formed on semiconductor samples. In this approach, a light source generates a probe beam which is directed to the sample. In one preferred embodiment, an incoherent light source is used. A lens is used to focus the probe beam on the sample in a manner so that rays within the probe beam create a spread of angles of incidence. The size of the probe beam spot on the sample is larger than the spacing between the features of the periodic structure so some of the light is scattered from the structure. A detector is provided for monitoring the reflected and scattered light. The detector includes multiple detector elements arranged so that multiple output signals are generated simultaneously and correspond to multiple angles of incidence. The output signals are supplied to a processor which analyzes the signals according to a scattering model which permits evaluation of the geometry of the periodic structure. In one embodiment, the sample is scanned with respect to the probe beam and output signals are generated as a function of position of the probe beam spot.

Claims

1. An apparatus for evaluating the geometry of one or more geometrical features on the surface of a wafer having at least one dimension significantly less than a micron comprising:

a light for source for generating a probe beam;

an optical element for focusing the probe beam to a spot overlapping the feature on the wafer surface in a manner so that the rays within the probe beam create a spread of angles of incidence and so that the probe beam is diffracted upon reflection;

a detector array for monitoring the diffracted probe beam light, said detector array simultaneously generating a plurality of independent first output signals corresponding to a plurality of different angles of incidence;

a measurement module selected from one of a broadband reflectometer and a broadband ellipsometer, said measurement module for optically inspecting the feature and generating a plurality of second output signals; and

a processor for evaluating the geometry of the feature on the wafer based on a combination of the first and second output signals.

2. An apparatus as recited in claim 1, wherein the light source is a coherent.

3. An apparatus as recited in claim 2, wherein the light source is a laser.

4. An apparatus as recited in claim 3, further including a means for scanning the probe beam with respect to the wafer.

5. An apparatus as recited in claim 1, wherein the probe beam is focused to a spot size on the order of one micron in diameter.

6. An apparatus as recited in claim 2, wherein the optical element for focusing the beam is a microscope objective with a numerical aperture on the order of 0.9.

7. An apparatus as recited in claim 1, wherein light source is incoherent.

8. An apparatus as recited in claim 1, wherein the processor compares the first and second output signals to a predetermined set of output signals to determine if a process is within specified tolerances.

9. An apparatus as recited in claim 1, further including an analyzer and wherein the processor determines the change in polarization state of the rays within the probe beam to evaluate the geometry of the feature on the wafer.

10. An apparatus as recited in claim 1, wherein the optical element for focusing the probe beam is a lens.

11. An apparatus as recited in claim 1, wherein the probe beam is directed substantially normal to the wafer prior to being focused.

12. An apparatus as recited in claim 1, wherein the processor functions to generate a set of theoretical output signals based on a theoretical profile of the feature and wherein the theoretical output signals are compared with the actual first and second output signals and thereafter, the processor generates another set of theoretical output signals based on the comparison and using a different theoretical profile of the feature and wherein the comparison and generation steps are repeated until the differences between the theoretical output signals and the actual output signals are minimized.

13. An apparatus as recited in claim 1, wherein the processor compares the first and second output signals to a set of previously generated theoretical output signals to find the closest match and wherein each one of the set of previously generated output signals corresponds to a different possible geometry of the feature.

14. A method for evaluating the geometry of one or more geometrical features on the surface of a wafer having at least one dimension significantly less than a micron comprising the steps of:

focusing a probe beam of radiation to a spot overlapping the feature on the wafer surface in a manner so that the rays within the probe beam create a spread of angles of incidence and so that the probe beam is diffracted upon reflection;

monitoring the diffracted probe beam light and simultaneously generating a plurality of independent first output signals corresponding to a plurality of different angles of incidence;

measuring the feature using a measurement module selected from one of a broadband reflectometer and a broadband ellipsometer and generating a plurality of second output signals; and

evaluating the geometry of the feature on the wafer based on the first and second output signals.

15. A method as recited in claim 14, wherein the probe beam is formed from coherent radiation.

16. A method as recited in claim 14, wherein the probe beam is generated by a laser.

17. A method as recited in claim 14, further including the step of scanning the probe beam with respect to the wafer.

18. A method as recited in claim 14, wherein the probe beam is focused to a spot size on the order of one micron in diameter.

19. A method as recited in claim 14, wherein the probe beam is focused with a microscope objective having a numerical aperture on the order of 0.9.

20. A method as recited in claim 14, wherein the probe beam is formed from incoherent radiation.

21. A method as recited in claim 14, further including the step of comparing the first and second output signals to a predetermined set of output signals to determine if a process is within specified tolerances.

22. A method as recited in claim 14, further including the step of determining the change in polarization state of the rays within the probe beam to evaluate the geometry of the feature on the wafer.

23. A method as recited in claim 14, wherein the evaluation step includes generating a set of theoretical output signals based on a theoretical profile of the feature and wherein the theoretical output signals are compared with the actual first and second output signals and thereafter generating another set of theoretical output signals based on the comparison and using a different theoretical profile of the feature and wherein the comparison and generation steps are repeated until the differences between the theoretical output signals and the actual output signals are minimized.

24. A method as recited in claim 14, wherein evaluation step includes comparing the first and second output signals to a set of previously generated theoretical output signals to find the closest match and wherein each one of the set of previously generated output signals corresponds to a different possible geometry of the feature.