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Method for integrated high Q inductors in FCGBA packages

  • US 6,972,965 B2
  • Filed: 02/04/2003
  • Issued: 12/06/2005
  • Est. Priority Date: 02/04/2003
  • Status: Expired due to Fees
First Claim
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1. An inductor assembly, comprising:

  • a flip-chip, ball-grid array package substrate;

    a microelectronic die coupled to one or more bumps attached to an upper surface of the package substrate; and

    an on-package, off-die trace line coupled to the one or more bumps attached to the upper surface of the package substrate, wherein the trace line has an inherent self-inductance that is used in combination with on-die inductive components to achieve a predetermined frequency of resonance or other matching network of RF frequencies.

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