Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment

• US 6,972,966 B1
• Filed: 09/13/2000
• Issued: 12/06/2005
• Est. Priority Date: 09/14/1999
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Oishi, Eiji, Endo, Kogo
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Semenenko, Yuriy
• Application Number:
  US09/661,187
• Time in Patent Office: 1,910 Days
• Field of Search: 174/250, 174/254, 174/200, 361149-152, 361749-751, 361760-766, 361/803, 361/804, 349/150
• US Class Current: 361/803
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence

Abstract

A composite flexible wiring board comprises a first flexible wiring board and a second flexible wiring board on which a surface-mounted part is provided. The second flexible wiring board is disposed on the first flexible wiring board in its predetermined area. The first flexible wiring board and the second flexible wiring board are electrically connected to each other through an interlayer contact portion provided in a predetermined position. The first flexible wiring board has an input terminal region and an output terminal region with a power IC chip mounted on the first flexible wiring board.

Claims

1. An electro-optical device comprising:

a first substrate;

a second substrate opposite the first substrate, the second substrate having a projected portion that projects outward further than an edge of the first substrate;

an electro-optical material disposed between the first substrate and the second substrate;

a driver IC chip mounted on the projected portion of the second substrate using Chip On Glass technology;

a wiring junction region provided on the projected portion of the second substrate, the wiring junction region being electrically connected to the IC chip;

a first flexible wiring board mounted to the projected portion of the second substrate and in electrical connection with the wiring junction region;

a power IC chip mounted on the first flexible wiring board;

a second flexible wiring board disposed on the first flexible wiring board at a position inboard of the first flexible wiring board;

an interlayer contact portion that electrically connects the first flexible wiring board and the second flexible wiring board together; and

a surface-mounted component mounted on the second flexible wiring board.

2. The electro-optical device according to claim 1, wherein said first flexible wiring board has an input terminal region and an output terminal region.

3. The electro-optical device according to claim 1, wherein said surface-mounted component comprises at least one of a flat-packaged LSI, a resistor, a capacitor, an inductance, a diode, a transistor, a quartz oscillator, and a connector.

4. The electro-optical device according to claim 1, wherein said power IC chip is connected to a conductive layer through an anisotropic conductive film.

5. The electro-optical device according to claim 1, wherein said surface-mounted part is connected to an conductive layer through a solder layer.

6. The electro-optical device according to claim 1, wherein said interlayer contact portion comprises at least one of an anisotropic conductive film and solder.

7. The electro-optical device according to claim 1, further comprising a third flexible wiring board connected to said first flexible wiring board, said third flexible wiring board having an output terminal region.

8. The electro-optical device according to claim 1, wherein said electro-optical material includes an EL display panel having an electroluminescence structure formed on said second substrate.