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Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment

  • US 6,972,966 B1
  • Filed: 09/13/2000
  • Issued: 12/06/2005
  • Est. Priority Date: 09/14/1999
  • Status: Active Grant
First Claim
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1. An electro-optical device comprising:

  • a first substrate;

    a second substrate opposite the first substrate, the second substrate having a projected portion that projects outward further than an edge of the first substrate;

    an electro-optical material disposed between the first substrate and the second substrate;

    a driver IC chip mounted on the projected portion of the second substrate using Chip On Glass technology;

    a wiring junction region provided on the projected portion of the second substrate, the wiring junction region being electrically connected to the IC chip;

    a first flexible wiring board mounted to the projected portion of the second substrate and in electrical connection with the wiring junction region;

    a power IC chip mounted on the first flexible wiring board;

    a second flexible wiring board disposed on the first flexible wiring board at a position inboard of the first flexible wiring board;

    an interlayer contact portion that electrically connects the first flexible wiring board and the second flexible wiring board together; and

    a surface-mounted component mounted on the second flexible wiring board.

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