Temperature compensated strain sensing apparatus

• US 6,973,837 B2
• Filed: 05/21/2002
• Issued: 12/13/2005
• Est. Priority Date: 07/13/2001
• Status: Expired due to Fees

• Current Assignee: John D. Barnett
• Original Assignee: John D. Barnett
• Inventors: Barnett, John D.
• Primary Examiner(s): NOORI, MAX H
• Application Number:
  US10/483,916
• Publication Number:
  US 20040159161A1
• Time in Patent Office: 1,302 Days
• Field of Search: 737/65, 737/66
• US Class Current: 73/765
• CPC Class Codes: G01D 3/022 having an ideal characteristic, map or correction data stored in a digital memory
• CPC Class Codes: G01D 3/036 on measuring arrangements themselves
• CPC Class Codes: G01L 1/2256 involving digital counting
• CPC Class Codes: G01L 1/2281 for temperature variations
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: G01L 1/2293 of the semi-conductor type semi-conductor devices controllable by variations of applied mechanical force H01L29/84
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm
• CPC Class Codes: G01L 9/045 with electric temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A strain sensing apparatus for use in the presence of thermal gradients has a strain gauge and resistance temperature gauge in a planar assembly bonded to, deposited on or diffused or implanted in a substrate surface. The apparatus can sense strain and temperature independently and can be used alone or with a plurality of installations in strain gauge based transducers or experimental stress analysis. The output from the temperature gauge can be used accurately to compensate for unwanted thermal effects in the strain gauge and to measure temperature at the strain gauge site.

Claims

1. A strain sensing apparatus having:

a strain gauge having a layer to which a strain sensing area is bonded;

a temperature gauge having a layer to which a temperature sensing area is bonded, the temperature sensing area being in thermal contact with the strain sensing area; and

wherein one of the strain sensing area and the temperature sensing area overlies the other, the temperature gauge being directly bonded to the strain gauge.

2. A strain sensing apparatus according to claim 1 wherein the layer to which the strain sensing area is bonded and/or the layer to which the temperature sensing area is bonded is a dielectric material layer.

3. A strain sensing apparatus according to claim 1 wherein the strain sensing area and the temperature sensing area substantially match in size and are overlaid substantially to coincide.

4. A strain sensing apparatus according to claim 1 wherein the strain gauge has a strain sensing pattern and the temperature gauge has a temperature sensing pattern of substantially the same shape, the gauges being overlaid substantially to match the patterns.

5. A strain sensing apparatus according to claim 1 wherein the strain gauge has a strain sensing pattern and the temperature gauge has a temperature sensing pattern selected to complement the strain sensing pattern.

6. A strain sensing apparatus according to claim 5 wherein the temperature sensing pattern is selected so that, in use, when subjected to a predetermined non-zero strain or to a predetermined non-zero strain format, the temperature gauge has substantially zero net strain output.

7. A strain sensing apparatus according to claim 1 wherein the strain gauge is formed on a substrate by selective deposition.

8. A strain sensing apparatus according to claim 1 wherein the strain gauge is formed on or in a substrate by selective diffusion or implantation into the surface of the substrate.

9. A strain sensing apparatus according to claim 7 wherein the temperature gauge is formed before or after the strain gauge by selective deposition onto the substrate or strain gauge.

10. A strain sensing apparatus according to claim 8 wherein the temperature gauge is formed before or after the strain gauge by selective diffusion into the substrate or into a layer overlying the strain gauge.

11. A strain sensing apparatus according to claim 1 wherein the strain gauge is formed, at least in part, of a material comprising platinum and tungsten.

12. A strain sensing apparatus according to claim 1 wherein the strain gauge is formed, at least in part, of a material comprising silicon.

13. A strain sensing apparatus according to claim 1 wherein the temperature gauge is formed, at least in part, of a material comprising nickel or platinum.

14. A strain sensing apparatus according to claim 1, comprising

means for correcting the output from the strain gauge of said strain sensing apparatus using the output from the temperature gauge of said strain sensing apparatus.

15. A method of measuring strain using apparatus according to claim 1, wherein the output from the strain gauge is corrected to give a temperature-compensated strain output according to the output from the temperature gauge.

16. A method according to claim 15 wherein the strain is measured during a thermal transient applied to the strain sensing apparatus.

17. A strain sensing apparatus having:

a strain gauge comprising a layer having a strain resistor;

a temperature gauge comprising a layer having a temperature compensation resistor, the temperature compensation resistor being in thermal contact with the strain resistor; and

wherein one of the strain resistor and the temperature compensation resistor area overlies the other, the temperature gauge being directly bonded to the strain gauge.

18. The strain sensing apparatus of claim 17 wherein the strain resistor and the temperature compensation resistor substantially match in size and are overlaid substantially to coincide.

19. The strain sensing apparatus of claim 17 wherein the strain gauge has a strain sensing pattern and the temperature gauge has a temperature sensing pattern of substantially the same shape, and the strain gauge and temperature gauge are overlaid substantially to match the patterns.

20. The strain sensing apparatus of claim 17 wherein the strain gauge has a strain sensing pattern and the temperature gauge has a temperature sensing pattern selected to complement the strain sensing pattern.