Solder ball attaching system and method

• US 6,974,069 B2
• Filed: 06/20/2003
• Issued: 12/13/2005
• Est. Priority Date: 10/15/1999
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Yang, Hee-Sang, Kang, Ju-il
• Primary Examiner(s): Johnathan, Johnson
• Assistant Examiner(s): Tran, Len
• Application Number:
  US10/465,632
• Publication Number:
  US 20030213832A1
• Time in Patent Office: 907 Days
• Field of Search: 228/6.2, 228/8, 228/9, 228/10, 228/33, 228/49.5, 228/103, 228/105, 228/245, 228/246, 228/205, 228/207, 228/223
• US Class Current: 228/103
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/0623 for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: B23K 3/082 Flux dispensers; Apparatus for applying flux
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 3/3478 Applying solder preforms; Transferring prefabricated solder patterns

Abstract

The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Claims

1. A method for attaching solder balls of a ball grid array package, the method comprising:

a solder ball seating step of unloading base frames attaching base tapes on which solder ball pads are provided, coating the solder ball pads with flux, transferring identified solder balls on positions of the corresponding solder ball pads respectively, transferring the base frame after confirming the position of the solder balls on the solder ball pads, and transferring an empty container, from which all base frames are unloaded, in a designated position;

a solder ball reflow step of melting and cooling the solder balls seated on the solder ball pads and transferring the base frames after receiving the base frames from the solder ball seating step;

a cleaning step of removing the flux covered on the solder ball pads and transferring the base frames after receiving the base frames from the solder ball reflow step; and

a base frame storing step of determining quality of the base frames received from the cleaning step, sorting the base frames according to the quality and storing the base frames in the empty container transferred to the designated position;

wherein the base frames, which finished the solder ball seating step, are transferred in the first direction, the empty container is transferred to the designated position along the second direction, the base frames, which finished the solder ball reflow step, are transferred in the third direction, and the base frames, which finished the cleaning step, are transferred in the fourth direction toward the empty container transferred to the designated position.

2. The method as claimed in claim 1, wherein the first, second, third and fourth directions are directed in such a manner that the transfer course of the base frames is in the form of a loop.