Matrix array devices with flexible substrates

• US 6,974,971 B2
• Filed: 02/25/2002
• Issued: 12/13/2005
• Est. Priority Date: 04/03/2001
• Status: Expired due to Fees

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Young, Nigel D.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): MANDALA, VICTOR A
• Application Number:
  US10/084,723
• Publication Number:
  US 20020139981A1
• Time in Patent Office: 1,387 Days
• Field of Search: 257/39, 257/72, 257/59, 349/42, 349/43, 349/139, 349/143, 349/149
• US Class Current: 257/72
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence

Abstract

A matrix array device, for example, an active matrix display device, image sensor, or the like, comprises a matrix circuit (12, 14, 16, 18) carried on a flexible substrate (20) which circuit includes an array of semiconductor devices (12), such as TFTs, occupying discrete areas. Selected regions of the substrate (20) away from the semiconductor devices (12) are formed as areas of weakness to encourage flexing of the substrate to occur preferentially at those regions upon bending of the device and so reduce the risk of damage to the semiconductor devices. The regions, for example, may comprise lines of weakness (50, 52) extending between the semiconductor devices and may be formed by localized thinning of the substrate or by treating the substrate material to modify its stiffness at predetermined areas.

Claims

1. A flexible matrix array device comprising

a thin film matrix circuit carried on the surface of a flexible substrate which matrix circuit includes:

semiconductor devices arranged in a regular array and occupying respective first areas of the substrate, and

pixel electrodes corresponding coupled to each of the semiconductor devices and occupying respective second areas of the substrate;

wherein

the substrate is configured such that flexing of the substrate occurs more readily at the second areas than at the first areas.

2. A device according to claim 1, wherein

the second areas comprise locally thinner regions of the substrate.

3. A device according to claim 2, wherein

the locally thinner regions are formed by selective etching of the substrate.

4. A device according to claim 2, wherein

the substrate comprises a laminated structure with at least two layers and in which one layer is patterned to form the locally thinner regions.

5. A device according to claim 1, wherein

the second areas comprise areas of the substrate at which the material of the substrate is rendered less stiff compared with the first areas of the substrate.

6. A device according to claim 1, wherein

the substrate comprises polymer material.

7. A device according to claim 1, wherein

the second areas include lines that facilitate flexing of the substrate between the first areas of the substrate.

8. A device according to claim 7, wherein

the semiconductor devices are arranged in an array of rows and columns and wherein

the second areas comprise lines that facilitate flexing of the substrate extending across the array between rows and/or columns of semiconductor devices.

9. A device according to claim 1, wherein

the first areas are thicker than the second areas of substrate.

10. A device according to claim 1, wherein

the semiconductor devices each comprise a semiconductor film formed into an island.

11. A device according to claim 1, wherein

the semiconductor devices comprises thin film transistors.

12. A device according to claim 1, wherein

the device comprises

an active matrix display devices having an array of display pixels.

13. A device according to claim 12, wherein

the device comprises

an active matrix liquid crystal display device which includes

a further flexible substrate mounted to the substrate carrying the matrix circuit with liquid crystal material disposed between the substrates.

14. A device according to claim 13, wherein

the further substrate has lines that facilitate flexing formed therein.

15. A curved matrix array device comprising

a thin film matrix circuit carried on the surface of a substrate which matrix circuit includes:

semiconductor devices arranged in a regular array and occupying respective first areas of the substrate, and

pixel electrodes correspondingly coupled to each of the semiconductor devices and occupying respective second areas of the substrate;

wherein

the substrate is configured such that curvature of the device is accommodated substantially by deformation at the substrate at the second areas.