Optoelectronic semiconductor component having multiple external connections

• US 6,975,011 B2
• Filed: 04/06/2004
• Issued: 12/13/2005
• Est. Priority Date: 09/29/1995
• Status: Expired due to Term

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Schellhorn, Franz, Waitl, Günter, Arndt, Karlheinz
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US10/819,638
• Publication Number:
  US 20040188790A1
• Time in Patent Office: 616 Days
• Field of Search: 257432-437, 257 79- 84, 257/428, 257/787, 257 98-100
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Claims

1. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a lead frame having a chip carrier part and a connection part;

a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part;

an encapsulation surrounding the semiconductor chip and at least a partial region of the chip carrier part;

said connection part being arranged at a distance from the chip carrier part;

said chip carrier part and said connection part each having two external connections which project from the encapsulation at opposite sides.

2. A semiconductor component as claimed in claim 1, wherein said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.

3. A semiconductor component as claimed in claim 2, wherein the recess having inner surfaces which are coated with reflection-enhancing material.

4. A semiconductor component as claimed in claim 1, wherein the encapsulation is formed completely of a radiation-permeable material.