CPC Class Codes
H01L 2224/05624
Aluminium [Al] as principal...
H01L 2224/26145
Flow barriers
H01L 2224/291
with a principal constituen...
H01L 2224/2919
with a principal constituen...
H01L 2224/32225
the item being non-metallic...
H01L 2224/32245
the item being metallic
H01L 2224/45124
Aluminium (Al) as principal...
H01L 2224/45144
Gold (Au) as principal cons...
H01L 2224/48091
Arched
H01L 2224/48247
connecting the wire to a bo...
H01L 2224/48257
connecting the wire to a di...
H01L 2224/48624
Aluminium (Al) as principal...
H01L 2224/48724
Aluminium (Al) as principal...
H01L 2224/49171
Fan-out arrangements
H01L 2224/73265
Layer and wire connectors
H01L 2224/83101
as prepeg comprising a laye...
H01L 2224/8319
Arrangement of the layer co...
H01L 2224/83801
Soldering or alloying
H01L 23/49562
for devices being provided ...
H01L 23/49575
Assemblies of semiconductor...
H01L 24/33 :
of a plurality of layer con...
H01L 24/45 :
of an individual wire conne...
H01L 24/48 :
of an individual wire conne...
H01L 24/49 :
of a plurality of wire conn...
H01L 24/83 :
using a layer connector
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01005 :
Boron [B]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01023 :
Vanadium [V]
H01L 2924/01027 :
Cobalt [Co]
H01L 2924/01029 :
Copper [Cu]
H01L 2924/01079 :
Gold [Au]
H01L 2924/014 :
Solder alloys
H01L 2924/0665 :
Epoxy resin
H01L 2924/07802 :
not being an ohmic electric...
H01L 2924/0781 :
being an ohmic electrical c...
H01L 2924/12042 :
LASER
H01L 2924/13055 :
Insulated gate bipolar tran...
H01L 2924/13091 :
Metal-Oxide-Semiconductor F...
H01L 2924/14 :
Integrated circuits
H01L 2924/30107 :
Inductance
H01L 2924/3025 :
Electromagnetic shielding
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