Method and device for vacuum treatment

US 6,977,359 B2
Filed: 05/17/2002
Issued: 12/20/2005
Est. Priority Date: 05/18/2001
Status: Active Grant

First Claim

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1. A vacuum-processing method of carrying out, in a vacuum processing vessel, a process wherein an effect of the process changes as the number of processed objects increases, and controlling a controlled parameter affecting the effect of the process directly so that the controlled parameter is maintained at a target value, said vacuum-processing method comprising the steps of:

determining a mode of variation of the effect of the process through measurement;

determining a mode of the controlled parameter change to keep the effect of the process constant;

determining a model function on the basis of the determined mode of variation of the effect of the process and the determined mode of the controlled parameter change; and

calculating the target value of the controlled parameter every time one or a plurality of objects are processed, on the basis of the model function and a set value of a set parameter representing the effect of the process.

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Abstract

A vacuum-processing method carries out, in a vacuum-processing vessel (4), a process wherein a condition of an interior of the vacuum processing vessel (4) changes as the number of processed objects (W) increases, such as a film-forming process for forming a thin film on a semiconductor wafer (W) by using a process gas in the vacuum processing vessel (4). The vacuum-processing method controls a controlled parameter directly affecting an effect of the process, such as film thickness, so that the controlled parameter is maintained at a target value (r_t). The vacuum-processing method determines a model function obeying a change of the condition of the interior of the processing vessel (4), and calculates the target value (r_t) of the controlled parameter every time one or a plurality of objects (W) are processed on the basis of a set value (D_t) of a set parameter representing the effect of the process, and the model function.

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10 Claims

1. A vacuum-processing method of carrying out, in a vacuum processing vessel, a process wherein an effect of the process changes as the number of processed objects increases, and controlling a controlled parameter affecting the effect of the process directly so that the controlled parameter is maintained at a target value, said vacuum-processing method comprising the steps of:
- determining a mode of variation of the effect of the process through measurement;
  
  determining a mode of the controlled parameter change to keep the effect of the process constant;
  
  determining a model function on the basis of the determined mode of variation of the effect of the process and the determined mode of the controlled parameter change; and
  
  calculating the target value of the controlled parameter every time one or a plurality of objects are processed, on the basis of the model function and a set value of a set parameter representing the effect of the process.
- View Dependent Claims (2, 3, 4, 5, 6, 7)
- - 2. The vacuum-processing method according to claim 1, wherein the model function is updated on the basis of measured data of the effect of the process.
  - 3. The vacuum-processing method according to claim 2, wherein it is decided that the measured data and/or data obtained by using the model function is abnormal when the difference between the measured data and the data obtained by using the model function is not smaller than a reference value.
  - 4. The vacuum-processing method according to claim 1, wherein the model function is produced by any one of a least-squares method, a Kalman filter and a maximum likelihood estimation method.
  - 5. The vacuum-processing method according to claim 1, wherein the process is a film-forming process for forming a thin film on the object by supplying a deposition gas into the processing vessel, the set parameter is either the thickness of the film or the sheet resistivity of the film, and the controlled parameter is any one of a processing temperature in the processing vessel, a processing time for processing each object and a gas supply rate of the deposition gas.
  - 6. The vacuum-processing method according to claim 5, wherein the model function is updated on the basis of the measured film thickness as the measured data of the effect of the process.
  - 7. The vacuum-processing method according to claim 1, wherein the model function is an autoregressive moving-average model represented by Expression (1):
    - r_t={B(Z^−
      
      1)/A(Z^−
      
      1)}·
      
      D_t
      
      (1)where;
      
      r_trepresents the target value of the controlled parameter,D_trepresents the set value of the set parameter,A(Z^−
      
      1) is equal to 1+a₁+Z^−
      
      1+a₂Z^−
      
      2+ . . . +a_nZ^−
      
      n,B(Z^−
      
      1) is equal to b₁Z^−
      
      1+b₂Z^−
      
      2+ . . . +b_nZ^−
      
      n,wherein the coefficients a₁to a_nare represented by a_i, the coefficients b₁to b_nare represented by bⁱ, and Z^−
      
      1to Z^−
      
      nare represented by Z^−
      
      i, where i=1 to n, Z^−
      
      iare time-delay operators, Z^−
      
      iindicates data obtained in a processing cycle preceding the present processing cycle by “
      
      i”
      
      processing cycles.

8. A vacuum-processing apparatus comprising a vacuum processing vessel for containing an object to carry out a process wherein an effect of the process changes as the number of processed objects increases in the processing vessel, said vacuum-processing apparatus further comprising:
- a controller for controlling a controlled parameter affecting the effect of the process directly so that the controlled parameter is maintained at a target value; and
  
  a processing condition compensator storing a model function determined on the basis of a mode of variation of the effect of the process and a mode of change of the controlled parameter, and calculating the target value of the controlled parameter on the basis of the model function and a set value of a set parameter representing the effect of the process.
- View Dependent Claims (9, 10)
- - 9. The vacuum-processing apparatus according to claim 8, wherein the processing condition compensator updates the model function on the basis of measured data of the effect of the process.
  - 10. The vacuum-processing apparatus according to claim 8, wherein the model function is an autoregressive moving-average model represented by Expression (1):
    - r_t={B(Z^−
      
      1)/A(Z^−
      
      1)}·
      
      D_t
      
      (1)where;
      
      r_trepresents the target value of the controlled parameter,D_trepresents the set value of the set parameter,A(Z^−
      
      1) is equal to 1+a₁+Z^−
      
      1+a₂Z^−
      
      2+ . . . +a_nZ^−
      
      n,B(Z^−
      
      1)is equal to b₁Z^−
      
      1b₂Z^−
      
      2+ . . . +b_nZ^−
      
      n,wherein the coefficients a₁to a_nare represented by a_i, the coefficients b₁to b_nare represented by b_i, and Z^−
      
      1to Z^−
      
      nare represented by Z^−
      
      i, where i=1 to n, Z^−
      
      iare time-delay operators, Z^−
      
      iindicates data obtained in a processing cycle preceding the present processing cycle by “
      
      i”
      
      processing cycles.

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Current Assignee
Tokyo Electron Limited
Original Assignee
Tokyo Electron Limited
Inventors
Kasai, Shigeru
Primary Examiner(s)
PASCHALL, MARK H

Application Number

US10/477,593
Publication Number

US 20040144770A1
Time in Patent Office

1,313 Days
Field of Search

219/121.43, 219/121.4, 219/121.41, 204/298.21, 204/298.37, 204/298.38, 156/345.34, 156/345.31, 156/345.24, 118/723.R, 118/723.I, 118/723.MW
US Class Current

219/490
CPC Class Codes

C23C 16/52 Controlling or regulating t...

Method and device for vacuum treatment

First Claim

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Abstract

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Method and device for vacuum treatment

First Claim

1 Assignment

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Abstract

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