Apparatus and method for electrically coupling a bezel

• US 6,977,819 B2
• Filed: 09/21/2001
• Issued: 12/20/2005
• Est. Priority Date: 09/21/2001
• Status: Expired due to Term

• Current Assignee: SMART Embedded Computing, Inc. (Smart Global Holdings Incorporated)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Richardson, Patrick J., Bertram, Thomas J., Wong, Suzanne M.
• Primary Examiner(s): Zarabian, Amir
• Assistant Examiner(s): Tran, Thanh Y.
• Application Number:
  US09/957,999
• Publication Number:
  US 20030058600A1
• Time in Patent Office: 1,551 Days
• Field of Search: 361/760, 361/748, 361/736, 361/752, 361/753, 361727-731, 361/737, 361/818, 361/816, 361/800, 361/756, 361/796, 361/759, 174/35.R
• US Class Current: 361/730
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 9/0015 Gaskets or seals

Abstract

An apparatus including a front panel (102) and a bezel (104) coupled to the front panel (102) and having a gasket (110), where the gasket (110) is affixed to the bezel (104) and electrically couples the bezel (104) to the front panel (102). Bezel (104) can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel (102) to a bezel (104) includes providing a front panel (102) having an inner surface (112) defining a cut-out (114). Also, providing a bezel (104) having a perimeter (118), where the inner surface (112) of the cut-out (114) is designed to receive the bezel (104). Affixing a gasket (110) to the perimeter (118) of bezel (104) an the inner surface (112) receiving the bezel (104) where the gasket (110) is designed to be coupled to the inner surface (112), and electrically coupling the bezel (104) to the front panel (102) through the gasket (110).

Claims

1. In an electronics module, an apparatus, comprising:

a host board;

a front panel coupled to the host board; and

a mezzanine board bezel, wherein the front panel is coupled to receive the mezzanine board bezel, wherein the mezzanine board bezel is coupled to the front panel and having an integrally affixed gasket, wherein the gasket is integrally molded or chemically bonded to the bezel, wherein the integrally affixed gasket is an integral part of the bezel, and wherein the gasket electrically couples the mezzanine board bezel to the front panel.

2. The apparatus of claim 1, wherein the integrally affixed gasket is molded to the mezzanine board bezel.

3. The apparatus of claim 1, wherein the integrally affixed gasket is bonded to the mezzanine board bezel.

4. The apparatus of claim 1, wherein the integrally affixed gasket is a metal impregnated elastomer.

5. The apparatus of claim 4, wherein the metal impregnated elastomer comprises silver-plated copper in silicone.

6. The apparatus of claim 4, wherein the metal impregnated elastomer has a resistivity less than 0.005 ohm-cm.

7. An apparatus, comprising:

a mezzanine board bezel having a surface and a perimeter, wherein the mezzanine board bezel is designed to be coupled to a mezzanine board; and

an integrally affixed gasket integrally affixed to the perimeter, wherein the integrally affixed gasket is integrally molded or chemically bonded as an integral part of the bezel, wherein the gasket is designed to electrically couple the mezzanine board bezel to a front panel.

8. The apparatus of claim 7, wherein the mezzanine board bezel comprises a connector notch in the surface, and wherein the connector notch impinges on the perimeter of the mezzanine board bezel.

9. The apparatus of claim 8, wherein the integrally affixed gasket is discontinuous at the connector notch.

10. The apparatus of claim 7, wherein the integrally affixed gasket is continuous around the perimeter of the mezzanine board bezel.

11. The apparatus of claim 7, wherein the integrally affixed gasket is molded to the mezzanine board bezel.

12. The apparatus of claim 7, wherein the integrally affixed gasket is bonded to the mezzanine board bezel.

13. An apparatus, comprising:

a front panel having an inner surface defining a cut-out;

a mezzanine board bezel having a perimeter, wherein the inner surface defining the cut-out out is designed to receive the mezzanine board bezel; and

an integrally affixed gasket integrally affixed to the perimeter of the mezzanine board bezel, wherein the integrally affixed gasket is designed to be coupled to the inner surface of the front panel, wherein the integrally affixed gasket is integrally molded or chemically bonded as an integral part of the bezel, and wherein the gasket electrically couples the mezzanine board bezel to the front panel.

14. The apparatus of claim 13, wherein the mezzanine board bezel comprises a connector notch, and wherein the connector notch impinges on the perimeter of the mezzanine board bezel.

15. The apparatus of claim 14, wherein the integrally affixed gasket is discontinuous at the connector notch.

16. The apparatus of claim 13, wherein the intently affixed gasket is continuous around the perimeter of the mezzanine board bezel.

17. In an electronics module, a method of electrically coupling a front panel to a mezzanine board bezel, comprising:

providing the front panel having an inner surface defining a cut-out;

providing the mezzanine board bezel having a perimeter, wherein the inner surface defining the cut-out is designed to receive the mezzanine board bezel;

affixing an integrally affixed gasket to the perimeter of the mezzanine board bezel, wherein the integrally affixed gasket is integrally molded or chemically bonded as an integral part of the bezel;

the inner surface of the cut-out receiving the mezzanine board bezel, wherein the integrally affixed gasket is designed to be coupled to the inner surface; and

electrically coupling the mezzanine board bezel to the front panel trough the integrally affixed gasket.

18. The method of claim 17, wherein affixing the integrally affixed gasket comprises molding the gasket to the mezzanine board bezel.

19. The method of claim 17, wherein affixing the integrally affixed gasket comprises bonding the gasket to the mezzanine board bezel.