Curing light
DCFirst Claim
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1. A curing light comprising:
- a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, an LED chip module mounted on said mounting platform, said LED chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting an LED chip, an LED chip mounted in said well, a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said LED chip module, and a light reflective cone installed at said elongate heat sink distal end, said light reflective cone including a proximal side proximal to said LED chip module, said proximal side including a light inlet having a dimension “
d”
, a distal side distal to said LED chip module, said distal side including a light exit having a dimension “
a” and
an exterior dimension “
e”
, where e>
a and a>
d, an exterior surface, and an interior surface, said interior surface being capable of reflecting light emitted by said LED chip module in order to create a light footprint of desired shape, dimension and density.
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Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
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Citations
7 Claims
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1. A curing light comprising:
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a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, an LED chip module mounted on said mounting platform, said LED chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting an LED chip, an LED chip mounted in said well, a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said LED chip module, and a light reflective cone installed at said elongate heat sink distal end, said light reflective cone including a proximal side proximal to said LED chip module, said proximal side including a light inlet having a dimension “
d”
,a distal side distal to said LED chip module, said distal side including a light exit having a dimension “
a” and
an exterior dimension “
e”
, where e>
a and a>
d,an exterior surface, and an interior surface, said interior surface being capable of reflecting light emitted by said LED chip module in order to create a light footprint of desired shape, dimension and density. - View Dependent Claims (2, 3)
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4. A curing light comprising:
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an elongate heat sink with a proximal end and a distal end, said elongate heat sink having a longitudinal axis defined between said proximal end and said distal end, a semiconductor chip module mounted at said elongate heat sink distal end, said semiconductor chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting a semiconductor chip, a semiconductor chip mounted in said well, a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to pass through it to provide usable light exiting from said semiconductor chip module, and a light reflective device installed at said elongate heat sink distal end, said light reflective device including a proximal side proximal to said semiconductor chip module, said proximal side including a light inlet having a dimension “
d”
,a distal side distal to said semiconductor chip module, said distal side including a light exit having a dimension “
a” and
an exterior dimension “
e”
, where e>
a and a>
d,an exterior surface, and an interior surface, said interior surface being capable of reflecting light emitted by said semiconductor chip module in order to create a light footprint of desired shape, dimension and density. - View Dependent Claims (5, 6, 7)
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Specification