Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modules
First Claim
1. A MEMS module comprising:
- at least one MEMS device including a movable element;
a substrate having a surface carrying electronic circuitry, the at least one MEMS device overlying at least a portion of the electronic circuitry;
an organic adhesive bond joining the at least one MEMS device and the circuitry-carrying surface of the substrate; and
electrical conductors connecting the at least one MEMS device with the electronic circuitry.
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Accused Products
Abstract
A MEMS module is provided comprising at least one MEMS device adhesively bonded to a substrate or wafer, such as a CMOS die, carrying pre-processed electronic circuitry. The at least one MEMS device, which may comprise a sensor or an actuator, may thus be integrated with related control, readout/signal conditioning, and/or signal processing circuitry.
An example of a method pursuant to the invention comprises the adhesive bonding of a pre-processed electronics substrate or wafer to a layered structure preferably in the form of a silicon-on-insulator (SOI) substrate. The SOI is then bulk micromachined to selectively remove portions thereof to define the MEMS device. Prior to release of the MEMS device, the device and the associated electronic circuitry are electrically interconnected, for example, by wire bonds or metallized vias.
65 Citations
13 Claims
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1. A MEMS module comprising:
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at least one MEMS device including a movable element; a substrate having a surface carrying electronic circuitry, the at least one MEMS device overlying at least a portion of the electronic circuitry; an organic adhesive bond joining the at least one MEMS device and the circuitry-carrying surface of the substrate; and electrical conductors connecting the at least one MEMS device with the electronic circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification