×

Packaged microelectromechanical device with lubricant

  • US 6,979,893 B2
  • Filed: 03/26/2004
  • Issued: 12/27/2005
  • Est. Priority Date: 03/26/2004
  • Status: Active Grant
First Claim
Patent Images

1. A microelectromechanical package, comprising:

  • a package substrate;

    a microelectromechanical device having a surface to be lubricated, wherein the microelectromechanical device is disposed on the package substrate;

    a container containing a lubricant that evaporates from an opening of the container and contacts the surface to be lubricated; and

    a package cover that is bonded to the package substrate for sealing the package.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×