Packaged microelectromechanical device with lubricant
First Claim
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1. A microelectromechanical package, comprising:
- a package substrate;
a microelectromechanical device having a surface to be lubricated, wherein the microelectromechanical device is disposed on the package substrate;
a container containing a lubricant that evaporates from an opening of the container and contacts the surface to be lubricated; and
a package cover that is bonded to the package substrate for sealing the package.
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Abstract
The present invention provides a lubricant container inside a microelectromechanical device package. The lubricant container contains selected lubricant that evaporates from the container and contact to a surface of the microelectromechanical device for lubricating the surface.
48 Citations
30 Claims
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1. A microelectromechanical package, comprising:
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a package substrate; a microelectromechanical device having a surface to be lubricated, wherein the microelectromechanical device is disposed on the package substrate; a container containing a lubricant that evaporates from an opening of the container and contacts the surface to be lubricated; and a package cover that is bonded to the package substrate for sealing the package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification