Wireless communication devices and methods of forming and operating the same

• US 6,980,085 B1
• Filed: 04/13/2000
• Issued: 12/27/2005
• Est. Priority Date: 08/18/1997
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Dando, Ross S.
• Primary Examiner(s): Zimmerman, Brian
• Assistant Examiner(s): YANG, CLARA I
• Application Number:
  US09/570,365
• Time in Patent Office: 2,084 Days
• Field of Search: 340/10.4, 340/10.41, 340/10.42, 340/10.5, 340/10.51, 340/10.52, 340/10.6, 340/825.71, 340/825.72, 340/3.51, 340/568.1, 340/572.1, 340/10.1
• US Class Current: 340/10.4
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

Wireless communication devices and methods of forming and operating the same are provided. The present invention provides a wireless communication device including a substrate having a support surface, wireless communication circuitry upon the support surface of the substrate, at least one antenna electrically coupled with the wireless communication circuitry, a conductive layer configured to interact with the antenna, and an insulative layer intermediate the conductive layer and the antenna. A method of forming a wireless communication device includes providing a substrate having a support surface, forming an antenna upon the support surface, conductively coupling wireless communication circuitry with the antenna, forming an insulative layer over at least a portion of the antenna, and providing a conductive layer over at least a portion of the insulative layer.

Claims

1. A radio frequency identification device comprising:

a substrate having a support surface;

wireless communication circuitry upon the support surface of the substrate;

at least one antenna electrically coupled with the wireless communication circuitry;

a conductive layer configured to interact with the at least one antenna;

an insulative layer intermediate the conductive layer and the at least one antenna; and

wherein the at least one antenna and conductive layer include respective peripheral edges and the peripheral edges of the at least one antenna are provided within the confines of the peripheral edges of the conductive layer.

2. The device according to claim 1 wherein the wireless communication circuitry is intermediate the at least one antenna and the conductive layer.

3. The device according to claim 1 further comprising a housing configured to encapsulate the wireless communication circuitry.

4. The device according to claim 3 wherein the housing includes the substrate.

5. The device according to claim 1 wherein the insulative layer is over substantially the entire support surface and the conductive layer is over substantially the entire insulative layer.

6. The device according to claim 1 further comprising a power source having plural terminals coupled with the wireless communication circuitry.

7. The device according to claim 6 further comprising an electrical connection provided through the insulative layer and operable to conductively couple the conductive layer and one of the terminals of the power source.

8. The device according to claim 1 wherein the insulative layer forms a first encapsulant layer operable to envelope the wireless communication circuitry, the at least one antenna and the support surface.

9. The device according to claim 8 further comprising a second encapsulant layer over the conductive layer.

10. The device according to claim 9 wherein the first and second encapsulant layers and the substrate form a substantially solid housing.

11. The device according to claim 1 wherein the wireless communication circuitry comprises transponder circuitry configured to transmit an identification signal responsive to receiving a polling signal.

12. The device according to claim 1 further comprising a processor operable to process signals received via the at least one antenna.

13. The device according to claim 1 wherein the at least one antenna defines a plane, the conductive layer is substantially planar, and the conductive layer is substantially parallel to the plane defined by the at least one antenna.

14. The device according to claim 1 wherein the at least one antenna is operable to receive wireless communication signals and the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.

15. The device according to claim 1 wherein the conductive layer comprises a ground plane configured to electromagnetically interact with the at least one antenna.

16. A remote intelligent communication device comprising:

a substrate having a support surface;

a conductive trace formed upon the support surface and including at least one antenna configured to at least one of transmit and receive wireless communication signals;

transponder circuitry bonded to the support surface and electrically coupled with the conductive trace;

a first encapsulant layer encapsulating the transponder circuitry and the at least one antenna with at least a portion of the substrate;

a conductive layer positioned upon the first encapsulant layer to interact with the at least one antenna; and

a second encapsulant layer over the conductive layer and forming a substantially solid housing with the substrate and the first encapsulant layer.

17. The remote intelligent communication device according to claim 16 further comprising a power source coupled with the transponder circuitry.

18. The remote intelligent communication device according to claim 16 further comprising an electrical connection through the first encapsulant layer coupling the conductive layer and the conductive trace.

19. The remote intelligent communication device according to claim 16 further comprising a processor operable to process at least some of the wireless communication signals.

20. The remote intelligent communication device according to claim 16 wherein the transponder circuitry is configured to transmit an identification signal responsive to receiving a polling signal.

21. The remote intelligent communication device according to claim 16 wherein the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.

22. The remote intelligent communication device according to claim 21 further comprising an electrical connection conductively coupling the conductive layer with at least one terminal of the power source.

23. The remote intelligent communication device according to claim 16 wherein the transponder circuitry is intermediate the at least one antenna and the conductive layer.

24. The remote intelligent communication device according to claim 16 wherein the first encapsulant layer contacts the transponder circuitry and the at least one antenna.

25. A radio frequency identification device configured to receive wireless communication signals comprising:

a lower housing;

at least one antenna upon the lower housing;

transponder circuitry provided upon the lower housing and coupled with the at least one antenna;

a power source having plural terminals electrically and conductively bonded with the transponder circuitry;

an insulative layer over the at least one antenna; and

a conductive layer over the at least one antenna.

26. The radio frequency identification device according to claim 25 further comprising an electrical connection conductively coupling the conductive layer with at least one terminal of the power source.

27. The radio frequency identification device according to claim 25 further comprising an upper housing portion over the conductive layer.

28. The radio frequency identification device according to claim 27 wherein the lower housing, the insulative layer, and the upper housing provide a substantially solid housing.

29. The radio frequency identification device according to claim 25 further comprising a processor coupled with the transponder circuitry and operable to process at least some of the wireless communication signals.

30. The radio frequency identification device according to claim 25 wherein the transponder circuitry is configured to transmit an identification signal responsive to receiving a polling signal.

31. The radio frequency identification device according to claim 25 wherein the conductive layer is positioned to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.

32. The radio frequency identification device according to claim 25 wherein the transponder circuitry is intermediate the at least one antenna and the conductive layer.

33. A method of operating a wireless communication device comprising:

coupling an antenna with wireless communication circuitry intermediate the antenna and a conductive layer;

receiving wireless communication signals using the wireless communication circuitry;

transmitting wireless communication signals using the wireless communication circuitry; and

interacting the conductive layer with the antenna.

34. The method of operating a wireless communication device according to claim 33 further comprising processing some of the wireless communication signals.

35. The method of operating a wireless communication device according to claim 33 wherein the interacting comprises:

shielding some of the wireless communication signals from the antenna; and

reflecting others of the wireless communication signals toward the substrate and the antenna thereover.

36. The method of operating a wireless communication device according to claim 33 wherein the transmitting comprises transmitting an identification signal responsive to receiving a polling signal.

37. The method of operating a wireless communication device according to claim 33 further comprising:

supplying operational power to the wireless communication circuitry using a power source; and

electrically grounding the conductive layer using the power source.

38. A method of operating a radio frequency identification device comprising:

providing an antenna upon a substrate;

coupling transponder circuitry with the antenna;

using the antenna and transponder circuitry, at least one of transmitting and receiving wireless communication signals;

providing a ground plane with the transponder circuitry intermediate the antenna and the ground plane; and

interacting the ground plane with the antenna comprising;

shielding some of the wireless communication signals from the antenna; and

reflecting others of the wireless communication signals toward the substrate and the antenna thereover.

39. The method of operating a radio frequency identification device according to claim 38 further comprising:

supplying operational power to the wireless communication circuitry using a power source; and

electrically grounding the conductive layer using the power source.

40. The method of operating a radio frequency identification device according to claim 38 further comprising processing at least some of the wireless communication signals.

41. A method of forming a wireless communication device comprising:

providing a substrate having a support surface;

forming an antenna upon the support surface;

conductively coupling wireless communication circuitry with the antenna;

forming an insulative layer over at least a portion of the antenna; and

providing a conductive layer over at least a portion of the insulative layer.

42. The method of forming a wireless communication device according to claim 41 further comprising electrically grounding the conductive layer.

43. The method of forming a wireless communication device according to claim 41 further comprising providing electrical conductivity through the insulative layer.

44. The method of forming a wireless communication device according to claim 41 further comprising:

providing a power source; and

coupling the conductive layer with a terminal of the power source.

45. The method of forming a wireless communication device according to claim 44 wherein the coupling comprises providing a conductive post.

46. The method of forming a wireless communication device according to claim 44 wherein the coupling comprises dispensing conductive material.

47. The method of forming a wireless communication device according to claim 41 wherein the providing the conductive layer comprises providing the conductive layer over substantially the entire support surface.

48. The method of forming a wireless communication device according to claim 41 wherein the providing of the conductive layer includes positioning the conductive layer to interact with the antenna.

49. The method of forming a wireless communication device according to claim 41 further comprising removing a portion of the insulative layer providing a substantially planar insulative layer having a predetermined thickness.

50. The method of forming a wireless communication device according to claim 41 wherein the forming of the insulative layer comprises encapsulating the antenna, the wireless communication circuitry and at least a portion of the support surface.

51. The method of forming a wireless communication device according to claim 41 further comprising encapsulating at least a portion of the conductive layer with an encapsulant.

52. The method of forming a wireless communication device according to claim 51 wherein the encapsulant, the substrate, and insulative layer form a substantially solid device.

53. The method of forming a wireless communication device according to claim 41 wherein the wireless communication device comprises a remote intelligent communication device.

54. The method of forming a wireless communication device according to claim 41 wherein the wireless communication device comprises a radio frequency identification device.

55. A method of forming a radio frequency identification device comprising:

providing a substrate having a support surface;

printing an antenna over the support surface configured to at least one of transmit and receive wireless communication signals;

conductively bonding transponder circuitry with the antenna;

first encapsulating the antenna and the transponder circuitry forming a first encapsulant layer;

providing a conductive layer upon at least a portion of the encapsulant layer; and

second encapsulating the conductive layer forming a second encapsulant layer.

56. The method of forming a radio frequency identification device according to claim 55 further comprising removing some of the first encapsulant layer providing a substantially planar first encapsulant layer having a predetermined thickness.

57. The method of forming a radio frequency identification device according to claim 55 further comprising providing the conductive layer over the antenna.

58. The method of forming a radio frequency identification device according to claim 55 further comprising coupling a processor with the transponder circuitry.

59. The method of forming a radio frequency identification device according to claim 55 further comprising electrically grounding the conductive layer.

60. The method of forming a radio frequency identification device according to claim 55 further comprising conductively bonding a power source with the transponder circuitry.

61. The method of forming a radio frequency identification device according to claim 55 wherein the first encapsulant layer, the second encapsulant layer, and the substrate form a substantially solid device.

62. A method of forming a radio frequency identification device comprising:

providing a substrate having a support surface;

printing a conductive trace comprising a plurality of terminal connections and first and second antennas upon the support surface, the first antenna being configured to transmit wireless signals and the second antenna being configured to receive wireless signals;

conductively bonding a battery with the terminal connections;

conductively bonding transponder circuitry with the terminal connections and the first and second antennas;

coupling a processor with the transponder circuitry;

providing an electrical connection comprising one of dispensing conductive material and providing a conductive post;

first encapsulating the first and second antennas, the battery, the transponder circuitry, the processor, the electrical connection, and at least a portion of the support surface, the first encapsulating forming a first encapsulant layer;

removing some of the first encapsulant layer providing a substantially planar first encapsulant layer having a predetermined thickness;

providing a ground plane upon the first encapsulant layer and over substantially the entire support surface, the providing of the ground plane including positioning the ground plane to interact with the antennas;

electrically coupling the ground plane with one of the terminal connections using the electrical connection; and

second encapsulating the ground plane forming a second encapsulant layer and a substantially solid device with the substrate and the first encapsulant layer.

63. A wireless communication device comprising:

a housing;

an antenna coupled with the housing and configured to at least one of output wireless signals and receive wireless signals;

wireless communication circuitry coupled with the housing and the antenna; and

a ground plane coupled with the housing and configured to enhance wireless communications via the antenna, the wireless communication circuitry being positioned intermediate the ground plane and the antenna.

64. The device according to claim 63 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.

65. The device according to claim 63 wherein the antenna, the ground plane, the wireless communication circuitry, and the housing provide a substantially void-free wireless communication device.

66. The device according to claim 63 wherein the housing comprises a substrate and at least one encapsulant layer.

67. The device according to claim 66 wherein the at least one encapsulant layer contacts at least respective portions of the antenna, the wireless communication circuitry and the ground plane.

68. The device according to claim 63 wherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.

69. A wireless communication device comprising:

a substrate having a support surface;

an antenna elevationally over the support surface and configured to at least one of output wireless signals and receive wireless signals;

wireless communication circuitry elevationally over the antenna and coupled with the antenna; and

a ground plane elevationally over the wireless communication circuitry and configured to interact with the antenna.

70. The device according to claim 69 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.

71. The device according to claim 69 further comprising at least one encapsulant layer.

72. The device according to claim 71 wherein the antenna, the ground plane, the wireless communication circuitry, and the at least one encapsulant layer provide a substantially void-free wireless communication device.

73. The device according to claim 71 wherein the at least one encapsulant layer contacts at least respective portions of the antenna, the wireless communication circuitry and the ground plane.

74. A wireless communication device comprising:

an antenna configured to at least one of output wireless signals and receive wireless signals;

a ground plane configured to enhance wireless communications via the antenna;

wireless communication circuitry coupled with the antenna;

a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; and

wherein the antenna, the ground plane, the wireless communication circuitry, and the housing provide a substantially void-free wireless communication device.

75. The device according to claim 74 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.

76. The device according to claim 74 wherein the housing comprises a substrate and at least one encapsulant layer.

77. The device according to claim 74 wherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.

78. The device according to claim 74 wherein the wireless communication circuitry is positioned intermediate the antenna and the ground plane.

79. A method of forming a wireless communication device comprising:

providing an antenna configured to at least one of output wireless signals and receive wireless signals;

positioning a ground plane to enhance wireless communications via the antenna;

providing wireless communication circuitry intermediate the antenna and the ground plane; and

coupling the wireless communication circuitry with the antenna.

80. The method according to claim 79 wherein the providing the wireless communication circuitry comprises providing radio frequency identification device circuitry.

81. The method according to claim 79 further comprising encapsulating the antenna, the ground plane and the wireless communication circuitry.

82. The method according to claim 81 wherein the encapsulating comprises providing a substantially void-free wireless communication device.

83. The method according to claim 81 wherein the encapsulating comprises contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane with at least one encapsulant layer.

84. A method of forming a wireless communication device comprising:

providing a substrate having a support surface;

providing an antenna configured to at least one of output wireless signals and receive wireless signals elevationally over the support surface;

positioning wireless communication circuitry elevationally over the antenna;

coupling the wireless communication circuitry with the antenna; and

positioning a ground plane elevationally over the wireless communication circuitry to enhance wireless communications via the antenna.

85. The method according to claim 84 wherein the providing the wireless communication circuitry comprises providing radio frequency identification device circuitry.

86. The method according to claim 84 further comprising encapsulating the antenna, the ground plane and the wireless communication circuitry.

87. The method according to claim 86 wherein the encapsulating comprises providing a substantially void-free wireless communication device.

88. The method according to claim 86 wherein the encapsulating comprises contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane with at least one encapsulant layer.

89. A method of forming a wireless communication device comprising:

providing an antenna configured to at least one of output wireless signals and receive wireless signals;

coupling wireless communication circuitry with the antenna;

providing a ground plane to enhance wireless communications via the antenna;

providing a housing encapsulating and contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane; and

wherein the providing the ground plane provides the wireless communication circuitry intermediate the antenna and the ground plane.

90. The method according to claim 89 wherein the coupling wireless communication circuitry comprises coupling radio frequency identification device circuitry.

91. The method according to claim 89 wherein the providing the housing comprises providing a substantially void-free wireless communication device.

92. A radio frequency identification device comprising:

a substrate having a support surface;

wireless communication circuitry upon the support surface of the substrate;

at least one antenna electrically coupled with the wireless communication circuitry;

a conductive layer configured to interact with the at least one antenna;

an insulative layer intermediate the conductive layer and the at least one antenna; and

wherein the wireless communication circuitry is intermediate the at least one antenna and the conductive layer.

93. A radio frequency identification device comprising:

a substrate having a support surface;

wireless communication circuitry upon the support surface of the substrate;

at least one antenna electrically coupled with the wireless communication circuitry;

a conductive layer configured to interact with the at least one antenna;

an insulative layer intermediate the conductive layer and the at least one antenna; and

wherein the insulative layer is over substantially the entire support surface and the conductive layer is over substantially the entire insulative layer.

94. A radio frequency identification device comprising:

a substrate having a support surface;

wireless communication circuitry upon the support surface of the substrate;

at least one antenna electrically coupled with the wireless communication circuitry;

a conductive layer configured to interact with the at least one antenna;

an insulative layer intermediate the conductive layer and the at least one antenna;

a power source having plural terminals coupled with the wireless communication circuitry; and

an electrical connection provided through the insulative layer and operable to conductively couple the conductive layer and one of the terminals of the power source.

95. A wireless communication device comprising:

an antenna configured to at least one of output wireless signals and receive wireless signals;

a ground plane configured to enhance wireless communications via the antenna;

wireless communication circuitry coupled with the antenna;

a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; and

wherein the housing comprises an encapsulant layer intermediate the ground plane and a substrate.

96. A wireless communication device comprising:

an antenna configured to at least one of output wireless signals and receive wireless signals;

a ground plane configured to enhance wireless communications via the antenna;

wireless communication circuitry coupled with the antenna;

a housing configured to encapsulate and contact at least respective portions of the antenna, the wireless communication circuitry and the ground plane; and

wherein the wireless communication circuitry is positioned intermediate the antenna and the ground plane.

97. A method of forming a wireless communication device comprising:

providing an antenna configured to at least one of output wireless signals and receive wireless signals;

coupling wireless communication circuitry with the antenna;

providing a ground plane to enhance wireless communications via the antenna;

providing a housing encapsulating and contacting at least respective portions of the antenna, the wireless communication circuitry and the ground plane; and

wherein the providing the housing comprises providing a substantially void-free wireless communication device.