Display devices and integrated circuits

• US 6,980,184 B1
• Filed: 09/27/2000
• Issued: 12/27/2005
• Est. Priority Date: 09/27/2000
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Boling, Edward, Jacobsen, Jeffrey J., Stewart, Roger Green
• Primary Examiner(s): Chow, Dennis-Doon
• Assistant Examiner(s): Kumar, Srilakshmi K.
• Application Number:
  US09/671,659
• Time in Patent Office: 1,917 Days
• Field of Search: 174/261, 257/99, 326 38- 44, 438/597
• US Class Current: 345/87
• CPC Class Codes: G09G 2300/0804 Sub-multiplexed active matrix panel, i.e. wherein one active driving circuit is used at pixel level for multiple image producing elements
• CPC Class Codes: G09G 2300/0809 Several active elements per pixel in active matrix panels
• CPC Class Codes: G09G 2310/0275 Details of drivers for data electrodes, other than drivers for liquid crystal, plasma or OLED displays, not related to handling digital grey scale data or to communication of data to the pixels by means of a current
• CPC Class Codes: G09G 2330/021 Power management, e.g. power saving
• CPC Class Codes: G09G 3/14 Semiconductor devices, e.g. diodes
• CPC Class Codes: G09G 3/18 using liquid crystals
• CPC Class Codes: G09G 3/2085 Special arrangements for addressing the individual elements of the matrix, other than by driving respective rows and columns in combination
• CPC Class Codes: G09G 3/3208 organic, e.g. using organic light-emitting diodes [OLED]
• CPC Class Codes: G09G 3/34 by control of light from an independent source
• CPC Class Codes: G09G 3/36 using liquid crystals
• CPC Class Codes: G09G 3/3688 suitable for active matrices only
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H03K 19/01855 : synchronous, i.e. using clock signals
• CPC Class Codes: H03K 19/09429 : one of the states being the high impedance or floating state

Abstract

Integrated circuits, assemblies with integrated circuits, display devices and electrical circuits. There are various different aspects and embodiments of these apparatuses described herein. According to one aspect, a display device includes a plurality of display drivers which includes a serial shift register, wherein the display drivers are located in the display area of the display device which is viewable. According to another aspect, an integrated circuit, which has a plurality of functionally symmetric interface pads, includes an instruction decoder which decodes instructions received through at least one of the pads. In another aspect, an integrated circuit (IC) includes a position detector which detects a position of the IC relative to a receptor substrate and provides a signal which is determined by the position; this IC may be used in an assembly which includes the receptor substrate. In another aspect, an IC includes a position detector which detects a position of the IC relative to a receptor substrate and also includes a configurable pad which is configurable, depending upon the position as one of at least two of the following: an input pad, an output pad, or a no-operation pad. According to another aspect, a layout of an IC has a plurality of functionally symmetric interface pads wherein two such pads are configurable pads. According to another aspect, an assembly includes a receptor substrate and an IC attached to the substrate, and the IC includes a first logic circuit which provides a first function, a second logic circuit which provides a second function, and a selector which selects between the two functions such that the IC performs only the selected function. Other aspects and methods are also described.

Claims

1. An assembly comprising:

a receptor substrate having a conductive layer disposed over at least a portion of said receptor substrate;

an integrated circuit (IC) attached to said receptor substrate and having a plurality of interface pads, including at least one interface pad which is coupled to said conductive layer to receive a signal from said conductive layer, said IC also comprising;

a first logic circuit coupled to a first set said interface pads and providing a first function;

a second logic circuit coupled to a second set of said interface pads and providing a second function which is different than said first function;

a selector logic circuit coupled to said first logic circuit and coupled to said second logic circuit and coupled to receive said signal which causes said selector logic to select between said first function and said second function such that said IC performs only one of said first and said second functions.

2. An assembly as in claim 1 wherein said IC is attached to said receptor substrate through a fluidic self-assembly process, and wherein said first set and said second set of interface pads overlap at least partially.

3. An assembly as in claim 1 wherein said signal is determined by a position of said IC on said receptor substrate.

4. An assembly as in claim 3 wherein said position determines whether said IC provides said first function or said second function at said position.

5. An assembly as in claim 1 wherein said signal is a programming instruction which selects between said first and said second functions.

6. An assembly as in claim 1 wherein said first function is a sensing function and said second function is a presentation function.

7. An assembly as in claim 6 wherein said sensing function senses a touch of a user and said presentation function displays data to said user.