Method for modulating shapes of substrates
First Claim
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1. A method for modulating shapes of a substrate, having first and second opposed surfaces, with said second opposed surface facing an imprinting layer, said method comprising:
- creating a pressure differential between differing regions of said first opposed surface to obtain a desired shape of said second opposed surface by compensating for external pressures bearing thereon resulting from contact by said second opposed surface with said imprinting layer.
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Abstract
The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.
207 Citations
24 Claims
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1. A method for modulating shapes of a substrate, having first and second opposed surfaces, with said second opposed surface facing an imprinting layer, said method comprising:
creating a pressure differential between differing regions of said first opposed surface to obtain a desired shape of said second opposed surface by compensating for external pressures bearing thereon resulting from contact by said second opposed surface with said imprinting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for modulating shapes of a substrate, having first and second opposed surfaces with a side surface extending therebetween, said method comprising:
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creating a pressure differential between differing regions of said first opposed surface; and
attenuating structural distortions in said second opposed surface by loading said side surface causing said substrate to bow and varying said pressure differential to compensate for external forces bearing on said side surface and said second opposed surface. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method for modulating shapes of a substrate, having first and second opposed surfaces with a side surface extending therebetween, said substrate being spaced-apart from a wafer having an imprinting layer disposed thereon, said method comprising:
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defining a plurality of pressure chambers in fluid communication with said first opposed surface by providing a chuck body having first and second opposed sides with an edge surface extending therebetween, said first opposed side including first and second spaced-apart recesses defining first and second spaced-apart support regions, resting said substrate against said first and second spaced-apart support regions, covering said first and second spaced-apart recesses, with said first recess and a first portion of said substrate in superimposition therewith defining a first chamber and said second recess and a second portion of said substrate in superimposition therewith defining a second chamber;
hydrostatically supporting said substrate against gravity by creating a pressure differential between said first and second chambers; and
attenuating structural distortions in said second opposed surface by loading said side surface causing said substrate to bow and varying said pressure of said second chamber to compensate for external forces bearing on said side surface and said second opposed surface. - View Dependent Claims (19, 20, 21, 22)
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23. A method for modulating shapes of a substrate, having first and second opposed surfaces and a side surface extending therebetween, with said second opposed surface having a pattern disposed thereon and facing an imprinting layer, said method comprising:
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loading said side surface causing said substrate to bow;
creating a pressure differential between differing regions of said first opposed surface to attenuate distortions in said pattern while maintaining a desired predetermined shape of said second opposed surface.
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24. A method for modulating shapes of a substrate, having first and second opposed surfaces with a side surface extending therebetween, said substrate being spaced-apart from a wafer having an imprinting layer disposed thereon, said method comprising:
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hydrostatically supporting said substrate against gravity by creating a pressure differential between first and second regions of said first opposed surface; and
attenuating structural distortions in said second opposed surface by dynamically varying said pressure associated with said second region to compensate for varying external pressures bearing on said second opposed surfaces that results from contacting said imprinting layer with said substrate.
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Specification