Computer cooling system

• US 6,980,436 B2
• Filed: 04/16/2004
• Issued: 12/27/2005
• Est. Priority Date: 01/15/2004
• Status: Expired due to Fees

• Current Assignee: Cheng-Yi Lin
• Original Assignee: Huang-Han Chen
• Inventors: Chen, Huang-Han
• Primary Examiner(s): Vortman, Anatoly
• Assistant Examiner(s): Pape, Zachary
• Application Number:
  US10/825,226
• Publication Number:
  US 20050157468A1
• Time in Patent Office: 620 Days
• Field of Search: 361/699, 361/711, 165/80.4, 165/104.33, 257/714, 257/715
• US Class Current: 361/699
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A computer cooling system devised with a computer housing, which is a sealed body and has a plurality of paths. An end portion of the sealed body is connected to a heat conducting plate via pipes thereof. The heat conducting plate is directly attached to a CPU, hard disc or other computer components that need heat dissipation. The paths of the housing are filled with a cooling liquid that is circulated between an interior of the housing and the heat conducting plate using a pump, thereby rapidly lowering temperatures of the computer components to which the heat conducting plate is attached. The housing is made of a material such as aluminum having a good thermal conductance coefficient. In conjunction with circulation of the cooling liquid, temperatures in the computer are rapidly exchanged by the housing and thus controlled within a recommended operating temperature range.

Claims

1. A computer cooling system comprising:

a housing made of a material having a good thermal conductance coefficient;

formed as a shape of a hollow square; and

having inner and outer housings, and a plurality of transverse partitions between the inner and outer housings;

wherein paths penetrating through the housing are formed between two adjacent partitions, and front and rear ends of the paths alternately develop into openings (odd-number paths each having an opening at a front end portion thereof, and even number paths each having an opening at a rear end portion thereof), such that the paths are distributed in communication, joined and located closely to one another at wall surfaces of the housing;

sealing panels joined at front and rear ends of the housing such that an interior of the housing becomes as a sealed environment; and

having a water inlet and a water outlet that correspond with the paths of the housing; and

a heat conducting plate made of a material having a good thermal conductance coefficient;

having two pipes thereof connected with the water inlet and the water outlet of the sealing panels, and a pump which can be directly a CPU or a hard disc of a computer; and

according to the aforesaid structures, a cooling liquid is poured into the housing to have the cooling liquid fill up the paths, the pipes and an interior of the heat conducting plate; and

the cooling liquid is circulated between the paths, the pipes and the heat conducting plate when the pump at the heat conducting plate is in operation.

2. The computer cooling system in accordance with claim 1, wherein the housing is devised into a shape having a U-shaped cross section;

end portions of the housing are provided with an embedding strip and an embedding slot;

two housings having U-shape cross sections are first joined with each other by embedding means, and then joined with the sealing panels into one body to form an integrated housing.