Molded electronic connector formed from a thermally conductive polymer composition and method of making the same
First Claim
1. An electronic connector, comprising:
- a housing having at least one interface port configured to receive and retain an electronic communication cable and a surface portion adjacent said interface port for receiving a circuit board; and
a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon, wherein the housing is molded over the circuit board and heat-generating component and the housing is made of a thermally-conductive polymer composition, the composition including a base polymer and thermally-conductive filler material.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.
62 Citations
22 Claims
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1. An electronic connector, comprising:
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a housing having at least one interface port configured to receive and retain an electronic communication cable and a surface portion adjacent said interface port for receiving a circuit board; and a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon, wherein the housing is molded over the circuit board and heat-generating component and the housing is made of a thermally-conductive polymer composition, the composition including a base polymer and thermally-conductive filler material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electronic connector, comprising:
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a housing having at least one interface port configured to receive and retain an electronic communication cable and a surface portion adjacent said interface port for receiving a circuit board; and a circuit board mounted on the surface portion, the circuit board including a heat-generating component residing thereon, wherein the housing is molded over the heat-generating component and circuit board and the housing is made of a thermally-conductive polymer composition, the composition including i) 30% to 60% by volume of a base polymer, ii) 25% to 50% by volume of a first thermally-conductive filler material having an aspect ratio of at least 10;
1, and iii) 10% to 25% by volume of a second thermally-conductive filler material having aspect ratio of 5;
1 or less. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of making an electronic connector having a molded housing, comprising the steps of:
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providing a circuit board including a heat-generating component residing thereon, molding a thermally-conductive polymer composition over the heat-generating component and circuit board to form a molded housing and at least one interface port adjacent said circuit board, said interface port configured to receive and retain an electronic communication cable, the composition including a base polymer and thermally-conductive filler material. - View Dependent Claims (17, 18, 19)
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20. A method of making an electronic connector having a molded housing, comprising the steps of:
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providing a circuit board including a heat-generating component residing thereon, molding a thermally conductive polymer composition over the heat-generating component and circuit board to form a molded housing and at least one interface port adjacent said circuit board, said interface port configured to receive and retain an electronic communication cable, the composition including;
i) 30% to 60% by volume of a base polymer, ii) 25% to 50% by volume of a first thermally conductive filler material having an aspect ratio of at least 10;
1, and iii) 10% to 25% by volume of a second thermally conductive filler material having an aspect ratio of 5;
1 or less. - View Dependent Claims (21, 22)
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Specification