Microprocessor chip simultaneous switching current reduction method and apparatus
First Claim
Patent Images
1. A method for reducing simultaneous switching current in a microprocessor chip, comprising:
- partitioning the chip into multiple independent processor cores, each with an associated clock domain;
generating a clock signal;
independently delaying the clock signal to produce multiple independent phase-staggered clock signals, each said signal being distributed to a differing said core and clock domain;
defining a plurality of intra-chip functions including high-speed I/O (input/output) latches and drivers associated with each of said cores; and
distributing said intra-chip functions over the area of said chip in each of said cores clustered into areas corresponding and proximal to each said clock domain.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed is an electronic chip containing a plurality of electronic circuit partitions, distributed over the area of the chip, each including a processor core and a clock phase domain different from cores in other partitions of the chip. A source of same frequency, but different phase clock signals representing different clock domains, provides different phase signals to adjacent partitions for the purpose of reducing instantaneous magnitude switching currents. Intra-chip communication circuitry distributes control and data signals between partitions.
-
Citations
18 Claims
-
1. A method for reducing simultaneous switching current in a microprocessor chip, comprising:
-
partitioning the chip into multiple independent processor cores, each with an associated clock domain; generating a clock signal; independently delaying the clock signal to produce multiple independent phase-staggered clock signals, each said signal being distributed to a differing said core and clock domain; defining a plurality of intra-chip functions including high-speed I/O (input/output) latches and drivers associated with each of said cores; and distributing said intra-chip functions over the area of said chip in each of said cores clustered into areas corresponding and proximal to each said clock domain. - View Dependent Claims (8)
-
-
2. An electronic package including a plurality of separately partitioned microprocessor functions, comprising:
-
a clock signal generator; independent delay circuitry to produce multiple independent phase-staggered clock signals, each clock signal providing same frequency but different phase output; a plurality of electronic circuit partitions, distributed over the area of said electronic package, each including an independent processor core and an independent clock phase domain different from cores in other partitions of said electronic package; intra-chip communication circuitry, associated with each of said cores, including I/O (input/output) latches and drivers; and circuit paths between the clock signal generator and the circuit partitions whereby different phase clock signals are provided to different partitions. - View Dependent Claims (9, 10, 11)
-
-
3. A method of communicating between a plurality of microprocessors on a single electronic chip, comprising:
-
partitioning the chip into a plurality of areas; placing some of the processors and associated intra-chip input/output circuitry in different partitions where different independent partitions have different clock domains; generating a clock signal; and independently delaying the clock signal to provide same frequency but different phase independent clock signals to each of said partitions having different clock domains whereby load switching currents occur at different times for each of said clock domains. - View Dependent Claims (12)
-
-
4. A method for reducing simultaneous switching current in a microprocessor chip, comprising:
-
partitioning the chip into multiple independent processor cores, each with an associated clock domain, each of the partitions including associated intra-chip input/output functionality; generating a clock signal; and independently delaying the clock signal to provide same frequency but different phase independent clock signals to the processor cores in each of said partitions whereby load switching currents occur at different times for each of said clock domains. - View Dependent Claims (13)
-
-
5. An electronic package including a plurality of separately partitioned microprocessor functions, comprising:
-
a plurality of electronic circuit partitions, distributed over the area of said electronic package, each including an independent processor core and an independent clock phase domain different from cores in other partitions of said electronic package; intra-chip communication circuitry, associated with said cores in each of said partitions; and delay circuitry to produce multiple independent clock signals of same frequency but different phase output providing different phase clock signals to different partitions. - View Dependent Claims (14, 15, 16)
-
-
6. A method for reducing simultaneous switching current in a microprocessor chip, comprising the steps of:
-
interconnecting a plurality of independent microprocessors using different intra-chip input/output circuitry, comprising latches and drivers, for each microprocessor; generating a clock signal; and independently delaying the clock signal to provide same frequency but different phase independent output clock signals to different ones of said different intra-chip input/output circuitry. - View Dependent Claims (17)
-
-
7. An electronic package including a plurality of separately partitioned microprocessor functions, comprising:
-
a clock signal generator; a plurality of independent delay circuits, wherein each delay circuit is directly connected to the clock signal generator and produces a different independent phase-staggered clock signal, wherein the plurality of phase-staggered clock signals provide the same frequency but different phase output; a plurality of electronic circuit partitions, distributed over the area of said electronic package, each including an independent processor core and an independent clock phase domain different from cores in other partitions of said electronic package, wherein each electronic circuit partition is connected to the output of a different delay circuit of the plurality of delay circuits; and intra-chip communication circuitry, associated with each of said cores, including I/O (input/output) latches and drivers. - View Dependent Claims (18)
-
Specification