Electrical connector semiconductor package with fly-over signal paths

• US 6,984,132 B1
• Filed: 01/17/2004
• Issued: 01/10/2006
• Est. Priority Date: 01/17/2004
• Status: Expired due to Fees

• Current Assignee: Aperture Technologies Corporation
• Original Assignee: Aperture Technologies Corporation
• Inventors: Fujioka, Robert M., Spalding, Kirby H., Chang, Stanley M., Weiher, Patrick M.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US10/760,605
• Time in Patent Office: 724 Days
• Field of Search: 439/76.1, 439/76.2, 439/654, 439/638
• US Class Current: 439/76.1
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 31/02 Intermediate parts for distributing energy to two or more circuits in parallel, e.g. splitter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/92
• CPC Class Codes: H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94
• CPC Class Codes: H05K 3/222 Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685

Abstract

An electrical connector semiconductor package with electrically conductive “fly-over” paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with “fly-over” paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with “fly-over” paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.

Claims

1. An electrical connector semiconductor package comprising:

one or more substrate comprising one or more semiconductor devices attached to the substrate and a first plurality of electrically conductive signal paths provided on at least a first surface of the substrate;

a semiconductor package, wherein the semiconductor package comprises a first package face comprising a first set of connector terminations and a second package face comprising a second set of connector terminations, wherein one or more of the first set of connector terminations are provided to couple a set of external signals to the one or more semiconductor devices via one or more of the plurality signal paths on the substrate and the one or more semiconductor devices are also coupled to the one or more of the second set of connector terminations via one or more of the plurality of signal paths on the substrate;

one or more fly-over, electrically conductive signal paths, wherein at least one of the fly-over signal paths is coupled from one of the first set connector terminations to one of the second set of connector terminations while bypassing a direct connection with the substrate;

wherein the semiconductor package hermetically seals the substrate and one or more fly-over signal paths; and

wherein at least one of the fly-over signal paths comprises a dip portion in that signal path, wherein the dip makes a direct electrical contact with one of the signal paths on the substrate to electrically connect to one or more of the semiconductor devices on the substrate, while a first and a second portion of the fly-over signal path on either side of the dip portion comprise a curve portion providing a clearance from the substrate.

2. The electrical connector semiconductor package of claim 1 wherein the first set of connector terminations comprises a set of connector pins, connector blades, electrically conductive bumps, electrically conductive pads, or electrically conductive receptacles.

3. The electrical connector semiconductor package of claim 1 wherein the second set of connector terminations comprises a set of connector pins, connector blades, electrically conductive bumps, electrically conductive pads, or electrically conductive receptacles.

4. The electrical connector semiconductor package of claim 1 wherein the first set of connector terminations comprises a set of male connector terminations.

5. The electrical connector semiconductor package of claim 1 wherein the second set of connector terminations comprises a set of female connector terminations.