Thermal interface pad utilizing low melting metal with retention matrix
First Claim
1. In a stabilized thermally conductive mechanically compliant laminate pad for interposing between opposed surfaces of a heat generating semiconductor device and a heat sink wherein the stabilized thermally conductive mechanically compliant laminate comprises upper and lower laminae on opposed surfaces of a central stabilizing apertured grid and with portions of said laminae extending through apertures in said mesh grid to form a continuum, said stabilized thermally conductive laminate being characterized in that:
- (a) said upper and lower laminae comprise a mixture of;
(1) a polymer matrix;
(2) a quantity of low melting indium or gallium containing alloy having a melt point at about 120°
C. disbursed within said polymer matrix;
(3) a thermally conductive particulate solid disbursed within said polymer matrix;
(b) said stabilizing open mesh grid comprising a grid body with an array of generally reticulated apertures formed therein, and with the structure and said grid forming between about 10% and 90% of the area of said mesh grid, balance apertures;
(c) each of said reticulated apertures having a cross-sectional dimension greater than about 0.5 mil;
(d) said polymer matrix selected from the group consisting of hot melt waxes of paraffin and silicone, elastomers of acrylic, silicone, urethane, and flexible epoxy'"'"'s, and rigid resins consisting of silicone, urethane, epoxy and phenolic polymers with each polymer matrix having a melting point ranging from between about 40°
C. and 120°
C.
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Accused Products
Abstract
A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.
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Citations
6 Claims
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1. In a stabilized thermally conductive mechanically compliant laminate pad for interposing between opposed surfaces of a heat generating semiconductor device and a heat sink wherein the stabilized thermally conductive mechanically compliant laminate comprises upper and lower laminae on opposed surfaces of a central stabilizing apertured grid and with portions of said laminae extending through apertures in said mesh grid to form a continuum, said stabilized thermally conductive laminate being characterized in that:
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(a) said upper and lower laminae comprise a mixture of; (1) a polymer matrix; (2) a quantity of low melting indium or gallium containing alloy having a melt point at about 120°
C. disbursed within said polymer matrix;(3) a thermally conductive particulate solid disbursed within said polymer matrix; (b) said stabilizing open mesh grid comprising a grid body with an array of generally reticulated apertures formed therein, and with the structure and said grid forming between about 10% and 90% of the area of said mesh grid, balance apertures; (c) each of said reticulated apertures having a cross-sectional dimension greater than about 0.5 mil; (d) said polymer matrix selected from the group consisting of hot melt waxes of paraffin and silicone, elastomers of acrylic, silicone, urethane, and flexible epoxy'"'"'s, and rigid resins consisting of silicone, urethane, epoxy and phenolic polymers with each polymer matrix having a melting point ranging from between about 40°
C. and 120°
C. - View Dependent Claims (2, 3, 4, 5)
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6. A method of preparing thermally conductive mechanically compliant multi-layer pads comprising the steps of:
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(a) preparing a mixture of; (1) a low melting metal selected from the group consisting of gallium and indium alloys, and being in the liquid state at temperatures below 120°
C.; and(2) a thermally conductive particulate solid selected from the group consisting of boron nitride, aluminum nitride, and alumina; (b) mechanically blending said mixture to cause the surfaces of said particulate to become wetted with said liquid alloy to form a homogeneous thermally conductive paste wherein said liquid alloy encapsulates individual of said particles comprising said particulate; (c) combining said thermally conductive paste with a quantity of a flowable plastic resin material selected from the group consisting of a silicone wax having a siloxane backbone with pendent alkyl chains, and soft silicone polymers consisting of a reactive elastomer to form a thermally conductive mass, with said thermally conductive mass comprising from between about 10% and 90% by volume of metal coated particulate, balance flowable plastic resin blend; (d) applying said thermally conductive mass to opposed surfaces of a mesh grid having an array of reticulated apertures to form a multi-layer preform grid of between about 10% and 90% open; and (e) subjecting said preform to pressure sufficient to cause said oppositely disposed coatings to pass through said reticulated apertures to merge and form a continuum.
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Specification