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Nitride semiconductor light emitting element and production thereof

  • US 6,984,841 B2
  • Filed: 01/30/2002
  • Issued: 01/10/2006
  • Est. Priority Date: 02/15/2001
  • Status: Expired due to Term
First Claim
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1. A nitride semiconductor light emitting device, comprising:

  • a processed substrate (101a) including at least a groove (G) and at least a hill (H) formed on a surface of a nitride semiconductor;

    a nitride semiconductor underlayer (102) grown to cover said groove and said hill of said processed substrate; and

    a light emitting device structure having a light emitting layer (106) including a quantum well layer or a quantum well layer and a barrier layer in contact with the quantum well layer between an n type layer (103

    105) and a p type layer (107

    110) over said nitride semiconductor underlayer,wherein there exists at least a depression (D) not flatten above at least one of said groove and said hill even after growth of said nitride semiconductor underlayer of said light emitting device structure,and wherein in the case that a first depression is formed above said hill and no depression is formed above said groove, a light emitting portion of said light emitting device structure is formed above a region within the width of said groove and more than 1 μ

    m away from the width center of said groove in the width direction or within the width of said hill and more than 2 μ

    m away from a side edge of said first depression in the width direction;

    orin the case that a second depression is formed above said groove and no depression is formed above said hill, the light emitting portion of sold light emitting device structure is formed above a region within the width of said hill and more than 1 μ

    m away from the center of said hill in the width direction or within the width of said groove and more than 2 μ

    m away from a side edge of said second depression in the width direction;

    orin the case that the first depression is formed above said hill and the second depression is formed above said groove in said nitride semiconductor underlayer, the light emitting portion of said light emitting device structure is formed above a region within the width of said hill and more than 2 μ

    m away from a side edge of said first and second depressions in the width direction or within the width of said groove and more than 2 μ

    m away from a side edge of said first and second depressions in the width direction.

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